公开(公告)号：EP4316154A1

公开(公告)日：2024-02-07

申请号：EP22710936.0

申请日：2022-02-25

Applicant: QUALCOMM INCORPORATED

Inventor： KWAK, Yongjun ,  LY, Hung Dinh ,  LEI, Jing ,  KIM, Yuchul ,  KWON, Hwan Joon

IPC: H04W74/08 ,  H04B1/713 ,  H04W48/12

公开(公告)号：EP4302502A1

公开(公告)日：2024-01-10

申请号：EP22701859.5

申请日：2022-01-10

Applicant: QUALCOMM INCORPORATED

Inventor： DUAN, Weimin ,  LEI, Jing ,  MANOLAKOS, Alexandros

IPC: H04W8/24 ,  G01S5/02 ,  H04W64/00

公开(公告)号：EP4292321A1

公开(公告)日：2023-12-20

申请号：EP22710923.8

申请日：2022-02-11

Applicant: QUALCOMM INCORPORATED

Inventor： LEI, Jing ,  TAKEDA, Kazuki ,  XU, Huilin ,  GAAL, Peter

IPC: H04W16/14 ,  H04W72/12 ,  H04L5/00 ,  H04W24/02

公开(公告)号：EP4287751A2

公开(公告)日：2023-12-06

申请号：EP23204299.4

申请日：2020-01-16

Applicant: QUALCOMM Incorporated

Inventor： LEI, Jing ,  LY, Hung Dinh ,  HUANG, Yi ,  GAAL, Peter ,  SORIAGA, Joseph Binamira ,  AMINZADEH GOHARI, Amir ,  CHEN, Wanshi ,  HE, Linhai ,  JI, Tingfang

IPC: H04W74/00

Abstract: A user equipment (UE) may be configured to receive configuration information from a base station, and the configuration information may indicate at least two different random access channel (RACH) request configuration parameters that each is associated with a respective radio resource control (RRC) state. The UE may be further configured to generate a first message associated with a two-step RACH procedure including a preamble and a payload, the payload including data on an uplink data channel and at least one reference signal. The UE may be further configured to transmit the first message to the base station using at least one of the at least two different RACH request configuration parameters that corresponds to an RRC state of the UE. The preamble may be transmitted on a first set of resources associated with a RACH occasion, and the payload may be transmitted on a second set of resources.

公开(公告)号：EP4278710A1

公开(公告)日：2023-11-22

申请号：EP21847902.0

申请日：2021-12-30

Applicant: QUALCOMM INCORPORATED

Inventor： KIM, Yuchul ,  KWON, Hwan Joon ,  ANG, Peter Pui Lok ,  SUNDARARAJAN, Jay Kumar ,  MUKKAVILLI, Krishna Kiran ,  TOKGOZ, Yeliz ,  XU, Huilin ,  LEI, Jing ,  KWAK, Yongjun ,  CHEN, Wanshi

IPC: H04W52/02

公开(公告)号：EP4275439A1

公开(公告)日：2023-11-15

申请号：EP21848472.3

申请日：2021-12-30

Applicant: QUALCOMM INCORPORATED

Inventor： LEI, Jing ,  KIM, Yuchul ,  KWON, Hwan Joon

IPC: H04W72/12

公开(公告)号：EP4229957A1

公开(公告)日：2023-08-23

申请号：EP20957219.7

申请日：2020-10-16

Applicant: Qualcomm Incorporated

Inventor： XU, Huilin ,  GAAL, Peter ,  CHEN, Wanshi ,  HAO, Chenxi ,  ZHU, Xipeng ,  KIM, Yuchul ,  MUKKAVILLI, Krishna Kiran ,  OZTURK, Ozcan ,  LEI, Jing ,  KWON, Hwan Joon ,  JI, Tingfang

IPC: H04W72/04

公开(公告)号：EP4223033A1

公开(公告)日：2023-08-09

申请号：EP21806856.7

申请日：2021-09-30

Applicant: QUALCOMM INCORPORATED

Inventor： KWAK, Yongjun ,  HOSSEINI, Seyedkianoush ,  LEI, Jing ,  LY, Hung Dinh ,  KIM, Yuchul ,  KWON, Hwan Joon

IPC: H04W72/02 ,  H04W72/04 ,  H04W88/04 ,  H04W92/18

公开(公告)号：EP4215010A1

公开(公告)日：2023-07-26

申请号：EP21790693.2

申请日：2021-09-15

Applicant: QUALCOMM INCORPORATED

Inventor： KIM, Yuchul ,  ANG, Peter Pui Lok ,  HE, Linhai ,  KWON, Hwan Joon ,  MUKKAVILLI, Krishna Kiran ,  TOKGOZ, Yeliz ,  SUNDARARAJAN, Jay Kumar ,  XU, Huilin ,  LEI, Jing

IPC: H04W72/14

公开(公告)号：EP4215009A1

公开(公告)日：2023-07-26

申请号：EP21789961.6

申请日：2021-09-15

Applicant: QUALCOMM INCORPORATED

Inventor： KIM, Yuchul ,  ANG, Peter Pui Lok ,  KWON, Hwan Joon ,  MUKKAVILLI, Krishna Kiran ,  SUNDARARAJAN, Jay Kumar ,  TOKGOZ, Yeliz ,  HE, Linhai ,  XU, Huilin ,  LEI, Jing

IPC: H04W72/14