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公开(公告)号：JP4732710B2
公开(公告)日：2011-07-27
申请号：JP2004151919
申请日：2004-05-21
Applicant: ハリマ化成株式会社
IPC: C09J201/00 , C09J133/00 , C09J145/00 , C09J157/02 , C09J193/04
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公开(公告)号：JP2011121059A
公开(公告)日：2011-06-23
申请号：JP2009278210
申请日：2009-12-08
Applicant: Arakawa Chem Ind Co Ltd , Denso Corp , Fujitsu Ten Ltd , Harima Chemicals Inc , Koki:Kk , Toyota Motor Corp , トヨタ自動車株式会社 , ハリマ化成株式会社 , 富士通テン株式会社 , 株式会社デンソー , 株式会社弘輝 , 荒川化学工業株式会社
Inventor： IWAMURA EIJI , GOTO KAZUYUKI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO KIMITAKA , NAKAMURA MITSUO , OKOCHI TERUO , MITSUHARU MASAKI , SUKEGAWA TAKUSHI , IKEDO KENJI , ANDO YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SATOSHI
IPC: B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00
CPC classification number: B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
Abstract: PROBLEM TO BE SOLVED: To provide flux for solder paste and solder paste having adequate fluidity even when the shear force is repeatedly applied thereto, and capable of suppressing any fatigue degradation of the viscoelastic characteristic and various kinds of performance degradation due to the same.
SOLUTION: The flux for solder paste comprises acrylic resin which is obtained by the radical copolymerization of (meth)acrylic ester having a 6-15C alkyl group and (meth)acrylic ester other than that (meth)acrylic ester, and rosins. The weight ratio of the acrylic resin when that of rosins is 1 is 0.5-1.2, and the flux for solder paste is fluidized by applying the shear force of 10-150 Pa.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：为了提供具有足够的流动性的焊膏和焊膏的助焊剂，即使当反复施加剪切力时，也能够抑制粘弹性特性的疲劳劣化和各种性能下降 相同。 焊膏的焊剂包含通过使具有6-15C烷基的（甲基）丙烯酸酯与除（甲基）丙烯酸酯以外的（甲基）丙烯酸酯）和（甲基）丙烯酸酯的自由基共聚得到的丙烯酸树脂，以及松香 。 当松香的丙烯酸树脂为1时，丙烯酸树脂的重量比为0.5-1.2，通过施加10-150Pa的剪切力使焊膏的流量流动。版权所有（C）2011，JPO＆INPIT
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63.发明专利
公开(公告)号：JP2011117021A
公开(公告)日：2011-06-16
申请号：JP2009273651
申请日：2009-12-01
Applicant: Harima Chemicals Inc , ハリマ化成株式会社
Inventor： SAITO HIROSHI , HAMADA TAKESHI , UEDA MASAYUKI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC: B22F1/00
Abstract: PROBLEM TO BE SOLVED: To provide a method for reproducibly producing a spherical metal powder having a mean diameter in a region of a submicron order and a micron order, so as to have such a narrow particle size distribution that σ W /W which is a ratio of the standard deviation σ W to a target weight W (metal quantity) of the metal powder is in the range satisfying σ W /W≤1/2. SOLUTION: In a process of dripping and dropping down a dispersion liquid in which metal nanoparticles are dispersed in an organic solvent, in a form of droplets with a predetermined liquid amount, the method for producing the metal powder with a uniform size includes: making the organic solvent contained in the fine droplets of the dispersion liquid of the metal nanoparticles, which are dripped, evaporate to form particles made of an aggregate of the metal nanoparticles; bumping the particles made of the aggregate of the metal nanoparticles; and further heat-treating the particles made of the aggregate of the metal nanoparticles to progress a sintering reaction among the metal nanoparticles. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 待解决的问题：提供一种可重复地制造平均直径为亚微米级和微米级的球状金属粉末的方法，以具有如此窄的粒度分布，σ
W / SB / W与标准偏差σ W 的比值与金属粉末的目标重量W（金属量）的比值在满足σ W /W≤1/ 2。 解决方案：在将金属纳米颗粒分散在有机溶剂中的分散液滴下并以一定液体的液滴的形式滴下的过程中，具有均匀尺寸的金属粉末的制造方法包括 ：使滴入的金属纳米粒子的分散液的细小液滴中含有的有机溶剂蒸发，形成由金属纳米粒子的聚集体构成的颗粒; 撞击由金属纳米颗粒的聚集体制成的颗粒; 并且进一步热处理由金属纳米颗粒的聚集体制成的颗粒以在金属纳米颗粒之间进行烧结反应。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JPWO2009069601A1
公开(公告)日：2011-04-14
申请号：JP2009543799
申请日：2008-11-25
Applicant: ハリマ化成株式会社
IPC: B23K35/363
CPC classification number: B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , H05K3/3489
Abstract: フラックス残渣の粘着性を抑え、高い信頼性を確保しつつ、リフロー時の揮発量を低減して環境負荷の少ないはんだ付けを可能にするはんだ付け用フラックスを提供する。かかる課題を解決する手段として、本発明のはんだ付け用フラックスは、ベース樹脂、活性剤および溶剤を含有するはんだ付け用フラックスであって、前記溶剤として、20℃以上で液状である有機酸無水物および20℃以上で液状である多価アルコールを含有し、かつ、前記有機酸無水物の酸価をAV(mgKOH/g)、その含有量をWA(g)とし、前記多価アルコールの水酸基価OHV(mgKOH/g)、その含有量をWOH(g)としたときに、AV× WA:OHV×WOH=1:0.4〜0.6である。
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公开(公告)号：JP4660811B2
公开(公告)日：2011-03-30
申请号：JP2003415933
申请日：2003-12-15
Applicant: ハリマ化成株式会社
IPC: C09D11/033 , C09D11/10 , C09D11/102
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公开(公告)号：JP2011057859A
公开(公告)日：2011-03-24
申请号：JP2009209245
申请日：2009-09-10
Applicant: Harima Chemicals Inc , ハリマ化成株式会社
Inventor： OSAKO TAKEHISA , OGAWA TAKAYUKI , MATSUBA YORISHIGE
Abstract: PROBLEM TO BE SOLVED: To provide an electroconductive paste thermally curable at ≤150°C, capable of forming an electroconductive film exhibiting excellent adhesiveness, for example, to the surface of a PET film or a polyimide film, and having flexibility and toughness, and suitable for the formation of a wiring layer of a flexible printed board.
