HOT MELT ADHESIVE COMPOSITION
    8.
    发明公开

    公开(公告)号:EP3839004A1

    公开(公告)日:2021-06-23

    申请号:EP19306715.4

    申请日:2019-12-20

    申请人: BOSTIK SA

    IPC分类号: C09J123/20 C08L23/20

    摘要: The present invention relates to a hot melt adhesive composition having an enthalpy of crystallization below 5 J/g and comprising:
    a) at least 60% by weight of a composition a) comprising :
    - at least one copolymer A having a needle penetration higher than 15 dmm;
    - at least (co)polymer B having a needle penetration lower than 15 dmm ;

    b) from 0% to 30% by weight of at least one tackifying resin.