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公开(公告)号：EP4506754A2
公开(公告)日：2025-02-12
申请号：EP24192828.2
申请日：2024-08-05
Applicant: Duksan Neolux Co., Ltd
Inventor： Kim, Jin Hyun , Kwon, Ju cheol , Lee, Changmin , Kim, Kyung Soo
Abstract: There is an effect of increasing the mechanical properties and adhesion to the base of a pattern manufactured from a photosensitive composition including a copolymer in which a monomer capable of increasing mechanical properties is introduced into the component of the benzoxazole-based copolymer resin according to the present disclosure, and a silane-based additive.
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2.发明公开
公开(公告)号：EP4433873A2
公开(公告)日：2024-09-25
申请号：EP22817950.3
申请日：2022-11-15
Applicant: Merck Patent GmbH
Inventor： LI, Zhong , WU, Hengpeng , CHEN, Chunwei , LIU, Weihong , CHEN, Hung-Yang
IPC: G03F7/022 , G03F7/023 , G03F7/027 , G03F7/032 , G03F7/033 , G03F7/038 , G03F7/039 , G03F7/085 , G03F7/16
CPC classification number: G03F7/085 , G03F7/16 , G03F7/0236 , G03F7/0233 , G03F7/0226 , G03F7/0392 , G03F7/027 , G03F7/033 , G03F7/032 , G03F7/0382
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3.发明公开
公开(公告)号：EP4276055A1
公开(公告)日：2023-11-15
申请号：EP21917741.7
申请日：2021-12-27
Applicant: Toray Industries, Inc.
Inventor： KOYAMA, Yutaro , ARAKI, Hitoshi
Abstract: The present invention provides a hollow structure having a low acid ion content and low wiring corrosion when stored in high-temperature, high-humidity conditions. The present invention relates to a hollow structure in which an organic film (I) having a film thickness of 5-30 um as a hollow structure support material and an organic film (II) having a film thickness of 5-30 um as a hollow structure roof material are layered in said order from the upper surface of a substrate having a metal wiring, wherein, when the organic film (I) and the organic film (II) are independently evaluated by the following method for evaluating ion elution amounts, the total of the ion elution amount of the organic film (I) and the ion elution amount of the organic film (II) is no more than 4,000 ppm. (Ion elution amount evaluation method) An organic film is placed in pure water having a mass 10 times that of the organic film and is extracted in hot water for 10-20 hours at 100-121 °C, after which the supernatant of the liquid extract is used as a sample solution. The sample solution and a target ion standard solution are introduced into an ion chromatography device, the concentrations of formate ions, acetate ions, propionate ions, and sulfate ions in the sample solution are determined by a calibration curve method, and a value obtained by converting the total of said concentrations into the mass of eluted ions relative to the mass of the organic film is used as the ion elution amount.
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公开(公告)号：EP4122964A1
公开(公告)日：2023-01-25
申请号：EP21775123.9
申请日：2021-03-25
Applicant: Central Glass Company, Limited
Inventor： HIROTAKI, Kensuke , HARA, Yukari , AOKI, Takashi , NAGURA, Hirokatsu , HOSOI, Kenji
Abstract: A novolak resin including a partial structure represented by -C(CF 3 )H-. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by -C(CF 3 )H-. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by -C(CF 3 )H-. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by -C(CF 3 )H-with epihalohydrin in a presence of a base.
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5.发明公开
公开(公告)号：EP4099090A1
公开(公告)日：2022-12-07
申请号：EP21830283.4
申请日：2021-06-21
Applicant: Showa Denko Materials Co., Ltd.
Inventor： AOKI, Yu , HAMANO, Yoshimi , SUZUKI, Teruaki , HASHIMOTO, Masahiro
Abstract: The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.
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6.发明公开
公开(公告)号：EP4062232A1
公开(公告)日：2022-09-28
申请号：EP20808354.3
申请日：2020-11-17
Applicant: Merck Patent GmbH
Inventor： KUDO, Takanori , CHEN, Hung-Yang
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公开(公告)号：EP3974904A1
公开(公告)日：2022-03-30
申请号：EP21197201.3
申请日：2021-09-16
Applicant: Shin-Etsu Chemical Co., Ltd.
Inventor： Urano, Hiroyuki , Iio, Masashi , Takemura, Katsuya
Abstract: The present invention is a photosensitive resin composition containing: (A) a resin; (B) a photosensitizer; (C) a surfactant containing a structural unit represented by the following average composition formula (1); and (D) a solvent, where Y 1 and Y 2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by the following general formula (2), at least one of Y 1 and Y 2 is a group represented by the following general formula (2), R 1 to R 6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, "l" and "n" are each independently integers of 1 to 100, and "m" is an integer of 0 to 100. This provides: a photosensitive resin composition that is excellent in film thickness uniformity at the time of application and that has reduced coating defects when forming a thick film; a patterning process performed using the photosensitive resin composition; a cured film formed by curing the pattern; and an electronic component having the cured film.
(R 1 R 2 Y 2 SiO 1/2 ) 2 (R 3 Y 1 SiO 2/2 ) I (R 5 R 6 SiO 2/2 ) n (R 4 SiO 3/2 )m (1)
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公开(公告)号：EP3896521A1
公开(公告)日：2021-10-20
申请号：EP21156645.0
申请日：2021-02-11
Inventor： Zubarev, Dmitry , Urano, Hiroyuki , Takemura, Katsuya , Iio, Masashi , Honda, Kazuya , Kawai, Yoshio
Abstract: Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2):
wherein T 1 and T 2 may be the same as, or different from, each other and represent any of -CO- and -SO 2 -; X 1 is a tetravalent organic group; and 1 is 0 or 1; and X 2 is a divalent organic group.
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公开(公告)号：EP3734362B1
公开(公告)日：2021-09-08
申请号：EP20166910.8
申请日：2020-03-30
Inventor： Urano, Hiroyuki , Takemura, Katsuya , Iio, Masashi , Honda, Kazuya