SOLUTION: The electroconductive paste is obtained by selecting an acrylic resin having 284-946 epoxy equivalent, 58-155 hydroxy value, 30,000-170,000 molecular weight, and 10-55°C glass transition temperature as a resin component, and compounding 3-8 pts.mass of the acrylic resin, 0.1-1.5 pts.mass of a silane coupling agent and 8-25 pts.mass of an organic solvent having ≥150°C and ≤266°C boiling point under the normal pressure with 100 pts.mass of metallic silver powder.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：提供一种在≤150℃下可热固化的导电膏，其能够形成例如在PET膜或聚酰亚胺膜的表面上显示出优异的粘附性的导电膜，并且具有柔性和 韧性好，适合形成柔性印刷电路板的布线层。 导电糊是通过选择具有284-946环氧当量，58-155羟基值，30,000-170,000分子量和10-55℃玻璃化转变温度的丙烯酸树脂作为树脂组分而获得的，并且配混 3-8份丙烯酸树脂，0.1-1.5份硅烷偶联剂和8-25份有机溶剂，在常压下具有≥150℃和≤266℃沸点的有机溶剂， 100磅金属银粉。 版权所有（C）2011，JPO＆INPIT
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70.发明专利
公开(公告)号：JP2011038134A
公开(公告)日：2011-02-24
申请号：JP2009184781
申请日：2009-08-07
Applicant: Harima Chemicals Inc , ハリマ化成株式会社
Inventor： SAITO HIROSHI , HATA NORIAKI , MATSUBA YORISHIGE
IPC: B22F1/00
Abstract: PROBLEM TO BE SOLVED: To provide a method for reproducibly producing a spherical metal powder having a mean diameter in a region of a submicron order and a micron order, so as to have such a narrow particle size distribution that σ
W /W which is a ratio of the standard deviation σ
W to the target weight W (metal quantity) of the metal powder is in the range satisfying σ
W /W≤1/2.
SOLUTION: The method for producing the metal powder with a uniform size includes: preparing a dispersion liquid in which metal nanoparticles are dispersed in the first organic solvent; adding the dispersion liquid into the second organic solvent 3 dropwise in a form of droplets 2 of a predetermined amount; diffusing the first organic solvent in the droplet into the surrounding second organic solvent 3 and consequently agglomerating the metal nanoparticles coated with a covering agent to form fine particulate precipitates formed of the aggregate of the metal nanoparticles; collecting the fine particulate precipitates from the second organic solvent 3; drying the precipitates; and further heat-treating the precipitates to progress the sintering of the metal nanoparticles.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 待解决的问题：提供一种可重复地制造平均直径为亚微米级和微米级的球状金属粉末的方法，以具有如此窄的粒度分布，σ
作为标准偏差σ W 与金属粉末的目标重量W（金属量）的比率的W / W / W / W在满足σ W /W≤1/ 2。 解决方案：具有均匀尺寸的金属粉末的制造方法包括：制备其中金属纳米颗粒分散在第一有机溶剂中的分散液; 将分散液以预定量的液滴2的形式逐滴加入到第二有机溶剂3中; 将液滴中的第一有机溶剂扩散到周围的第二有机溶剂3中，从而使涂覆有覆盖剂的金属纳米颗粒凝聚，以形成由金属纳米颗粒的聚集体形成的细微颗粒沉淀; 从第二有机溶剂3收集细颗粒沉淀物; 干燥沉淀物; 并进一步热处理沉淀物以进行金属纳米颗粒的烧结。 版权所有（C）2011，JPO＆INPIT
