公开(公告)号：JP3925449B2

公开(公告)日：2007-06-06

申请号：JP2003098495

申请日：2003-04-01

Applicant: 日立電線株式会社

Inventor： 滋宏 森下

IPC: H01L21/60

CPC classification number: H01L2224/16225 ,  H01L2924/15311

Abstract: PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device, which improves the adhesive property of a solder resist, does not change the shape of the copper foil after the foil is roughened, and can match the desired roughened amount or roughened shape; and to provide a method of manufacturing the tape carrier. SOLUTION: In the method of manufacturing the tape carrier, the tape carrier is manufactured by forming circuit patterns 21 and 22 of a copper foil on one or both surfaces of a tape substrate 4 composed of an insulating film, and forming an insulating film or providing a cover film by applying the solder resist to the areas of the circuit patterns 21 and 22 excluding connecting terminals. Immediately before the insulating film is formed or cover film is provided by applying the solder resist, a roughening process is performed for roughening the surface and side face of the copper foil forming the circuit patterns 21 and 22. COPYRIGHT: (C)2005,JPO&NCIPI