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1.发明公开公开(公告)号：EP2755232A4
公开(公告)日：2015-09-30
申请号：EP12829319
申请日：2012-09-07
Applicant: HENKEL AG & CO KGAA
Inventor： HORIGUCHI YUSUKE , SANO MIEKO , SATO KENICHIRO
CPC classification number: C09J135/02 , C08F222/40 , C08F2222/402 , C09J11/06 , C09J133/24 , H01L21/563 , H01L23/293 , H01L23/3142 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/00012
Abstract: The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
Abstract translation: 本发明提供一种用于电子设备的密封剂组合物，其中固化在加热时不进行，这在电子设备的安装过程中不会引起使用。 本发明涉及电子器件用密封剂组合物，其包含（a）具有两个以上（甲基）丙烯酰基的化合物和（c）氮氧化合物和/或硫代羰基硫代化合物。
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公开(公告)号：EP2755233A4
公开(公告)日：2015-06-03
申请号：EP12830373
申请日：2012-09-07
Applicant: HENKEL AG & CO KGAA
Inventor： HORIGUCHI YUSUKE , SANO MIEKO , SATO KENICHIRO
IPC: H01L21/60 , C08F220/10 , C08F220/26 , C08F222/40 , C08F226/06 , C09D4/06 , C09D135/00 , H01L23/29 , H01L23/31
CPC classification number: C09J133/14 , C09D4/06 , C09D135/00 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/00012 , C08F220/32 , C08F2222/1013 , C08F2222/1026 , C08F222/40
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公开(公告)号：EP2755234A4
公开(公告)日：2015-05-27
申请号：EP12830834
申请日：2012-09-07
Applicant: HENKEL AG & CO KGAA
Inventor： HORIGUCHI YUSUKE , SANO MIEKO , SATO KENICHIRO
IPC: H01L21/60 , C08K7/16 , C08K9/04 , C08L25/18 , C08L33/04 , C09D4/00 , C09D133/14 , H01L23/29 , H01L23/31
CPC classification number: H01L23/293 , C08K5/3415 , C08K9/04 , C08L2205/22 , C08L2312/00 , C09D4/00 , C09D133/14 , H01L21/563 , H01L23/295 , H01L24/29 , H01L2224/2929 , H01L2924/01029
Abstract: The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.
