Abstract:
High resolution printing systems that utilize high power laser diode bars and digital mirror devices (DMD) require side-by-side stacking of illumination modules to stitching of the image from each module to form a longer total image width. An inline illumination optical system having a refractive prism and Total Internal Reflection (TIR) prism pair with an air gap along with a light guide transporting light beams at a compound angle to the prism pair eliminates the need for any axial rotation of the laser and light guide, and enables side-by-side module stacking. The illumination optical system includes an illumination module having a light source, the light guide, a DMD array and a Refractive TIR (RTIR) prism. The system also includes a DMD housing containing the DMD array and having a width within which the illumination module is confined to allow side-by-side stacking.
Abstract:
A light scanning device (4) includes a deflection unit (41), a first imaging lens (42a), and a second imaging lens (42b). The plurality of the adhesion portions (51) interposed between the first imaging lens (42a) and the housing (44) are symmetrically located with respect to a center position of the first imaging lens (42a) in a main-scanning direction. The adhesion portions (52) interposed between the first imaging lens (42a) and the second imaging lens (42b) are symmetrically located with respect to the center position of the first imaging lens (42a) in the main-scanning direction, and are located in the main-scanning direction outside with respect to the adhesion portions (51) between the first imaging lens (42a) and the housing (44).
Abstract:
A light scanning device (4) includes a deflection unit (41), a first imaging lens (42a), and a second imaging lens (42b). The plurality of the adhesion portions (51) interposed between the first imaging lens (42a) and the housing (44) are symmetrically located with respect to a center position of the first imaging lens (42a) in a main-scanning direction. The adhesion portions (52) interposed between the first imaging lens (42a) and the second imaging lens (42b) are symmetrically located with respect to the center position of the first imaging lens (42a) in the main-scanning direction, and are located in the main-scanning direction outside with respect to the adhesion portions (51) between the first imaging lens (42a) and the housing (44).
Abstract:
An optical scanning device (6) includes a light source (611-614), a scanning member (62), a converging lens (77), a first aperture (82), a second aperture (91), and a support member (93). The first aperture (82) is provided between the converging lens (77) and the scanning member (62) and includes a first opening portion (83) configured to restrict a beam path width in a main scanning direction of the laser beams emitted from the light source (611-614). The second aperture (91) is provided between the light source (611-614) and the converging lens (77) and includes a second opening portion (911) and a cylindrical portion (913). The second opening portion (911) is configured to restrict a beam path width in a sub scanning direction of the laser beams emitted from the light source (611-614), and is formed in the cylindrical portion (913). The support member (93) includes a cylinder supporting portion (931) that pivotably supports the cylindrical portion (913) of the second aperture (91).
Abstract:
A semiconductor distributed Bragg reflector (DBR) (110) including a first multilayer structure (103) including a plurality of first semiconductor layers and one or more second semiconductor layers each interposed between a corresponding pair of the plurality of first semiconductor layers; a second multilayer structure (104) including a plurality of third semiconductor layers and one or more second semiconductor layers each interposed between a corresponding pair of the plurality of third semiconductor layers; and a protection layer (105) interposed between the first multilayer structure and the second multilayer structure. The semiconductor layer has a lower decomposition temperature than the first semiconductor layer. The third semiconductor layer has a lower decomposition temperature than the second semiconductor layer.
Abstract:
In an optical sensor, a light emission system emits an irradiated light of a linear polarization in a first polarization direction toward a surface of a target object having a sheet shape from an incident direction which is inclined with respect to a normal direction of the surface. A first light detection system includes a first light detector arranged on a first light path of a specular reflected light, which is emitted from the light emission system and is specularly reflected from the target object. A second light detection system includes a second light detector arranged on a second light path of a diffuse reflected light which is diffusely reflected from an incident plane on the target object. The second light detector receives second light passed by an optical element which passes a linear polarization component of a second polarization direction perpendicular to the first polarization direction.