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1.发明专利Electronic circuit component mounting structure and manufacturing method thereof 审中-公开电子电路组件安装结构及其制造方法公开(公告)号：JP2009071071A
公开(公告)日：2009-04-02
申请号：JP2007238524
申请日：2007-09-13
Applicant: Denso Corp , 株式会社デンソー
Inventor： YASUDA AKIO , YOSHINO MUTSUMI
CPC classification number: H05K1/0263 , H01L2924/0002 , H05K1/056 , H05K1/144 , H05K3/202 , H05K3/3447 , H05K2201/0397 , H05K2201/10272 , H05K2201/10409 , H05K2201/10689 , H05K2201/10757 , Y10T29/49117 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit component mounting structure that excellently absorbs thermal stress based upon the difference in coefficient of linear expansion between a printed circuit board and a bus bar. SOLUTION: The bus bar 3A is fixed onto the board with an insulating sheet interposed, and a resin mold IC is joined to the bus bar 3A. The bus bar 3A has a parallel main portion 31 extending in an X direction and a bent end portion 32 bent from the tip of the parallel main portion 31 to reach the printed circuit board 6 and having its tip soldered to the printed circuit board 6. The bent end portion 32 has a first bend portion whose thickness direction matches the X direction, i.e. the length direction of the parallel main portion 31 of the bus bar 3A and a second bend portion whose thickness direction matches a Y direction, i.e. the width direction of the parallel main portion 31 of the bus bar 3A. Consequently, the thermal stress based upon the difference in coefficient of linear expansion between the printed circuit board and bus bar can excellently be absorbed, thereby improving the temperature cycle life of a soldering portion between the printed circuit board 6 and bus bar 3. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种基于印刷电路板和汇流条之间的线性膨胀系数差异优异地吸收热应力的电子电路部件安装结构。 解决方案：母线3A被固定在板上，绝缘片被插入，并且树脂模具IC接合到汇流条3A。 汇流条3A具有沿X方向延伸的平行主体部分31和从平行主体部分31的顶端弯曲的弯曲端部32，以到达印刷电路板6并且其顶端焊接到印刷电路板6。 弯曲端部32具有厚度方向与X方向一致的第一弯曲部，即母线3A的平行主体31的长度方向和厚度方向与Y方向一致的第二弯曲部，即宽度方向 的母线3A的平行主要部分31。 因此，基于印刷电路板和母线之间的线膨胀系数的差异的热应力可以被极好地吸收，从而提高印刷电路板6和母线3之间的焊接部分的温度循环寿命。
版权所有（C）2009，JPO＆INPIT
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2.发明专利
公开(公告)号：JP2007222907A
公开(公告)日：2007-09-06
申请号：JP2006047035
申请日：2006-02-23
Applicant: Denso Corp , 株式会社デンソー
Inventor： YAMAZAKI MASASHI , YOSHINO MUTSUMI , KAWAMOTO YASUNORI
CPC classification number: B23K1/0056 , H05K3/3494 , H05K2201/0108 , H05K2203/107
Abstract: PROBLEM TO BE SOLVED: To joint wiring members with solder through a cover. SOLUTION: A bus bar 1 and a bus bar 2 overlapping each other are solder-jointed with irradiation of a laser beam spot 6 through a laser beam transmissive cover 3. Solder 5 is filled into a hole part 4 of the bus bar 1 located on the laser beam irradiation side in the thickness direction of the bus bars 1, 2, and a solder fillet is formed on an inner circumferential surface of the hole part 4 after the solder-jointing. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：通过盖将焊料接合在一起。 解决方案：通过激光束透射罩3将激光束点6的照射焊接在一起，彼此重叠的母线1和母线2被焊接。焊料5被填充到母线的孔部分4中 1位于母线1,2的厚度方向上的激光束照射侧，在焊接后在孔部4的内周面上形成焊锡圆角。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007158126A
