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公开(公告)号：JP5346607B2
公开(公告)日：2013-11-20
申请号：JP2009023765
申请日：2009-02-04
Applicant: 日立電線株式会社
IPC: H01R4/02 , B23K35/22 , B23K35/26 , B23K35/28 , C22C13/00 , C22C18/00 , C22C18/04 , C22C20/00 , H01B13/00 , H01R4/18
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive terminal of high connection strength, capable of reducing connection resistance between conductor wires and connection resistance between a conductor and the terminal, and to provide a method of connecting the terminal and an electric wire. SOLUTION: The terminal 1 includes a bonding part 4 for electric connection by bonding to the conductor 3 of the electric wire 2, and a contact part 5 for electric connection by contact with a mating terminal formed integrally with the bonding part 4, the bonding part 4 has a fusible bonding layer 6 molten at a prescribed temperature, on a face bonded to the conductor 3 of the electric wire 2, and has a base material layer 7 not molten at the temperature, on an opposite face of the fusible bonding layer 6, and the fusible bonding layer 6 is compositely integrated preliminarily with the base material layer 7. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5077416B2
公开(公告)日：2012-11-21
申请号：JP2010235269
申请日：2010-10-20
Applicant: 日立電線株式会社
IPC: C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B5/08 , H01B7/00 , H01B11/00 , H01B11/18
Abstract: A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.
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公开(公告)号：JP4785155B2
公开(公告)日：2011-10-05
申请号：JP2011058681
申请日：2011-03-17
IPC: C22C9/00 , C22B15/14 , C22F1/00 , C22F1/02 , C22F1/08 , H01B1/02 , H01B5/02 , H01B5/08 , H01B7/00 , H01B7/17 , H01B11/18 , H01B11/20 , H01B13/00
Abstract: PROBLEM TO BE SOLVED: To provide a dilute copper alloy wire rod having high productivity and excellent conductivity, softening temperature and surface quality. SOLUTION: The dilute copper alloy wire is obtained by carrying out cold wire-drawing of the wire rod manufactured by a continuous casting and rolling process using copper alloy material comprising 2-12 mass ppm of sulfur, 2-30 mass ppm of oxygen, 4-55 mass ppm of titanium, and a balance consisting of copper as a base material, wherein the conductivity of the wire rod when cold-drawn by 90% working ratio is 98% IACS (International Annealed Copper Standard) and semi-softening temperature is 130-148°C. COPYRIGHT: (C)2011,JPO&INPIT
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公开(公告)号：JP5356974B2
公开(公告)日：2013-12-04
申请号：JP2009244777
申请日：2009-10-23
Applicant: 日立電線株式会社
IPC: B22D11/04 , B22D11/00 , B22D11/124 , B22D11/20 , C22C9/00
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive casting material by a continuous casting method (up casting process), to provide a copper wire for a magnet wire obtained by subjecting the same to wire drawing, and to provide a magnet wire. SOLUTION: Regarding the casting material produced by performing continuous pulling-up from the molten metal of copper and a copper alloy through a casting die, the crystal size of the crystal structure of the casting material 22 is 200 to 300 μm, and also, the crystal size to a depth of 500 μm from the surface is 20 to 200 μm. The copper wire 2 for a magnet wire uses the same, and a magnet wire 1 is obtained therefrom. COPYRIGHT: (C)2010,JPO&INPIT
