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    CORRUGATION-CRIMPED PACKAGE OF PAPER MATERIAL
    1.
    发明公开
    CORRUGATION-CRIMPED PACKAGE OF PAPER MATERIAL 审中-实审

    公开(公告)号：EP4406875A1

    公开(公告)日：2024-07-31

    申请号：EP22872722.8

    申请日：2022-09-08

    申请人： Rengo Co., Ltd.

    发明人： KAJIZUKA, Takashi ,  TONOOKA, Hidetoshi ,  FUJITANI, Keiichi ,  MORI, Takuya

    IPC分类号： B65D75/30 ,  B65B9/02 ,  B65B11/50 ,  B65D75/08

    CPC分类号： B65B11/50 ,  B65D75/08 ,  B65D75/30 ,  B65B9/02

    摘要： A package is provided which is formed by, with a commodity (G) sandwiched between single-faced corrugated paperboards (1) that are vertically disposed paper members, pressure-bonding together the paper members at the edges (2, 3) of the paper members along the peripheral sides thereof. The edges (2) of the single-faced corrugated paperboards (1) along at least two opposed sides thereof are subjected to waveform bonding by pressure bonding such that a wave shape is formed in the thickness direction of the single-faced corrugated paperboards (1). The dimensional difference between (i) the length L1 of the portion of each paper member deflected by sandwiching a commodity (G), and (ii) the flat-bonding length (imaginary linear distance) L2 of a respective one of the edges (2) extending parallel to the direction of the length L1, and each imaginarily bonded flat is absorbed by the waveform bonding, so that, at these edges (2), the vertical gaps between the single-faced corrugated paperboards (1) are eliminated.