Optical receiver module and an optical receiver
    1.
    发明专利

    公开(公告)号:JP5378915B2

    公开(公告)日:2013-12-25

    申请号:JP2009200507

    申请日:2009-08-31

    摘要: PROBLEM TO BE SOLVED: To provide a technology capable of improving frequency characteristics without damaging assembling workability in a light-receiving module. SOLUTION: A base of a light-receiving module includes a stepped part connecting a lower-stage surface, a rising surface and an upper-stage surface in this order, and a width of a top face is shorter than that of an underside and film wiring for a reference voltage arranged extensively over the top face and a front and wiring for a signal voltage are positioned in a carrier disposing a photo-detector. The carrier is arranged along the lower-stage surface and the rising surface and a preamplifier is disposed on the upper-stage surface. COPYRIGHT: (C)2011,JPO&INPIT

    摘要翻译: 要解决的问题:提供能够改善频率特性而不损害光接收模块中的组装可操作性的技术。 解决方案:光接收模块的基座包括依次连接下级表面,上升表面和上级表面的阶梯部分,并且顶面的宽度比 用于参考电压的底面和薄膜布线,其布置在顶面上,前端和信号电压的布线位于布置光检测器的载体中。 载体沿着下层表面和上升表面布置,并且前置放大器设置在上级表面上。 版权所有(C)2011,JPO&INPIT

    Electronics
    4.
    发明专利
    Electronics 有权
    空值

    公开(公告)号:JP5358472B2

    公开(公告)日:2013-12-04

    申请号:JP2010023591

    申请日:2010-02-04

    IPC分类号: H01L23/12

    摘要: PROBLEM TO BE SOLVED: To provide an electronic device more reducing an inductance of wiring for grounding a semiconductor element than ever. SOLUTION: The device includes the semiconductor element 10, and a grounding table 14 connected with the semiconductor element 10 via the wiring to ground the semiconductor element 10. The grounding table 14 has a height with which a difference between a value of the length of the wiring connecting the semiconductor element 10 with the grounding table 14 and a threshold value is held in a predetermined range. COPYRIGHT: (C)2011,JPO&INPIT

    摘要翻译: 要解决的问题:为了提供一种电子器件,其比以往更多地减少用于使半导体元件接地的布线的电感。 解决方案:该装置包括半导体元件10以及通过布线与半导体元件10连接以将半导体元件10接地的接地台14.接地台14具有高度, 将半导体元件10与接地台14连接的配线的长度和阈值保持在预定范围内。 版权所有(C)2011,JPO&INPIT

    Flexible printed circuit board, and the optical signal transmission equipment

    公开(公告)号:JP5349003B2

    公开(公告)日:2013-11-20

    申请号:JP2008275199

    申请日:2008-10-27

    IPC分类号: H01S5/022 H05K1/02

    摘要: PROBLEM TO BE SOLVED: To reduce noise generated owing to resonance between a conductor for transmitting signals and other signal patterns while maintaining flexibility. SOLUTION: The flexible printed substrate includes a dielectric layer 100, the strip conductor 106 formed on one surface of the dielectric layer 100 to transmit signals, a ground conductor 108 formed on the other surface of the dielectric layer 100 and opposed to the strip conductor 106 with the dielectric layer 100 interposed, and a resistance film 110 provided opposite the strip conductor 106 with the ground conductor 108 interposed. COPYRIGHT: (C)2010,JPO&INPIT