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公开(公告)号：EP3045508A1
公开(公告)日：2016-07-20
申请号：EP14844800.4
申请日：2014-09-09
Applicant: Dexerials Corporation
Inventor： AOKI Masaharu , KANISAWA Shiyuki , NAMIKI Hidetsugu , KOYAMA Taichi , ISHIGAMI Akira
IPC: C09J163/00 , C09J7/00 , C09J11/04 , C09J133/00 , H01B1/20 , H01R11/01
CPC classification number: C09J133/20 , C08F220/18 , C08L33/066 , C08L33/068 , C08L2205/22 , C09J9/02 , C09J133/066 , C09J163/00 , H01B1/22 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/62 , H01L2224/16227 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/32225 , H01L2224/81424 , H01L2224/81487 , H01L2224/81903 , H01L2224/83424 , H01L2224/83487 , H01L2224/83851 , H01L2224/83862 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2933/0066 , H01L2924/00 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/01006 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , C08F2220/1825 , C08F2220/1808 , C08F220/44 , C08F220/06 , C08F220/20 , C08K5/151
Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.
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公开(公告)号：EP1107305A3
公开(公告)日：2004-06-23
申请号：EP00127089.1
申请日：2000-12-11
Applicant: EBARA CORPORATION
Inventor： Fukunaga, Akira, , Nagasawa, Hiroshi,
IPC: H01L21/60
CPC classification number: H05K3/3436 , H01L24/11 , H01L24/13 , H01L24/742 , H01L24/75 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/11505 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/81191 , H01L2224/81192 , H01L2224/83815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/095 , H05K2201/0257 , H05K2201/10674 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178
Abstract: A method and a structure is provided for mounting a semiconductor device by the bump technique using compound metallic ultra-fine particles each comprising a core portion consisting substantially of a metallic component, and a coating layer chemically bound to the core portion and comprising an organic substance. The method and the structure are characterized by using one of, or a combination of, the following two bump technologies: 1) Forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals. 2) Using paste balls comprising the compound metallic ultra-fine particles, instead of ordinary solder balls.
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公开(公告)号：EP0995784A4
公开(公告)日：2001-04-25
申请号：EP98929847
申请日：1998-07-06
Applicant: NIPPON ZEON CO
Inventor： KODEMURA JUNJI
IPC: C09J9/02 , H01B1/20 , H01B1/22 , H01B1/24 , H01L21/60 , C09J123/26 , C09J145/00 , C09J151/06 , C09J165/00 , C09J171/12
CPC classification number: H01L24/83 , C09J9/02 , H01B1/20 , H01B1/22 , H01B1/24 , H01L24/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29369 , H01L2224/29393 , H01L2224/29399 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1579 , Y10T428/249994 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31515 , Y10T428/31522 , Y10T428/31678 , Y10T428/31692 , Y10T428/31696 , Y10T428/31855 , Y10T428/31931 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00012 , H01L2924/00014
Abstract: An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.
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4.发明公开CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME 审中-公开LETENDES VERBINDUNGSELEMENT UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP2560197A4
公开(公告)日：2016-04-27
申请号：EP11755941
申请日：2011-03-18
Applicant: FURUKAWA ELECTRIC CO LTD
Inventor： NISHIKUBO HIDEO , MASUMORI SHUNJI , HARADA TAKUYA , ISHII TOMOHIRO , FUJIWARA HIDEMICHI
IPC: H01L21/60 , H01L23/485 , H01L23/488
CPC classification number: H01L24/13 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05166 , H01L2224/05644 , H01L2224/1132 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13294 , H01L2224/13305 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1601 , H01L2224/16227 , H01L2224/16245 , H01L2224/2732 , H01L2224/2747 , H01L2224/29294 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29323 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/3201 , H01L2224/32227 , H01L2224/32245 , H01L2224/81075 , H01L2224/81125 , H01L2224/81127 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8184 , H01L2224/83075 , H01L2224/83125 , H01L2224/83127 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83447 , H01L2224/8384 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
Abstract: A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume%, and mean pore diameter being from 1 to 200 nm.
Abstract translation: 一种形成在半导体的电极端子或电路板的电极端子的接合面上的导电连接构件，所述导电性连接构件包括多孔体，所述多孔体形成为含有具有平均值的金属微粒（P）的导电性糊料 一次粒径为10〜500nm的有机溶剂（S），或包含有机溶剂（S）和有机粘合剂（R）的金属微粒（P）和有机分散介质（D）的导电糊） 对于待接合的金属微粒（P）进行加热处理，多孔体由平均一次粒径为10〜500nm的接合金属微粒（P）形成，孔隙率为5〜35 体积％，平均孔径为1〜200nm。
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公开(公告)号：EP1865549A4
公开(公告)日：2012-07-11
申请号：EP06729266
申请日：2006-03-16
Applicant: PANASONIC CORP
Inventor： KARASHIMA SEIJI , KITAE TAKASHI , NAKATANI SEIICHI
CPC classification number: H05K3/3484 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/742 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11005 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/11849 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/1601 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/16505 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29347 , H01L2224/294 , H01L2224/29411 , H01L2224/32225 , H01L2224/73204 , H01L2224/742 , H01L2224/75 , H01L2224/83097 , H01L2224/83192 , H01L2224/83204 , H01L2224/83211 , H01L2224/83855 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/301 , H01L2924/30105 , H01L2924/381 , H05K3/323 , H05K2201/10977 , H05K2203/0425 , H05K2203/087 , H05K2203/1178 , Y10T156/1744 , H01L2924/00011 , H01L2924/0103 , H01L2924/01051 , H01L2924/01083 , H01L2924/00015 , H01L2924/066 , H01L2924/00 , H01L2224/05599
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公开(公告)号：EP0995784B1
公开(公告)日：2004-09-22
申请号：EP98929847.6
申请日：1998-07-06
Applicant: NIPPON ZEON CO., LTD.
