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公开(公告)号：JP5332775B2
公开(公告)日：2013-11-06
申请号：JP2009066050
申请日：2009-03-18
Applicant: 富士通株式会社
IPC: H01L21/60
CPC classification number: H01L2224/16 , H01L2224/16225 , H01L2224/81903 , H01L2224/83951 , H01L2924/351 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component having a semiconductor element mounted on a circuit board and a method of manufacturing the component which make it possible to effectively reduce a stress applied from the circuit board to the semiconductor element while maintaining a contact connection between the circuit board and the semiconductor element. SOLUTION: The electronic component includes a substrate 30, and a substrate 10 formed on the substrate 30 and connected electrically to the substrate 30 by means of a protruding terminal. The protruding terminal includes a bundle 20 of linear structures of carbon element having a conductive film 22 on an end portion facing the substrate 30, and a bundle 34 of linear structures of carbon element having a conductive film on an end portion facing the substrate 10. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供一种具有安装在电路板上的半导体元件的电子部件和制造该部件的方法，其可以有效地减少从电路板施加到半导体元件的应力，同时保持 电路板与半导体元件之间的接触连接。 解决方案：电子部件包括基板30和形成在基板30上并通过突出端子与基板30电连接的基板10。 突出端子包括在面向基板30的端部上具有导电膜22的碳元素的线状结构的束20以及在面向基板10的端部上具有导电膜的碳元素的线状结构的束34。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP3469093B2
公开(公告)日：2003-11-25
申请号：JP19322698
申请日：1998-07-08
Applicant: 富士通株式会社
Inventor： 浩三 清水
IPC: H01L21/60
CPC classification number: H01L2224/16225 , H01L2924/13091 , H01L2924/00
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4.发明专利
公开(公告)号：JP5083000B2
公开(公告)日：2012-11-28
申请号：JP2008099753
申请日：2008-04-07
Applicant: 富士通株式会社
CPC classification number: H01L2224/16225 , H01L2224/81385
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公开(公告)号：JP4904710B2
公开(公告)日：2012-03-28
申请号：JP2005099887
申请日：2005-03-30
Applicant: 富士通株式会社
Inventor： 浩三 清水
IPC: H01L21/60
CPC classification number: H01L2224/1147 , H01L2224/13109 , H01L2924/01322
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6.发明专利
公开(公告)号：JP4888096B2
公开(公告)日：2012-02-29
申请号：JP2006332123
申请日：2006-12-08
Applicant: 富士通株式会社
Inventor： 浩三 清水
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L2224/16225 , H01L2224/81 , H01L2924/00011 , H01L2924/01322 , H01L2224/81805
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公开(公告)号：JP5292772B2
公开(公告)日：2013-09-18
申请号：JP2007296600
申请日：2007-11-15
Applicant: 富士通株式会社
CPC classification number: H01L23/373 , H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component which mounts a packaged semiconductor chip on a mounting board and which can easily remove a semiconductor chip being found to have initial failure. SOLUTION: A first pad (2) is formed on the surface of a first substrate (1). A metal film (3) is arranged on the surface of the first pad (2). A second substrate (6) is so arranged that it is opposed to the surface of the first substrate (1) on which the first pad (2) is formed. A second pad (7) is formed on the surface of the second substrate (6) which is opposed to the first pad (2). Ends of one side of conductive nanotubes (8) are connected with the second pad (7) and their ends of the other side are embedded in the metal film (3). An intermediate film (9) which is made of a conductive compound including at least one constituent element of the nanotubes (8) and at least one constituent element of the first pad (1) is arranged at the interface between the metal film (3) and the nanotubes (8). COPYRIGHT: (C)2009,JPO&INPIT
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公开(公告)号：JP5187148B2
公开(公告)日：2013-04-24
申请号：JP2008290200
申请日：2008-11-12
Applicant: 富士通株式会社
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
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10.发明专利
公开(公告)号：JP4684439B2
公开(公告)日：2011-05-18
申请号：JP2001061326
申请日：2001-03-06
Applicant: 富士通株式会社
IPC: B22F1/02 , C08K3/08 , B22F1/00 , C08L101/00 , C09J9/02 , C09J201/00 , H01B1/02 , H01B1/22 , H01C7/00 , H01C17/065 , H01L23/373 , H05K3/32 , H05K3/34
CPC classification number: H01B1/22 , H01B1/02 , H01C7/005 , H01C7/008 , H01C17/06526 , H01C17/06586 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/01322 , H05K3/321 , H05K3/3484 , H05K2201/0218 , H05K2203/0425 , Y10T428/2982 , Y10T428/2991
