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    Joining device and joining method
    1.
    发明专利
    Joining device and joining method 有权
    加工设备和接合方法

    公开(公告)号：JP2014191251A

    公开(公告)日：2014-10-06

    申请号：JP2013067995

    申请日：2013-03-28

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： YAMAGAMI TAKATOYO ,  KUBOTA TAKASHI ,  KIRA HIDEHIKO

    IPC: G02B6/42 ,  B29C65/52 ,  G02B6/122 ,  H01L31/0232 ,  H01S5/022

    CPC classification number: B32B37/12 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4221 ,  G02B6/4239

    Abstract: PROBLEM TO BE SOLVED: To provide a joining device and a joining method, capable of accurately joining components with each other in a short time by using a photo-curing adhesive.SOLUTION: The joining device includes a light source 36, a stage 31, a component holding part 34 made of a light transmissive material, a control part 40, and driving parts 32 and 35 controlled by the control part 40, to drive the stage 31 and the component holding part 34. The component holding part 34 includes an incident surface on which light outputted from the light source 36 is made incident, a first reflecting surface being a surface opposite to the incident surface and reflecting the light made incident from the incident surface, a second reflecting surface reflecting the light reflected by the first reflecting surface, and an emission surface from which the light reflected by the second reflecting surface is emitted. The joining device joins a first component 17 and a second component 15 by the photo-curing adhesive, in such a state that the second component 15 is held on the emission surface side of the component holding part 34.

    Abstract translation: 要解决的问题：提供一种接合装置和接合方法，其能够通过使用光固化粘合剂在短时间内精确地接合部件。解决方案：接合装置包括光源36，台31， 由透光材料制成的部件保持部分34，控制部分40和由控制部分40控制的驱动部分32和35，以驱动平台31和部件保持部分34.部件保持部分34包括事件 从光源36输出的光入射的表面，与入射面相反的面，反射从入射面入射的光的第一反射面，反射由第一反射面反射的光的第二反射面 以及发射由第二反射面反射的光的发射面。 接合装置以第二部件15保持在部件保持部34的出射面侧的状态通过光固化型粘合剂与第一部件17和第二部件15接合。

    Optical unit and method for manufacturing the same
    3.
    发明专利
    Optical unit and method for manufacturing the same 审中-公开
    光学单元及其制造方法

    公开(公告)号：JP2014063062A

    公开(公告)日：2014-04-10

    申请号：JP2012208766

    申请日：2012-09-21

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： YAMAGAMI TAKATOYO ,  KUBOTA TAKASHI ,  KITAJIMA MASAYUKI

    IPC: G02B6/42

    CPC classification number: G02B6/12 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43 ,  Y10T29/49124

    Abstract: PROBLEM TO BE SOLVED: To provide a highly reliably optical unit capable of easily and accurately controlling a region to which a packing material is applied, and forming a void between an optical component and a base material in a desired state to surely secure both low light loss and electrode joint reliability, and a method for manufacturing the optical unit.SOLUTION: An optical unit in which an optical component 10 having an optical element 12 is loaded on a base material 20 having an optical waveguide 21 includes: a first hydrophobic region 14 formed in a site including the optical axis of the optical component 10; a second hydrophobic region 24 formed in a site facing the first region 14 on the surface of the base material 20; and a hydrophilic packing material 4 for packing the periphery of the first region 14 and the second region 24 between the optical component 10 and the base material 20.

    Abstract translation: 要解决的问题：为了提供一种高可靠性的光学单元，其能够容易且精确地控制施加包装材料的区域，并且在所需状态下在光学部件和基材之间形成空隙，以确保两个低光 损失和电极接合可靠性以及光学单元的制造方法。其中，具有光学元件12的光学部件10装载在具有光波导21的基材20上的光学单元包括：第一疏水区域14 形成在包括光学部件10的光轴的位置; 形成在基材20的表面上面对第一区域14的部位的第二疏水区域24; 以及亲水性包装材料4，用于将第一区域14的周边和第二区域24的周边填充在光学部件10和基材20之间。

    Electronic device and method for manufacturing electronic device
    5.
    发明专利
    Electronic device and method for manufacturing electronic device 有权
    电子设备及制造电子设备的方法

