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    METHOD FOR MANUFACTURING PACKAGE LID MEMBER AND METHOD FOR MANUFACTURING PACKAGE
    53.
    发明公开
    METHOD FOR MANUFACTURING PACKAGE LID MEMBER AND METHOD FOR MANUFACTURING PACKAGE 审中-公开

    公开(公告)号：EP3876271A1

    公开(公告)日：2021-09-08

    申请号：EP19877833.4

    申请日：2019-10-24

    申请人： Mitsubishi Materials Corporation

    发明人： DAIDO, Satoru ,  UNO, Hironori

    IPC分类号： H01L23/02 ,  H01L33/48

    摘要： A method for manufacturing a package lid member includes a metalizing step of forming a metalized layer (4) on a surface of a glass member (30), a paste applying step of applying an Au-Sn paste on the metalized layer (4) in a frame shape, a reflow step of heating the glass member (30) to which the Au-Sn paste was applied after the paste applying step and reflowing the Au-Sn paste, and a cooling step of cooling the glass member (30) after the reflow step to form an Au-Sn layer (5). The cooling step includes a holding step of holding the glass member (30) in a temperature range of 150°C or higher and 190°C or lower for 2 minutes or longer.

    LIGHT EMITTING DEVICE
    55.
    发明公开
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：EP3872874A1

    公开(公告)日：2021-09-01

    申请号：EP21160139.8

    申请日：2018-12-21

    申请人： NICHIA CORPORATION

    发明人： NAKABAYASHI, Takuya ,  TAMURA, Gensui

    IPC分类号： H01L33/48 ,  H01L33/64 ,  H01L33/62

    摘要： A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.

    LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, ARRAY SUBSTRATE, AND LIGHT-EMITTING DEVICE
    59.
    发明公开
    LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, ARRAY SUBSTRATE, AND LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：EP3859912A1

    公开(公告)日：2021-08-04

    申请号：EP19865083.0

    申请日：2019-09-18

    申请人： Kyocera Corporation

    发明人： HIGASHI, Toshifumi ,  FURUKUBO, Youji ,  YAMAMOTO, Sentarou

    IPC分类号： H01S5/022 ,  H01L23/12 ,  H01L33/48

    摘要： A substrate for mounting a light-emitting element (1) includes a base (10) and a dam part (20). The base (10) has a front surface (11) and a back surface (12) that are principal surfaces thereof where the front surface (11) has a mounting part (11a) that is capable of mounting a light-emitting element (30) thereon. The dam part (20) is arranged on a peripheral part (11b) of the front surface (11) to surround the mounting part (11a). The front surface (11) is inclined relative to the back surface (12) at a predetermined angle (θ0). The dam part (20) is provided with an opening part (25) at a site where the front surface (11) is inclined to decrease a thickness of the base (10), in the peripheral part (11b) of the front surface (11). A site of the dam part (20) where the opening part (25) is provided is inclined relative to the back surface (12) in a direction that is identical to that of the front surface (11).