METHOD FOR FORMING MEMS VARIABLE CAPACITORS
    31.
    发明公开
    METHOD FOR FORMING MEMS VARIABLE CAPACITORS 审中-公开
    用于生产MEMS可变电容器

    公开(公告)号:EP2452349A1

    公开(公告)日:2012-05-16

    申请号:EP10727435.9

    申请日:2010-07-01

    IPC分类号: H01G5/14 B81B3/00

    CPC分类号: H01G5/011 H01G5/18

    摘要: A method for fabricating an out-of-plane variable overlap MEMS capacitor comprises: providing a substrate (40) comprising a first layer (41), a second layer (42), and a third layer (43) stacked on top of one another; and etching a plurality of first trenches (70) through the third layer (43), through the second layer (42), and into the first layer (41) using a single etching mask. Etching the plurality of first trenches (70) defines a plurality of first fingers (51) in the third layer (43) and a plurality of second fingers (52) in the first layer (41). By using a single mask, the process is self-aligned. The method further comprises removing the second layer (42) in a first region where the plurality of first trenches (70) are provided, thereby forming a spacing or gap between the plurality of first fingers (51) and the plurality of second fingers (52).