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公开(公告)号：JPH023557B2
公开(公告)日：1990-01-24
申请号：JP1959984
申请日：1984-02-06
申请人： HITACHI CONDENSER
发明人： YOKOYAMA HIROYOSHI , GOTO MASAAKI , UOZU NOBUO , MATSUDA YOICHI
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公开(公告)号：JPH01176080A
公开(公告)日：1989-07-12
申请号：JP33585987
申请日：1987-12-28
申请人： POLYPLASTICS CO
发明人： SUZUKI KOJI , MURAO TOSHIRO , OGURA MICHIAKI
IPC分类号： C08J7/04 , C08J7/12 , C23C18/16 , C23C18/20 , C23C18/22 , C23C18/24 , C23C18/38 , H05K1/03 , H05K3/18 , H05K3/38
摘要： PURPOSE:To uniformly impart a catalyst and to improve the plating property by dipping the title molded article in a specified alkaline soln. to rough the surface, and then treating the article with an aq. soln. contg. a surfactant. CONSTITUTION:A resin composition consisting of the hot-workable polyester (expressed liq. crystal polyester hereunder) capable of forming an anisotropic molten phase and contg. 5-80% of >=1 kind of filler selected from a group II element of the periodic table, its oxide and sulfate, elements such as Al and Si, or their oxides is used for the molded article. The article is dipped in an aq. soln. contg. >=20% oxide of an alkali (earth) metal to rough the surface, and then dipped in the aq. soln. of an amphoteric surfactant to activate the roughed surface. In addition, the amphoteric surfactant has >=1 cationic or anionic functional group in its molecular structure, and belongs to an aminocarboxylate type, a carboxybetaine type, etc.
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公开(公告)号：JPS63302593A
公开(公告)日：1988-12-09
申请号：JP13817687
申请日：1987-06-03
申请人： NIPPON MINING CO
发明人： KIKUCHI TETSUO , KAWAKUBO SHOJI
摘要： PURPOSE:To prevent a resistance between conductors from decreasing due to remaining catalyst and to cope with the miniaturization of printed wirings by forming the double film of a plated resist film and a catalyst resistance stabilizing film on the noncircuit section on the surface of an adhesive-coated substrate before a catalyst is applied in a full-additive process. CONSTITUTION:Through holes H are formed and roughed in a board 2 coated with an adhesive 1, and the double films of a plated resist film 3 and a catalyst resistance stabilizing film 4 are formed on the noncircuit section except a circuit forming section on the surface of the board. Then, catalyst 5 is applied to the surface of the board formed with the double films and the inner walls of the holes H, the film 4 is exfoliated, and electroless copper plating 6 is then performed on the circuit forming section and the inner walls of the holes H. The double films are formed, for example, by laminating a dry film 3' having plating resistivity or covering it with liquid photoresist, laminating a dry film 4' having catalyst resistance stability thereon or covering it with liquid photoresist, then exposing and developing the noncircuit section.
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公开(公告)号：JPS63262476A
公开(公告)日：1988-10-28
申请号：JP9605387
申请日：1987-04-17
申请人： MEIBAN KOGEI KK
发明人： HANAOKA MASAYUKI
摘要： PURPOSE:To improve the bonding strength of a metal layer to a substrate by forming a roughened surface having a required pattern on the substrate by physical etching and by forming the metal layer on the roughened surface by electroless plating. CONSTITUTION:A roughened surface 3 having a required pattern is formed on the pattern forming surface 2 of a substrate 1 of plastics of the like by physical etching. The substrate 1 is immersed in a soln. contg. a catalyst for electroless plating to stick a catalyst layer 4 on the roughened surface 3. The substrate 1 is then immersed in an electroless plating soln. to form a layer 5 of a metal such as Ni on the roughened surface 3. Thus, the metal layer 5 can be formed in an accurate pattern in few stages.
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公开(公告)号：JPS62207876A
公开(公告)日：1987-09-12
申请号：JP5204686
申请日：1986-03-10
发明人： NAKAO YUKIMICHI , KAERIYAMA KYOJI , SUDA MASAO , AOKI ISATAKA , MATSUI TOSHIKI , FUJIOKA KAZUO , IMAI TOMOYUKI
摘要： PURPOSE:To form a metallic film having superior adhesion on a molded body of polyvinylidene chloride by chemical plating by etching the surface of the molded body, treating it with palladium hyudrosol contg. a cationic surfactant and carrying out chemical plating. CONSTITUTION:A molded body of polyvinylidene chloride is immersed in an aqueous soln. of an alkali metallic hydroxide such as NaOH to etch the surface of the molded body. The molded body is then immersed in palladium hydrosol contg. a cationic surfactant such as a quat. ammonium salt type surfactant to stick palladium colloid to the surface of the molded body and the molded body is chemically plated with a metal such as Ni, Co, Cu or Ag. By this method, a metallic film having superior adhesion can be formed on the surface of the molded body by chemical plating with high reproducibility.
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公开(公告)号：JPS6235475B2
公开(公告)日：1987-08-01
申请号：JP17783480
申请日：1980-12-16
申请人： MITSUBISHI RAYON CO
发明人： TERAKUBO HITOSHI
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公开(公告)号：JPS62164884A
公开(公告)日：1987-07-21
申请号：JP692986
申请日：1986-01-16
发明人： NEMOTO YOUSUI , NAKANISHI TOMOAKI
摘要： PURPOSE:To produce a substrate for chemical plating used for a printed circuit board by forming a resin layer contg. dispersed alumina hydrate or silica particles of a specified particle size on the surface of a plate- or film-shaped body, exposing the particles and chemically dissolving the exposed particles. CONSTITUTION:A resin soln. contg. dispersed alumina hydrate or silica particles of 0.5-30mum average particle size is sprayed on the surface of a plate- or film-shaped body to form a resin layer. The particles in the resin layer are exposed by polishing with sandpaper or by sandblast and the exposed particles are chemically dissolved. In case of alumina hydrate, an aqueous alkali soln. is used. In case of silica, hydrofluoric acid is used.
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