公开(公告)日：2007-06-21
申请号：JP2005352664
申请日：2005-12-06
Applicant: Denso Corp , 株式会社デンソー
Inventor： YAMAZAKI MASASHI , YOSHINO MUTSUMI
CPC classification number: H05K7/142 , H05K3/202 , H05K3/341 , H05K2201/091 , H05K2201/10598 , H05K2203/175 , Y10T29/49144
Abstract: PROBLEM TO BE SOLVED: To provide electronic equipment using a bus bar whose current capacity is large and its manufacturing method for securing high heat radiating performance, for increasing the design flexibility of a circuit pattern, for configuring a large-scale circuit, and for achieving low-cost manufacturing. SOLUTION: A plurality of wiring metallic boards k worked into a predetermined pattern are arranged within the same plane, and a circuit 100k is configured. A plurality of electronic components D are soldered to the wiring metal boards k, and mounded on a wiring circuit 100k so that electronic equipment 100 can be configured. A resin case 100j, to which a plurality of wiring metallic boards k are fixed, is configured of a plate-shaped part jp, and a pillar-shaped part jc projecting from the plate-shaped part jp. The plurality of wiring metallic boards k are fixed to the pillar-shaped part jp of the resin case 100j, and the same plane, configured with the plurality of wiring metal boards k, is isolated from the plate-shaped part jp of the resin case 100j so that the electronic equipment 100 can be configured. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：为了提供使用电流容量大的母线的电子设备及其用于确保高散热性能的制造方法，为了增加电路图案的设计灵活性，用于配置大规模电路， 并实现低成本制造。 解决方案：在同一平面内布置多个预定图案的布线金属板k，并配置电路100k。 多个电子元件D被焊接到布线金属板k上，并且堆叠在布线电路100k上，从而可以配置电子设备100。 固定有多个布线金属板k的树脂壳体100j由板状部jp和从板状部jp突出的柱状部jc构成。 多个配线用金属板k固定在树脂外壳100j的柱状部jp上，与该多个布线用金属板k相同的平面与树脂外壳的板状部jp隔离 100j，从而可以配置电子设备100。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2009071068A
公开(公告)日：2009-04-02
申请号：JP2007238439
申请日：2007-09-13
Applicant: Denso Corp , 株式会社デンソー
Inventor： YASUDA AKIO , YOSHINO MUTSUMI
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component bus bar joining structure which has excellent reliability to a temperature cycle and is easy to manufacture. SOLUTION: Terminals 4 on both sides of an electronic circuit component are joined to bus bars 3A and 3B with solder 6. The bus bar 3A is supported on a substrate 2 with a screw 7A; and the bus bar 3B is supported with a screw 7B. The screw 7B penetrates a long hole 9 which is long in the longitudinal direction of the bus bar 3B to be fastened to the female screw hole 21 of the substrate. Consequently, the solder 6 is prevented from being broken with stress in the longitudinal direction of the bus bar 3 produced because of differences in coefficient of linear expansion between the bus bars 3A and 3B and the substrate 2. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种具有优异的温度循环可靠性并且易于制造的电子部件汇流条接合结构。 解决方案：电子电路部件两侧的端子4用焊料6连接到汇流条3A和3B上。母线3A用螺钉7A支撑在基板2上; 母线3B由螺钉7B支撑。 螺杆7B穿过在母线3B的长度方向上较长的长孔9，以固定到衬底的内螺纹孔21。 因此，由于母线3A和3B与衬底2之间的线膨胀系数不同，所以阻止焊料6在母线3的长度方向上的应力断裂。（C） 2009年，JPO＆INPIT
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公开(公告)号：JP2009060038A
