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公开(公告)号:EP4360799A1
公开(公告)日:2024-05-01
申请号:EP22845625.7
申请日:2022-03-15
发明人: SENGA, Takehito
IPC分类号: B23K26/364
CPC分类号: B23K26/364
摘要: Provided are a laser machining method and a laser machining device that can form a large number of fine grooves on a surface of a base material. A laser machining method and a laser machining device according to the present invention include: emitting a beam of laser light in a form of pulse from each of a plurality of laser emitting ends into a space, the plurality of laser emitting ends being arranged separately from each other; making a plurality of beams of the laser light incident on a light collection optical system that reduces a gap between the beams of the laser light to such an extent that the plurality of beams of the laser light are prevented from intersecting each other on a surface to be machined; irradiating the surface to be machined with the plurality of beams of the laser light emitted from the light collection optical system to form a plurality of focused spots separated from each other in a first direction, the plurality of focused spots each causing ablation; and moving the light collection optical system and the surface to be machined relative to each other both along the surface to be machined and in a second direction orthogonal to the first direction to simultaneously form a plurality of grooves on the surface to be machined.
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公开(公告)号:EP4357065A1
公开(公告)日:2024-04-24
申请号:EP22824619.5
申请日:2022-03-29
IPC分类号: B23K26/364 , H01L21/301
CPC分类号: B23K26/364 , H01L21/30
摘要: To provide a method that is less likely to cause cracks on the end surface of a brittle material layer after division, and that allows a composite material to have sufficient bending strength after division.
[Solution]
The present invention is directed to a method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a brittle material removing step in which irradiation is performed from a brittle material layer side with a laser beam L1, which is oscillated from an ultrashort pulse laser light source 20, along a scheduled dividing line DL of the composite material to form a scribe groove 11; and a resin removing step in which the resin layer is irradiated with a laser beam L2, which is oscillated from a laser light source 30, along the scheduled dividing line to remove a resin forming the resin layer. In the brittle material removing step, the laser beam L1 is oscillated to form the scribe groove that is open on a resin layer side, but is prevented from penetrating through the brittle material layer, the laser beam L1 being oscillated in a state in which a focal point AF of the laser beam L1 is set to a position, in the resin layer, which is located in a vicinity of an interface with the brittle material layer, and a thickness of the resin layer at an irradiation position that is irradiated with the laser beam L1 is 5 µm or more.-
公开(公告)号:EP3536441B1
公开(公告)日:2024-02-14
申请号:EP17866752.3
申请日:2017-09-01
IPC分类号: B23K26/364 , B21D37/01 , B21D37/20 , B23K26/00 , B21D22/28 , B21D51/26 , B23K26/0622 , B23K103/00
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4.
公开(公告)号:EP4318075A1
公开(公告)日:2024-02-07
申请号:EP22781205.4
申请日:2022-03-30
IPC分类号: G02B26/12 , B23K26/082 , B23K26/364 , G02B26/10
摘要: Provided is a laser scanning device that scans a surface of an electrical steel sheet with a laser beam, and includes: a laser beam output unit which irradiates the laser beam; a polygon mirror which has a polygonal shape including a top surface and a bottom surface that are polygonal, in which at least any one surface excluding the top surface and the bottom surface is formed as a mirror, which rotates about an axis serving as a rotation axis and penetrating the top surface and the bottom surface, and which causes the laser beam irradiated from the laser beam output unit to be reflected at the mirror; and an optical system which guides the laser beam reflected at the polygon mirror to the surface of an electrical steel sheet, the rotation axis of the polygon mirror being parallel to the surface of the electrical steel sheet and substantially parallel to a direction in which the laser beam is scanned.
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公开(公告)号:EP4245524A1
公开(公告)日:2023-09-20
申请号:EP21891717.7
申请日:2021-11-02
IPC分类号: B32B17/10 , B23K26/364 , B23K26/38 , B32B38/18
摘要: The present multi-layered structure includes: a resin layer; and a glass layer stacked via an adhesive layer on the resin layer. A thickness of the glass layer is 10 µmor more and 300 um or less. A thickness of an outer peripheral portion of the resin layer is 5 um or more.
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公开(公告)号:EP3274305B1
公开(公告)日:2023-09-06
申请号:EP16709951.4
申请日:2016-03-15
发明人: O'CONNOR, Gerard , COLLINS, Adam
IPC分类号: C03B33/02 , B23K26/364 , B23K26/0622 , B23K26/073 , B23K26/082 , B23K26/08 , B23K26/402 , B23K101/18 , B23K103/00
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公开(公告)号:EP3695932B1
公开(公告)日:2023-06-14
申请号:EP18866963.4
申请日:2018-10-12
发明人: SON, Bu Won , LEE, Jin Soo , JUNG, Jin Mi , SHIN, Bu Gon
IPC分类号: B29C65/16 , B23K26/324 , B23K26/364 , B29C65/82 , B29K709/08 , B29K23/00 , B23K103/18
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8.
公开(公告)号:EP4178754A1
公开(公告)日:2023-05-17
申请号:EP21743136.0
申请日:2021-07-08
发明人: MEYER, Fabian , BRAND, Andreas , NEKARDA, Jan
IPC分类号: B23K26/00 , B23K26/0622 , B23K26/06 , B23K26/067 , B23K26/352 , B23K26/364 , B23K26/402 , H01L21/027 , H01L31/0224 , B23K101/36 , B23K101/40 , B23K103/16
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公开(公告)号:EP3751013B1
公开(公告)日:2023-03-29
申请号:EP19750767.6
申请日:2019-02-06
IPC分类号: C21D8/12 , H01F1/147 , B23K26/364 , C21D1/76 , H01F1/16 , C22C38/02 , B23K26/40 , B23K101/18 , B23K103/04 , C21D9/46 , C21D10/00 , C23C8/02 , C23C8/26 , C23C8/80 , C23C28/04 , B23K26/142 , B23K101/36 , B23K26/08
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公开(公告)号:EP3975224B1
公开(公告)日:2022-11-30
申请号:EP21183785.1
申请日:2021-07-05
IPC分类号: H01L21/268 , H01L21/76 , H01L21/8252 , H01L21/285 , H01L27/06 , H01L29/08 , B23K26/12 , H01L21/335 , H01L21/329 , B23K26/0622 , B23K26/364
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