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公开(公告)号：EP3854846B1
公开(公告)日：2024-12-04
申请号：EP19862750.7
申请日：2019-09-17
Inventor： NAGAI, Aki , TANAKA, Ryo , KIMURA, Kentaro , KINOSHITA, Kosuke , FUKUTAKE Hitomi
IPC: C08L23/10 , B32B27/00 , B32B27/18 , B65D65/40 , C08L23/26 , C08L53/00 , C09K3/18 , C09D123/16 , C09D153/00
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公开(公告)号：EP4357435A3
公开(公告)日：2024-07-24
申请号：EP24153210.0
申请日：2017-08-25
Applicant: The Boeing Company
Inventor： CALLAHAN, Rebecca A. , KINLEN, Patrick J. , BRUTON, Eric A.
IPC: B64D15/12 , H01B1/12 , H05B3/14 , C08K5/42 , C08L33/08 , C08L79/02 , C09D133/06 , C09D179/02 , C08L65/00 , B05D1/00 , B05D1/02 , B05D3/14 , C09D133/08 , C09D153/00 , C09D163/00 , C09D165/00 , C09D175/04 , C09D5/24 , C09K3/16 , C08G73/02 , C08F116/38
CPC classification number: C08K5/42 , C08L33/08 , C08L65/00 , C08L79/02 , C08G2261/142420130101 , C08G2261/322320130101 , C08G2261/51220130101 , C08G2261/79420130101 , C08G73/0266 , C08F116/38 , C09D165/00 , C09D179/02 , C08K2201/00120130101 , B64D15/12 , H05B3/145 , H05B3/146 , H01B1/128 , H05B2203/01320130101 , H05B2203/01720130101 , B64C1/12
Abstract: Compositions of the present disclosure comprise electrostatic dissipative compositions comprising a first polymer, a second polymer, and a naphthyl sulfonic acid. Methods of the present disclosure comprise heating a vehicle component by applying a voltage to a surface of a composition disposed on a vehicle component. The composition comprises a first polymer and a second polymer.
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公开(公告)号：EP4337734A1
公开(公告)日：2024-03-20
申请号：EP22728579.8
申请日：2022-05-11
Applicant: BASF SE
Inventor： GRIGORENKO, Nikolay A , OSWALD, Andre , LEYBACH, Holger , KNISCHKA, Ralf , GERNANDT, Andreas
IPC: C09D7/40 , C09D7/61 , B42D25/425 , B42D25/378 , B42D25/36 , B42D25/30 , C08F222/00 , C08F222/10 , C08F287/00 , C08F292/00 , C08F293/00 , C08K3/08 , C08L53/00 , C09D5/00 , C09D151/10 , C09D153/00 , B42D25/324 , B42D25/328 , B42D25/364 , B42D25/351
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公开(公告)号：EP3786243B1
公开(公告)日：2023-04-12
申请号：EP19791755.2
申请日：2019-04-22
Inventor： OKUMURA, Shin , HONJO, Kazuhiko , UCHIYAMA, Shuhei
IPC: C09D153/00 , B32B27/30 , C09D5/16 , C09D7/61 , C09D183/10 , F21S8/06 , F21V8/00 , F21Y115/10
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公开(公告)号：EP3700988B1
公开(公告)日：2021-08-18
申请号：EP18783533.5
申请日：2018-10-16
Inventor： GERNANDT, Andreas , AUSCHRA, Clemens , KNISCHKA, Ralf
IPC: C09D153/00 , C09D183/06 , C08L53/00 , C08L83/06 , C09D11/023 , C09D11/033 , C09D11/03 , C09D11/102 , C09D11/107
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公开(公告)号：EP3202801B1
公开(公告)日：2021-08-18
申请号：EP15847574.9
申请日：2015-09-30
Inventor： LEE, Mi Sook , KIM, Jung Keun , KU, Se Jin , PARK, No Jin , LEE, Je Gwon , CHOI, Eun Young , YOON, Sung Soo , RYU, Hyung Ju
IPC: C08J7/04 , B82Y40/00 , C08F293/00 , C08L53/00 , C08F220/30 , C08J5/00 , C08F216/12 , C08F212/14 , C08F220/12 , C08F220/10 , C09D153/00 , G03F7/00 , B81C1/00
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公开(公告)号：EP3860318A1
公开(公告)日：2021-08-04
申请号：EP19867774.2
申请日：2019-09-20
Applicant: Sekisui Fuller Company, Ltd.
Inventor： NISHIDA, Haruhiko , NAGATA, Yoshiki , YOSHIMURA, Keiji
IPC: H05K3/28 , C09D7/65 , C09D153/00 , C09D191/00 , C09D191/06 , C09D201/00
Abstract: The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160°C (η1) of 20000 mPa·s or less and a melt viscosity at 180°C (η2) of 10000 mPa·s or less, wherein the ratio of the melt viscosity at 160°C (η1) to the melt viscosity at 180°C (η2) (η1/η2) is 1.0 to 5.0.
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公开(公告)号：EP2798018B1
公开(公告)日：2021-04-07
申请号：EP12799478.8
申请日：2012-12-04
Inventor： BATRA, Ashish , WALTON, Kim, L. , DIAS, Peter, S.
IPC: C09D123/02 , C09D153/00
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公开(公告)号：EP3786243A1
公开(公告)日：2021-03-03
申请号：EP19791755.2
申请日：2019-04-22
Inventor： OKUMURA, Shin , HONJO, Kazuhiko , UCHIYAMA, Shuhei
IPC: C09D153/00 , B32B27/30 , C09D5/16 , C09D7/61 , C09D183/10 , F21S8/06 , F21V8/00 , F21Y115/10
Abstract: The present disclosure provides an antifouling coating composition that may be used to make an antifouling coating film that reduces the adhesion of dust and oily components thereon. An antifouling coating composition contains a solid content which is a constituent component of the antifouling coating film. The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.
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公开(公告)号：EP3778768A1
公开(公告)日：2021-02-17
申请号：EP20191489.2
申请日：2013-02-22
Applicant: BASF SE
Inventor： THOMSON, Mary , KNISCHKA, Ralf , AUSCHRA, Clemens , ENGELBRECHT, Lothar
IPC: C08L53/00 , C09D153/00 , C09J153/00 , C08L27/12 , C08L33/14 , C08L33/16 , C08L75/04 , C09D133/16 , C09J133/16 , C08G18/62
Abstract: The present invention relates to a composition, comprising
- a binder resin,
- a block copolymer which comprises at least a block A and a block B, wherein
- the block A comprises monomer units derived from a compound selected from (meth)acrylic acid, a (meth)acrylic acid ester, a (meth)acrylamide, a vinyl aromatic compound, or any mixture thereof,
- the block B comprises monomer units derived from a fluorinated alpha-olefin having the following formula (II):
H 2 C=CH(R F-2 ) (II)
wherein R F-2 is an organic residue containing a perfluorinated C 4-6 alkyl group.