公开(公告)日：2009-03-19
申请号：JP2007228083
申请日：2007-09-03
Applicant: Denso Corp , 株式会社デンソー
Inventor： YASUDA AKIO , YOSHINO MUTSUMI
IPC: H05K1/18
CPC classification number: H05K3/3421 , H05K1/056 , H05K1/111 , H05K3/202 , H05K3/4092 , H05K2201/0382 , H05K2201/0397 , H05K2201/10272 , Y02P70/611 , Y02P70/613
Abstract: PROBLEM TO BE SOLVED: To provide an easy-to-manufacture electronic component bus bar bonding structure excellent in reliability to a cold cycle. SOLUTION: A bus bar 3 bonded to the distal end 41 of the lead terminal 4 of an electronic circuit component by solder 6 is provided with wall parts 31 and 32 solder-bonded to the side face of the distal end 41 of the lead terminal 4. The solder 6 is thereby prevented from being damaged caused by stress in the longitudinal direction of the bus bar 3 generated by difference in a linear expansion coefficient between a substrate 2 and the bus bar 3. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为冷循环提供可靠性优异的易于制造的电子元件母线棒结合结构。 解决方案：通过焊料6接合到电子电路部件的引线端子4的远端41的汇流条3设置有焊接到端子41的侧面41上的壁部31和32 引线端子4.由此可以防止焊料6由于基板2和母线3之间的线膨胀系数的差异而产生的母线3的纵向应力引起的损坏。 ）2009，JPO＆INPIT
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公开(公告)号：JP2008135691A
公开(公告)日：2008-06-12
申请号：JP2007148377
申请日：2007-06-04
Applicant: Denso Corp , 株式会社デンソー
Inventor： YAMAZAKI MASASHI , YOSHINO MUTSUMI
CPC classification number: H05K3/3421 , H01L23/49551 , H01L23/49575 , H01L23/49582 , H01L2924/0002 , H05K3/202 , H05K3/3463 , H05K2201/10689 , Y02P70/613 , Y10T29/49002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board of which the electronic component can be surely soldered to a wiring metal plate, without forming a solder sticking preventive layer, for a suppressed cost. SOLUTION: A wiring board 1 comprises electronic components 2-4, wiring metal plates 5-12, and a solder 13. On the surfaces of the wiring metal plates 5-12, a plating layer of Ni is formed. The solder 13 is a Pb free solder. Here, a solder contact angle which is an index representing solder wetting is within 40°-45° range. Thus, a good fillet can be formed for sufficient jointing strength. So, the electronic components 2-4 are surely soldered to the wiring metal plates 5-12, with no solder sticking preventive layer of solder resist and resin required to be formed. Thus, the cost of the wiring board 1 is suppressed. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种能够将电子部件可靠地焊接到布线金属板而不形成防止粘着阻止层的布线板，从而成本降低。 解决方案：布线板1包括电子部件2-4，布线金属板5-12和焊料13.在布线金属板5-12的表面上形成有Ni的镀层。 焊料13是无铅焊料。 这里，作为表示焊料润湿的指标的焊料接触角在40°-45°范围内。 因此，可以形成良好的圆角以获得足够的接合强度。 因此，电子部件2-4被确实地焊接到布线金属板5-12上，不需要形成阻焊剂和树脂的阻焊层。 因此，抑制了布线板1的成本。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008098559A
公开(公告)日：2008-04-24
申请号：JP2006281307
申请日：2006-10-16
Applicant: Denso Corp , 株式会社デンソー
Inventor： NISHIMURA TOSHIRO , YAMAZAKI MASASHI , YOSHINO MUTSUMI
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor mounting structure and its mounting method, capable of mounting a semiconductor component on a bus bar and a cooling metal substrate while suppressing complication of mounting work.
