PLATINUM ELECTRODE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明公开
    PLATINUM ELECTRODE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    维多利亚州立大学DAVON

    公开(公告)号:EP3135796A1

    公开(公告)日:2017-03-01

    申请号:EP16187016.7

    申请日:2003-04-10

    Inventor: ZHOU, Dau Min

    Abstract: A method for electroplating a rough platinum surface coating comprising: electroplating the surface of a conductive substrate at a rate such that the particles of platinum form on the conductive substrate faster than necessary to form shiny platinum and slower than necessary to form platinum black, wherein at least a portion of said rough platinum surface coating has a fractal geometry, and wherein electroplating voltage is less than -0.45 Volts and greater than -0.85 Volts vs. Ag/AgCl reference electrode

    Abstract translation: 一种用于电镀粗糙铂表面涂层的方法,包括:以使得导电基底上形成的铂颗粒比形成有光泽的铂所需的铂更快而不是形成铂黑所需的速度慢的速率使导电基底的表面电镀,其中在 所述粗糙的铂表面涂层的至少一部分具有分形几何形状,并且其中电镀电压小于-0.45V且大于-0.85V,相对于Ag / AgCl参比电极

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