公开(公告)号：EP2806162A1

公开(公告)日：2014-11-26

申请号：EP12863447.4

申请日：2012-12-25

申请人： Ebara Corporation

发明人： KARAKI, Ryotaro ,  MIYAUCHI, Sachiko ,  KONISHI, Yasutaka ,  KANEDA, Kazuhiro ,  TEJIMA, Tomoharu ,  HIGAKI, Nobuhiro

IPC分类号： F04B49/06

CPC分类号： G05D7/0676 ,  F04B49/065

摘要： A water supply apparatus is provided to meet demands for energy saving by controlling the rotational speed of a pump (1), for example, so as to lower the rotational speed in the time zone when water is not used much while avoiding the time zone when water is used in large quantities. The water supply apparatus includes the pump (1) configured to pressurize and deliver water, a frequency converter configured to supply electric power to the pump (1) to operate the pump (1) at a variable speed, and a controller (15) configured to send operating signals to the frequency converter so as to operate the pump (1) either at a first operation or at a second operation with less power consumption than the first operation. The controller (15) is configured to judge whether the operation of the pump (1) should be shifted from the first operation to the second operation based on an operational state of the pump (1).

公开(公告)号：EP2762274A2

公开(公告)日：2014-08-06

申请号：EP14020010.6

申请日：2014-01-29

申请人： EBARA CORPORATION

发明人： Ishii, Yu ,  Ito, Kenya ,  Nakanishi, Masayuki ,  Togawa, Tetsuji

IPC分类号： B24B37/04 ,  B24B37/30 ,  B24B7/22 ,  B24B21/00

CPC分类号： B24B7/228 ,  B24B21/004 ,  B24B21/06 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30

摘要： A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

摘要翻译： 提供了能够以高去除速度从基板的整个背面除去异物的研磨方法。 抛光方法包括：在保持基板的背面的中心侧区域的同时，将抛光工具与基板的背面的外周区域滑动接触，并且将抛光工具与中心部分滑动接触， 同时保持基板的斜面部分以整体地抛光背面。

公开(公告)号：EP2428315A3

公开(公告)日：2014-06-11

申请号：EP11007355.8

申请日：2011-09-09

申请人： EBARA CORPORATION

发明人： Watanabe, Katsuhide ,  Ihara, Masakazu

IPC分类号： B24B7/22 ,  B24B49/18 ,  B24B49/16 ,  B24B37/005 ,  B24B37/10

CPC分类号： B24B37/005 ,  B24B37/107 ,  B24B49/16 ,  B24B49/18

摘要： A polishing apparatus includes: a table rotating motor configured to rotate the polishing table about its own axis; a top ring rotating motor configured to rotate the top ring about its own axis; a dresser configured to dress the polishing pad; a pad-height measuring device configured to measure a height of the polishing pad; and a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.

公开(公告)号：EP2055960B1

公开(公告)日：2014-04-30

申请号：EP08018884.0

申请日：2008-10-29

申请人： EBARA CORPORATION

发明人： Kawasaki, Hiroyuki ,  Miyamoto, Matsutaro

IPC分类号： F04D19/04 ,  F04D25/06 ,  H02K17/16 ,  H02K7/09

CPC分类号： F04D19/042 ,  F04D25/06 ,  H02K7/09 ,  H02K17/165

公开(公告)号：EP1113093B1

公开(公告)日：2014-04-23

申请号：EP99919638.9

申请日：1999-05-18

申请人： EBARA CORPORATION

发明人： YOSHIOKA, Junichiro ,  MUKAIYAMA, Yoshitaka

IPC分类号： C25D17/06

CPC分类号： H01L21/68721 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68785

公开(公告)号：EP2690652A3

公开(公告)日：2014-04-16

申请号：EP13005022.2

申请日：2005-10-31

申请人： EBARA CORPORATION

发明人： Nabeya, Osamu ,  Togawa, Tetsuji ,  Fukushima, Makoto ,  Yasuda, Hozumi

IPC分类号： H01L21/304 ,  B24B37/04 ,  B24B47/22 ,  B24B49/16

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.

摘要翻译： 研磨装置（1）具有研磨垫（22），用于保持半导体晶片（W）的顶环（20），能够使顶环（20）沿上下方向移动的上下移动机构（24） 当顶环（20）的下表面与抛光垫（22）接触时可操作以检测顶环（20）的位置的距离测量传感器（46），以及控制器（47） 基于由距离测量传感器（46）检测到的位置来计算顶环（20）的最佳位置以抛光半导体晶片（W）。 垂直移动机构24包括滚珠丝杠机构30,32,38,42，该滚珠丝杠机构可操作以将顶环20移动到最佳位置。

公开(公告)号：EP2700819A1

公开(公告)日：2014-02-26

申请号：EP13020045.4

申请日：2013-06-27

申请人： Ebara Corporation

发明人： Ojima, Yoshinori ,  Hozumi, Takashi ,  Yoshida, Naoya ,  Inada, Takanori ,  Nakazawa, Toshiharu

IPC分类号： F04C29/00 ,  H02K15/16

CPC分类号： F04B17/00 ,  F04C29/0085 ,  F04C2220/10 ,  F04C2230/605 ,  F04C2240/40 ,  F04C2270/12 ,  F04C2280/04 ,  H02K7/04 ,  H02K7/14

摘要： In order to provide a vacuum pump motor which is free from rotation imbalance, there is provided a vacuum pump motor 10 which is connected directly to a pump main shaft 21 of a vacuum pump 20, including a motor rotor 120 which is attached directly or indirectly to the pump main shaft 21 and balance rings 127 which are attached directly or indirectly to the pump main shaft 21 at ends thereof which are spaced apart from end portions of a rotor core 123, wherein the balance rings 127 contain a material having anticorrosion properties.

