公开(公告)号：EP3278944B1

公开(公告)日：2020-02-12

申请号：EP15887786.0

申请日：2015-12-18

Applicant: Nichiban Co. Ltd.

Inventor： ICHIMURA, Syuji ,  ENDOU, Mikihiro ,  SUGIYAMA, Yusuke

IPC: B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29B13/06 ,  B29C48/00 ,  C09J201/00 ,  C09J7/30 ,  B29C48/04 ,  B29C48/05 ,  C08K7/00

公开(公告)号：EP3006535B1

公开(公告)日：2020-02-05

申请号：EP14805049.5

申请日：2014-05-27

Applicant: Idemitsu Kosan Co., Ltd

Inventor： HASHIMA, Kazuhiro ,  TAKEBE, Tomoaki ,  MINAMI, Yutaka ,  INOUE, Masao ,  KOBAYASHI, Kenji

IPC: C09J201/00 ,  C08F110/06 ,  C08L23/12 ,  C09J5/06 ,  C09J123/12 ,  A61L15/24 ,  A61L15/58 ,  C08F4/659 ,  C09J5/00

公开(公告)号：EP3231849B1

公开(公告)日：2020-01-15

申请号：EP15898878.2

申请日：2015-07-17

Applicant: Lintec Corporation

Inventor： TODAKA, Masaya ,  KATAGIRI, Baku ,  TOMIOKA, Kenta ,  ORUI, Tomoo

IPC: C09J201/00 ,  G06F3/041 ,  C09J7/38 ,  C09J7/00

公开(公告)号：EP3589093A1

公开(公告)日：2020-01-01

申请号：EP18756912.4

申请日：2018-02-20

Applicant: Namics Corporation

Inventor： YOSHIDA, Masaki ,  OHASHI, Satoko

IPC: H05K3/46 ,  B32B15/082 ,  C09J7/20 ,  C09J11/04 ,  C09J11/06 ,  C09J201/00 ,  H01L23/12

Abstract: A purpose of the present disclosure is to provide a multilayer wiring substrate capable of reducing transmission loss of electrical signals when using a fluororesin substrate, by using an adhesive layer capable of suppressing misalignment between layers and having excellent peel strength. Provided is a multilayer wiring substrate 1 including: a fluororesin substrate 30 having a conductor pattern 20 formed on at least one surface thereof; and an adhesive layer 10 for bonding the fluororesin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less.

公开(公告)号：EP3180197B1

公开(公告)日：2019-11-27

申请号：EP15833899.6

申请日：2015-08-17

Applicant: Foammatick, LLC

Inventor： STUMPHAUZER, William, C.

IPC: B29C44/34 ,  B41M5/00 ,  B05B7/00 ,  B05B7/16 ,  B29B13/02 ,  B29B13/04 ,  C08J9/10 ,  C09J9/00 ,  C09J11/06 ,  C09J201/00 ,  G05D23/19 ,  B29K105/04

公开(公告)号：EP2518031B1

公开(公告)日：2019-11-20

申请号：EP10839543.5

申请日：2010-12-24

Applicant: Sekisui Chemical Co., Ltd.

Inventor： IWAMOTO, Tatsuya ,  KANI, Kohei

IPC: C03C27/12 ,  C08L29/14 ,  C08L101/00 ,  C09J11/00 ,  C09J129/14 ,  C09J201/00

公开(公告)号：EP2765169B1

公开(公告)日：2019-11-06

申请号：EP12838280.1

申请日：2012-09-20

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： NORIMATSU, Takahiro

IPC: C09J7/38 ,  B41J3/36 ,  C09J201/00

公开(公告)号：EP3561010A1

公开(公告)日：2019-10-30

申请号：EP17882574.1

申请日：2017-12-05

Applicant: Furukawa Electric Co., Ltd.

Inventor： FUJIWARA, Hidemichi ,  NITTA, Norzafriza

IPC: C09J7/20 ,  B32B5/28 ,  B32B7/02 ,  B32B27/00 ,  C09J1/00 ,  C09J7/21 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J201/00 ,  H01L21/301 ,  H01L21/52

Abstract: The invention provides a joining film that can enhance the mechanical strength and thermal cycle characteristics in a semiconductor device produced by joining a semiconductor element and a substrate, and a tape for wafer processing.
Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a having a reinforcing layer formed from a porous body or a reticulate body, the pores or meshes of the porous body or the reticulate body being filled with an electroconductive paste containing metal fine particles (P).

公开(公告)号：EP3521393A1

公开(公告)日：2019-08-07

申请号：EP17855830.0

申请日：2017-09-19

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： SUITO Yoshikatsu ,  YOSHIMURA Chisato

IPC: C09J7/20 ,  C09J11/00 ,  B41J3/36 ,  C09J201/00 ,  B41J17/32

Abstract: OBJECT
To sufficiently produce respective effects of multiple pigments while suppressing increases in overall thickness of a tape and the number of manufacturing steps.
SOLVING MEANS
An adhesive tape roll 14 including a double-sided adhesive tape 150 wound in a housing 11A is included, and the double-sided adhesive tape 150 includes a film layer 151, a colored layer 190 disposed on one side in a thickness direction of the film layer 151 that has a pigment added thereto, and an adhesive layer 161 disposed on the one side in the thickness direction of the colored layer 190 that includes an adhesive to which a pigment is added.

公开(公告)号：EP3505581A1

公开(公告)日：2019-07-03

申请号：EP17846189.3

申请日：2017-08-21

Applicant: Zeon Corporation

Inventor： KURIHARA Ryuta ,  KOHARA Teiji

IPC: C09J7/00 ,  C08F8/04 ,  C08F8/42 ,  C09J153/02 ,  C09J201/00

Abstract: Disclosed is a method for manufacturing a double side embossed adhesive sheet which comprises a thermoplastic resin as a main component, the method including: contacting one side of a melt which comprises a thermoplastic resin as a main component, extruded from a die, with a surface of a cast roll having an embossed shape on the surface while nipping the melt from an opposite side with a nip roll having an embossed shape on a surface thereof, wherein one of the cast roll and the nip roll is made of metal and the other is made of rubber.