    公开(公告)号：JP2009129094A

    公开(公告)日：2009-06-11

    申请号：JP2007301869

    申请日：2007-11-21

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： KOBAYASHI HIROSHI ,  KOYAE KENJI ,  KUBOTA TAKASHI

    IPC: G06K19/077 ,  G06K19/07 ,  H05K1/02 ,  H05K3/28

    CPC classification number: G06K19/07749 ,  G06K19/02 ,  G06K19/027 ,  G06K19/07728 ,  G06K19/07758 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1815 ,  Y10T428/2462 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic device which is durable to a bending stress and a method for manufacturing the electronic device for manufacturing the electronic device. SOLUTION: The electronic device includes: a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and a plurality of protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern, and projected in a direction away from the base sheet. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供耐弯曲应力的电子设备以及用于制造用于制造电子设备的电子设备的方法。 电解装置包括：基片; 形成在基片上的导电图案; 电路芯片，安装在基片上并连接到导电图案; 以及布置在所述基片的前侧和后侧中的至少一个上的多个突起，以与所述导电图案的至少一部分重叠并且沿远离所述基片的方向突出。 版权所有（C）2009，JPO＆INPIT

    Rfid tag
    6.
    发明专利
    Rfid tag 有权
    RFID标签

    公开(公告)号：JP2009116649A

    公开(公告)日：2009-05-28

    申请号：JP2007289394

    申请日：2007-11-07

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： KOBAYASHI HIROSHI ,  KOYAE KENJI ,  KUBOTA TAKASHI ,  KIRA HIDEHIKO

    IPC: G06K19/077 ,  G06K19/07

    CPC classification number: G06K19/07749 ,  G06K19/07728 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191

    Abstract: PROBLEM TO BE SOLVED: To provide an RFID tag with bending stress durability.
    SOLUTION: The RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有弯曲应力耐久性的RFID标签。 解决方案：RFID标签包括：片状基座; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面上，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比 天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。 版权所有（C）2009，JPO＆INPIT

    Adhesive filling sheet, electronic device manufacturing method, and its manufacturing apparatus
    7.
    发明专利
    Adhesive filling sheet, electronic device manufacturing method, and its manufacturing apparatus 审中-公开
    胶带填充片，电子装置制造方法及其制造装置

    公开(公告)号：JP2009049148A

    公开(公告)日：2009-03-05

    申请号：JP2007213218

    申请日：2007-08-20

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： TAKEUCHI SHUICHI ,  KOYAE KENJI ,  KUBOTA TAKASHI ,  KOBAYASHI HIROSHI

    IPC: H01L21/56 ,  H01L21/60

    CPC classification number: H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T29/4913 ,  Y10T29/5313 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive filling sheet which prevents a generation of void, attachment of an adhesive on the back of an electronic component, and a rising of the adhesive around a surrounding of the electronic component, at the same time, and also to provide an electronic device manufacturing method. SOLUTION: The electronic device manufacturing method includes processes of: coating an adhesive 5 to be filled in a space portion between a mounting substrate 2 and a mounted electronic component 3 on one side of a sheet 11; contacting the one side of the sheet 11 with the back of the electronic component 3 mounted on the mounting substrate 2, and contacting the adhesive 5 with the surrounding of the electronic component 3 to fill the space portion with the adhesive 5; and after returning from a reduced pressure to an atmospheric pressure in the state where the sheet 11 is contacted to the electronic component 3, pressing a heating head onto the other side of the sheet 11 to heat the electronic component 3 through the sheet 11 by the heating head and hardens the adhesive 5. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种胶粘剂填充片，其防止产生空隙，粘合剂在电子部件的背面上的附着以及围绕电子部件的周围的粘合剂的上升，同时 时间，并且还提供电子设备制造方法。 电子装置的制造方法包括以下工序：在片材11的一面上涂布填充在安装基板2和安装的电子部件3之间的空间部分的粘合剂5; 使片材11的一侧与安装在安装基板2上的电子部件3的背面相接触，并且使粘合剂5与电子部件3的周围接触，以将粘合剂5填满空间部分; 并且在片材11与电子部件3接触的状态下从减压返回到大气压之后，将加热头压在片材11的另一侧，以通过片材11加热电子部件3 加热头并硬化粘合剂5.版权所有（C）2009，JPO＆INPIT

    Bonding method of flying lead
    8.
    发明专利
    Bonding method of flying lead 审中-公开
    飞行接头联结方法

