Abstract:
Verfahren zum Ziehen eines Einkristalls aus Silizium aus einer Schmelze, die in einem Tiegel enthalten ist, umfassend das Ziehen eines Einkristalls in einer ersten Phase, in der ein Anfangskonus entsteht, wobei ein Durchmesser D(to) und ein Kristallwinkel ω(t 0 ) jeweils zum Zeitpunkt t 0 bestimmt wird und eine Regelung verwendet wird, deren Führungsgröße den Durchmesser D(to) enthält, und das Ziehen des Einkristalls in einer zweiten Phase, in der ein zylindrischer Abschnitt mit einem Zieldurchmesser D T (Stabphase) entsteht, wobei eine Regelung verwendet wird, deren Führungsgröße die Länge des zylindrischen Abschnitts enthält, und der Wechsel zwischen der ersten Phase und der zweiten Phase dann vollzogen wird, sobald alternativ folgende Kriterien erfüllt sind: Winkelkriterium: D(to) > D T - Δ dω und co(to) max, Durchmesserkriterium: D(to) > D T - Δ dd, wobei die Abweichung vom Zieldurchmesser für das Winkelkriterium Δ dω nicht kleiner ist als 0 mm und nicht größer ist als 6 mm und der maximale Kristallwinkel ω max nicht kleiner ist als 0° und nicht größer ist als 20° und die Abweichung vom Zieldurchmesser für das Durchmesserkriterium Δ dd nicht kleiner ist als -2 mm und nicht größer ist als 5 mm.
Abstract:
A method and device for controlling constant-diameter growth of monocrystalline silicon and a storage medium, relating to the technical field of crystal fabrication, which can automatically adjust the controlling level of the crystal constant-diameter growth, to in turn control the crystal diameter better. The particular technical solution includes: acquiring PID initial values of an i -th cycle period; correcting the PID initial values of the i -th cycle period, and obtaining PID corrected values of the i -th cycle period; and according to the PID corrected values of the i -th cycle period, controlling a crystal growth diameter of the i -th cycle period. The present application is used to control constant-diameter growth of monocrystalline silicon.
Abstract:
In one embodiment, a sheet production apparatus comprises a vessel configured to hold a melt of a material. A cooling plate is disposed proximate the melt and is configured to form a sheet of the material on the melt. A first gas jet is configured to direct a gas toward an edge of the vessel. A sheet of a material is translated horizontally on a surface of the melt and the sheet is removed from the melt. The first gas jet may be directed at the meniscus and may stabilize this meniscus or increase local pressure within the meniscus.
Abstract:
Preparation of lutetium and yttrium aluminate single crystals doped with rare earth oxides and transition elements consists in the preparation of oxide mixture sinter which is melted throughout and homogenized for a period of at least one hour. The crystal growth rate and broadening of the crystal cone are maintained uniform at an angle of at least 60° from the crystal axis up to a diameter of at least 80% of the crucible diameter which is at least 100 mm. The completion of the process occurs by separating the crystal from the melt while the crystal continues to be positioned inside the crucible in the zone wherein it was grown, and wherein final tempering of the crystal also takes place.
Abstract:
[Subject] To provide a method of manufacturing a silicon single crystal, capable of suppressing generation of dislocation extending from a neck portion to a straight part of ingot. [Solving Means] A method of manufacturing a silicon single crystal according to this invention includes the steps of preparing a silicon melt (a preparation step (S10)), forming a neck portion continuing from a seed crystal by bringing the seed crystal in contact with the silicon melt (a neck portion formation step (S20)), separating the neck portion from the silicon melt (a separation step (S30)), decreasing a temperature of the neck portion separated from the silicon melt from a temperature of the neck portion in the neck portion formation step (S20) (a cooling step (S40)), and forming a silicon single crystal continuing from the neck portion by again bringing the neck portion in contact with the silicon melt after the cooling step (S40) (a re-growth step (S50)).
Abstract:
Methods and system for controlling crystal growth in a Czochralski crystal growing apparatus. A magnetic field is applied within the crystal growing apparatus and varied to control a shape of the melt-solid interface where theingot is being pulled from the melt. The shape of the melt-solid interface is formed to a desired shape in response to the varied magnetic field as a function of a length of the ingot.
Abstract:
The present invention provides a system for manufacturing a silicon single crystal which designs manufacturing conditions under which a value of F/G is controlled to fall within a predetermined range in order that a crystal quality of a silicon single crystal manufactured by a pulling apparatus using the CZ method falls within a target standard, including, automatically, at least: means 1 tentatively designing manufacturing conditions of a silicon single crystal in a subsequent batch from a crystal quality result of a silicon single crystal in a previous batch; means 2 calculating a correction amount from an amount of change in F and/or G due to constituent members of the pulling apparatus in the subsequent batch; means 3 calculating a correction amount from an amount of change in F and/or G due to a manufacturing process in the subsequent batch; and means 4 adding the correction amount by the means 2 and/or the means 3 to the manufacturing conditions by the means 1 to calculate manufacturing conditions in the subsequent batch. As a result, there can be provided the system for manufacturing a silicon single crystal that can more assuredly obtain a silicon single crystal having a desired crystal quality and improve productivity or a yield and a method for manufacturing a silicon single crystal using this system.