SOLUTION: A semiconductor component 1 is placed on bus bars 2, 3 and is connected thereto. The bus bars 2, 3 are mounted on a cooling metal substrate 4 via an electric insulating sheet 5. A resin made nail shaped body 8 penetrates through holes of the bus bars 2, 3 and the electric insulating sheet 5 and is collectively pressed into a bottomed hole 41 of the cooling metal substrate 4. Hereby, the bus bars 2, 3 are fixed while being electrically insulated to the cooling metal substrate 4 by a bar-shaped resin member 9.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：为了提供半导体安装结构及其安装方法，能够在抑制安装作业的复杂性的同时将半导体部件安装在汇流条和冷却金属基板上。 解决方案：将半导体部件1放置在汇流条2,3上并与之连接。 汇流条2,3通过电绝缘片5安装在冷却金属基板4上。制成钉状体8的树脂穿过汇流条2,3和电绝缘片5的孔，并被一体地压入 通过棒状树脂部件9，汇流条2,3固定在与冷却金属基板4电绝缘的状态下。（C）2008，JPO＆INPIT
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公开(公告)号：JPH11346460A
公开(公告)日：1999-12-14
申请号：JP31468898
申请日：1998-11-05
Applicant: DENSO CORP
Inventor： KIYOSE KENZO , EBIHARA YOSHIO , YAMASHITA KEIICHI , YOSHINO MUTSUMI , SAKAMOTO ZENJI
Abstract: PROBLEM TO BE SOLVED: To provide a commutator which can positively electrically connect a contact member an a terminal member and can position both of the members easily and also provide a fuel pump using such a commutator, and a method for manufacturing the commutator. SOLUTION: A commutator 50 is constituted of eight segments which are electrically insulated from each other by means of radial grooves 61, and each segment is constituted of a contact member 51 which brushes by a brush and a terminal member 53. A base metal of a contact members 51 before being divided by the grooves 61 has on the inner side an annular projection projecting toward a rotary shaft of the commutator. In an assembled state of the base metal of the contact members 53 and a base metal of the terminal members before filling in spaces between the contact members 51 and the terminal members 53 with connection material 57, the outer surface of the projection formed in the base metal of the contact members and the inner surface of the base metal of the terminal members surrounding the outer surface of the base metal of the contact members are in contact at several places, thereby allowing the contact members and the terminal members only to rotate. Since the base metal of the contact members and that of the terminal members can be assembled, without adjusting a space between the outer surface of the projection of the base metal of the cost members and the inner surface of the base metal of the terminal members, the number of manufacturing processes can be reduced.
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公开(公告)号：JPH10112581A
公开(公告)日：1998-04-28
申请号：JP15850697
申请日：1997-06-16
Applicant: DENSO CORP
Inventor： TAKEMOTO MASANORI , OSHIRO MASARU , AOYAMA MASAYUKI , KONDO KENJI , YOSHINO MUTSUMI
Abstract: PROBLEM TO BE SOLVED: To make possible soldering of all the leads of an electronic component by surely absorbing the variations of its leads, even when there exist the variations in the heights of its leads for its soldering to a board. SOLUTION: Interposing an adsorbent between an electronic part 100, its main body 101 and a board 200, the viscosity of the adsorbent is made reductive when heating the solder. That is, in the case of soldering, expanding the adsorbent along the whole surface of the board 200 and electronic component 100, as a result, the electronic component 100 is attracted to the side of the board 200 by the capillary force of the adsorbent to deform leads 102 by this attractive force and absorb the variations in the heights of the leads 102.
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公开(公告)号：JP2003266181A
公开(公告)日：2003-09-24
申请号：JP2002070483
申请日：2002-03-14
Applicant: DENSO CORP
Inventor： OMI YOSHINORI , KIKUCHI ATSUO , YOSHINO MUTSUMI
IPC: B23K20/12
Abstract: PROBLEM TO BE SOLVED: To provide a friction stir welding method that can prevent welding deformation due to a compression residual stress caused on both sides of a weld zone of the two members to be welded, by offsetting this stress timewise or spacewise. SOLUTION: This is a welding method in which a pin of the revolving tool is abutted on the weld zone 10 of the members 1, 2 to be joined, the contact part is softened by a frictional heat, and welding is performed by moving the tool while the contact part is stirred. The part once joined by the rotating first tool 5 is allowed to be joined again by using a second tool smaller than the first and rotating it opposite to the rotating direction of the first tool. As a result, the residual stress 20a caused by the first tool can be offset by the residual stress 20b caused by the second tool. COPYRIGHT: (C)2003,JPO