摘要翻译： 为了提供一种没有旋转不平衡的真空泵马达，提供了一个真空泵马达10，其直接连接到真空泵20的泵主轴21，该泵主轴21包括直接或间接附接的马达转子120 连接到泵主轴21和平衡环127，其平行环127直接或间接地连接到泵主轴21的端部，其与转子芯123的端部间隔开，其中平衡环127包含具有防腐性能的材料。

公开(公告)号：EP2378122A3

公开(公告)日：2014-02-19

申请号：EP11003266.1

申请日：2011-04-18

申请人： Ebara Corporation

发明人： Ito, Kazuma ,  Oyama, Atsushi ,  Usui, Katsuaki

IPC分类号： F04C25/02 ,  F04C29/04 ,  F04C28/08 ,  F01C21/00

CPC分类号： F04C25/02 ,  F01C21/007 ,  F04C28/08 ,  F04C29/045 ,  F04C29/047 ,  F04C2220/12 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/403 ,  F04C2240/808

摘要： A dry vacuum pump apparatus is small in size as it includes a highly efficient cooling unit for cooling, with a coolant such as cooling water, large-current circuit components of high self-heating value, typically switching devices of an inverter. The dry vacuum pump apparatus includes a dry vacuum pump including a pump unit and a motor for actuating the pump unit, an inverter for converting AC power from an AC power supply into AC power having a predetermined frequency and supplying the AC power to the motor, an electric equipment enclosure accommodating therein a control electronic circuit assembly including the inverter, a pump enclosure accommodating therein the dry vacuum pump and an operation monitoring sensor of the dry vacuum pump, a liquid-cooled partition interposed between the electric equipment enclosure and the pump enclosure, and having a coolant circulating therein, and an external enclosure housing therein the electric equipment enclosure, the pump enclosure, and the liquid-cooled partition as an integral structure.

公开(公告)号：EP2667033A1

公开(公告)日：2013-11-27

申请号：EP12736816.5

申请日：2012-01-20

申请人： Ebara Corporation

发明人： KOMATSU, Takahide ,  KARAKI, Ryotaro

IPC分类号： F04D15/00

CPC分类号： F04D15/0066 ,  F04D15/0088 ,  F05D2270/3013

摘要： A water supply apparatus is configured to meet energy-saving demands by controlling a pump so that the rotational speed of the pump is lowered while keeping a constant flow rate. The water supply apparatus includes a pump for pressurizing and delivering water, a frequency converter for supplying electric power to the pump to operate the pump at a variable rotational speed, a discharge-side pressure sensor for detecting a pressure at a discharge side of the pump, and a controller (15) for controlling the rotational speed of the pump. The controller (15) stores a plurality of control head curves (B, C 1 , C 2 , C 3 ) representing different relationships between flow rates (Q) and heads (H), and controls the rotational speed of the pump based on an alternatively selected one of the control head curves (B, C 1 , C 2 , C 3 ).

摘要翻译： 供水装置通过控制泵来满足节能要求，从而使泵的转速降低同时保持恒定的流量。 供水装置包括用于加压和输送水的泵，用于向泵供应电力以便以可变转速操作泵的变频器，用于检测泵的排出侧的压力的排出侧压力传感器 ，以及用于控制泵的转速的控制器（15）。 控制器（15）存储表示流量（Q）和喷头（H）之间的不同关系的多个控制头曲线（B，C 1，C 2，C 3），并且基于 选择控制头曲线（B，C 1，C 2，C 3）中的一个。

公开(公告)号：EP1933088A3

公开(公告)日：2013-07-17

申请号：EP07023594.0

申请日：2007-12-05

申请人： EBARA CORPORATION

发明人： Kawamura, Kotaro ,  Arai, Hiroyuki ,  Muroga, Yasutaka

IPC分类号： F23G5/24 ,  F23G7/06 ,  F23M5/00

CPC分类号： F23G7/065 ,  F23G5/24 ,  F23G2209/142 ,  F23M5/00

摘要： A combustion-type exhaust gas treatment apparatus is used to treat a harmful exhaust gas by combustion to render the gas harmless. The present invention provides such a combustion-type exhaust gas treatment apparatus. This treatment apparatus includes a combustion treatment section, a cooling section, and a washing section. The combustion treatment section includes an exhaust-gas treatment combustor, a body made from metal and having a roughened inner surface, and a water-film formation mechanism adapted to form a water film on the inner surface of the body. The combustion treatment of the exhaust gas is performed in the body.