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公开(公告)号：EP0956746A1
公开(公告)日：1999-11-17
申请号：EP97909792.0
申请日：1997-10-10
Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ)
Inventor： BERGSTEDT, Leif, Roland
CPC classification number: H01L23/3735 , H01L23/367 , H01L2224/05554 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H05K1/0271 , H05K1/056 , H05K3/0061 , H05K2201/068 , H05K2201/10416 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
Abstract: The present invention relates to a method and means for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated mean is totally or partly recessed in a carrier in the printed board. The chip is placed over the temperature-compensated mean. The temperature-compensated mean includes a piece of metal recessed in the carrier under the chip. A layer of copper is fixed against the upper side of the carrier and the upper side of the metal piece. The thickness of the copper layer and the thickness of the metal piece are dimensioned so that the resulting coefficient of linear expansion at the upper side of the copper layer is equally big as or a bit bigger than the coefficient of linear expansion of the chip. The temperature-compensated mean can as an alternative to the above include a module recessed in the carrier under the chip. A thin layer of dielectric is fixed against the carrier, so that the coefficient of linear expansion of the dielectric layer do not appreciably affect the resulting coefficient of linear expansion of the temperature-compensated mean.
Abstract translation: 本发明涉及一种用于制造印刷电路板上芯片的温度补偿垫层的方法和装置，其中温度补偿装置在印刷电路板中完全或部分地凹进载体中。 芯片放置在温度补偿的平均值上。 温度补偿装置包括在芯片下面的载体中嵌入的一块金属。 一层铜固定在载体的上侧和金属片的上侧。 确定铜层的厚度和金属片的厚度，使得在铜层上侧的最终线性膨胀系数与芯片的线性膨胀系数相同或稍大。 作为上述替代的温度补偿装置可以包括在芯片下面的载体中凹进的模块。 薄层电介质固定在载体上，使得电介质层的线性膨胀系数不明显地影响温度补偿平均值的所得线性膨胀系数。
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公开(公告)号：EP0997060A1
公开(公告)日：2000-05-03
申请号：EP98933992.4
申请日：1998-06-26
Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ)
Inventor： BERGSTEDT, Leif, Roland , CARLBERG, Bo
CPC classification number: H05K3/222 , H05K1/024 , H05K3/3442 , H05K2201/09036 , H05K2201/09781 , H05K2201/10363 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49169
Abstract: The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area (10) of the printed board (11). A separate component (1) for signal transmission comprises a conductor (5). The component (1) is mounted, with the conductor facing the printed board (11), over the area (10) of the printed board, which requires good transmissions qualities, whereby an air gap (L) is obtained between the conductor (5) and the printed board (11). Soldering joints (21) connect each one of the outer parts (7a, 7b) of the conductor (5) of the component (1) to corresponding pattern conductors (17a, 17b) on the printed board (11). The thickness of the soldering connections and the thickness of the pattern conductors form the air gap (L) between the conductor (5) and the printed board (11). In an alternative embodiment according to the invention, a groove (23) is milled out of the printed board (11) under the conductor (5), obtaining an enlarged air gap between the conductor (5) and the printed board (11).