    公开(公告)号：JP2007173363A

    公开(公告)日：2007-07-05

    申请号：JP2005366342

    申请日：2005-12-20

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： KUBOTA TAKASHI ,  KOYAE KENJI ,  NAKAMURA KIMIYASU

    IPC: H01L21/607 ,  G11B21/02 ,  H01L21/60

    CPC classification number: H05K3/361 ,  G11B5/4846 ,  H05K3/328 ,  H05K2201/0397 ,  H05K2201/10765 ,  H05K2203/0285 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: PROBLEM TO BE SOLVED: To surely carry out the ultrasonic bonding of flying leads and substrate pads by securing bondability between the flying leads and the substrate pads when bonding the flying leads to the substrate pads. SOLUTION: In this bonding method of flying leads, the flying leads 18 are aligned with a plurality of substrate pads arranged in parallel, respectively, and then ultrasonic vibration is made to act on the flying leads 18 by a bonding tool 20 to bond the flying leads 18 to the corresponding substrate pads 17. The flying leads 18 are formed wider than the substrate pads 17. In bonding the flying leads 18 to the substrate pads 17, the flying leads 18 are first aligned with the substrate pads 17, and then the flying leads 18 are pressed against the substrate pads 17 by the bonding tool 20. Finally, ultrasonic vibration is made to act on the flying leads 18 to bond the flying leads and the substrate pads. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：通过在将飞行引线接合到基板焊盘的同时确保飞行引线和基板焊盘之间的可焊接性，可靠地进行飞行引线和基板焊盘的超声波接合。 解决方案：在这种飞行引线的接合方法中，飞行引线18分别与并联布置的多个基板焊盘对齐，然后超声波振动通过焊接工具20作用到飞行引线18上 将飞行引线18结合到相应的衬底焊盘17.飞行引线18形成为比衬底焊盘17更宽。在将飞行引线18接合到衬底焊盘17时，首先将引线18与衬底焊盘17对准， 然后通过接合工具20将飞行引线18压靠在衬底焊盘17上。最后，使超声波振动作用于飞行引线18，以将飞行引线和衬底焊盘接合。 版权所有（C）2007，JPO＆INPIT

    Carriage assembly of hard disk drive, and its manufacturing method
    10.
    发明专利
    Carriage assembly of hard disk drive, and its manufacturing method 有权
    硬盘驱动器运输装配及其制造方法

    公开(公告)号：JP2006031768A

    公开(公告)日：2006-02-02

    申请号：JP2004206089

    申请日：2004-07-13

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： KOYAE KENJI ,  KUBOTA TAKASHI

    IPC: G11B21/21 ,  G11B5/60

    CPC classification number: G11B5/486 ,  G11B5/4833 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0285 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: PROBLEM TO BE SOLVED: To provide a carriage assembly of a hard disk drive, and its manufacturing method in which such problems never be caused that a flying lead is broken and resin residual is left on a junction terminal when the flying lead of a long tail suspension substrate is peeled off from a junction terminal of a flexible printed circuit board. SOLUTION: A flying lead 15a of a long tail suspension substrate 12 and a junction terminal 16a of a flexible printed circuit board 16 are joined by ultrasonic bonding in which a ultrasonic wave tool T is abutted from an opposite plane of a junction plane of the flying lead 15a for the junction terminal 16a and ultrasonic wave vibration is applied from the ultrasonic wave tool T in a state in which the flying lead 15a is pressed to the junction terminal 16a, coating layers 24 consisting of hot-melt metal melted at a lower temperature than a material constituting the junction plane are formed respectively on the opposite plane of each flying lead 15a. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种硬盘驱动器的托架组件及其制造方法，其中不会导致这样的问题，即，当飞铅引导断开并且树脂残留物留在接线端子上时， 从柔性印刷电路板的接线端子剥离长尾悬挂基板。 解决方案：长尾悬挂基板12的飞线引线15a和柔性印刷电路板16的接线端子16a通过超声波接合来接合，超声波焊接工具T从连接平面的相对平面邻接 在飞溅引线15a被压到连接端子16a的状态下，从超声波工具T施加用于接合端子16a的飞行引线15a和超声波振动，由热熔融金属熔化的涂层24 分别在每个飞行引线15a的相对平面上形成比构成结面的材料低的温度。 版权所有（C）2006，JPO＆NCIPI

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