IPC: C09J123/26 , C09J165/00 , C09J171/12 , H01B1/20 , C09J9/02 , C09J145/00 , C09J151/06
CPC classification number: H01L24/83 , C09J9/02 , H01B1/20 , H01B1/22 , H01B1/24 , H01L24/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29369 , H01L2224/29393 , H01L2224/29399 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1579 , Y10T428/249994 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31515 , Y10T428/31522 , Y10T428/31678 , Y10T428/31692 , Y10T428/31696 , Y10T428/31855 , Y10T428/31931 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00012 , H01L2924/00014
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7.发明授权Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效使用这些leifähigen糊和用于制备填充的接触孔，布线基板上的导电浆料组合物
公开(公告)号：EP0651602B1
公开(公告)日：1999-04-07
申请号：EP94117098.7
申请日：1994-10-28
Applicant: Matsushita Electric Industrial Co., Ltd. , DAI-ICHI KOGYO SEIYAKU CO., LTD. , Dowa Mining Co., Ltd.
Inventor： Kawakita, Kouji, , Nakatani, Seiichi, , Ogawa, Tatsuo, , Suehiro, Masatoshi, , Iwaisako, Kouichi, , Akiyama, Hideo,
CPC classification number: H05K1/095 , H01B1/22 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , H01L2924/0665 , H01L2924/00014
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公开(公告)号：EP0779653A3
公开(公告)日：1999-01-20
申请号：EP96119804.1
申请日：1996-12-10
Applicant: DOW CORNING CORPORATION
Inventor： Bearinger, Clayton R. , Camilletti, Robert Charles , Kilby, Jack St. Clair , Haluska, Loren Andrew , Michael, Keith Winton
IPC: H01L21/60
CPC classification number: H01L24/81 , C08L2666/54 , C09J183/04 , H01L2224/13111 , H01L2224/16225 , H01L2224/16235 , H01L2224/29076 , H01L2224/29083 , H01L2224/2919 , H01L2224/29191 , H01L2224/29291 , H01L2224/29311 , H01L2224/29316 , H01L2224/29344 , H01L2224/29388 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/81193 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/321 , Y10T428/2857 , Y10T428/31663 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
Abstract: A method and composition for joining flip chips back-side-up with respect to substrates, comprises applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material and, optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn or Au/Sn. The adhesive is applied as a ball or bump itself, in conjunction with a solder ball or bump or in the form of tape sandwiched between the flip chip and the substrate.
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公开(公告)号：EP3045508B1
公开(公告)日：2018-11-14
申请号：EP14844800.4
申请日：2014-09-09
Applicant: Dexerials Corporation
Inventor： AOKI Masaharu , KANISAWA Shiyuki , NAMIKI Hidetsugu , KOYAMA Taichi , ISHIGAMI Akira
IPC: C09J163/00 , C09J7/00 , C09J11/04 , C09J133/00 , H01B1/20 , H01R11/01 , C08F220/18
CPC classification number: C09J133/20 , C08F220/18 , C08L33/066 , C08L33/068 , C08L2205/22 , C09J9/02 , C09J133/066 , C09J163/00 , H01B1/22 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/62 , H01L2224/16227 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/32225 , H01L2224/81424 , H01L2224/81487 , H01L2224/81903 , H01L2224/83424 , H01L2224/83487 , H01L2224/83851 , H01L2224/83862 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2933/0066 , H01L2924/00 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/01006 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , C08F2220/1825 , C08F2220/1808 , C08F220/44 , C08F220/06 , C08F220/20 , C08K5/151
Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.
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公开(公告)号：EP3166999A1
公开(公告)日：2017-05-17
申请号：EP14897036.1
申请日：2014-07-07
Applicant: Honeywell International Inc.
Inventor： LIU, Ya Qun , ZENG, Liang , WANG, Hui , ZHANG, Bright , HUANG, Hong Min
CPC classification number: C09K5/14 , C08K13/02 , C08K2201/001 , C08L23/0815 , C08L2201/08 , C08L2203/20 , C09K5/063 , C09K15/06 , C09K15/22 , C09K15/24 , C09K15/30 , G06F1/20 , H01L23/3675 , H01L23/3737 , H01L23/42 , H01L24/32 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/32245 , H01L2924/0002 , H01L2924/0503 , H01L2924/05032 , H01L2924/05042 , H01L2924/0542 , H01L2924/05432 , H01L2924/0544 , H01L2924/12041 , H01L2924/1432 , H05K7/2039 , H01L2924/00
Abstract: A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.
Abstract translation: 热界面材料包括至少一种聚合物，至少一种导热填料; 和至少一种离子清除剂。 在一些实施方案中，离子清除剂为选自以下的络合剂：含氮络合剂，含磷络合剂和基于羟基羧酸的络合剂。
