公开(公告)号：JP5353614B2

公开(公告)日：2013-11-27

申请号：JP2009232282

申请日：2009-10-06

Applicant: 日立化成株式会社

Inventor： 英博 中村

IPC: H01R12/72 ,  H01R24/60 ,  H01R43/00

CPC classification number: H05K1/142 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09781 ,  H05K2201/10681 ,  Y10T156/10

Abstract: A wiring board insertion connector having only a small restriction on the structure of a wiring board to be inserted to the connector and high connection reliability includes a first substrate; a second substrate; a spacer layer that is located between the first substrate and the second substrate; and openings for accommodating a wiring board at predetermined positions in the spacer layer. The first substrate has a wiring layer, a deformable layer, a rigid layer, and a resin layer formed in this order from the side of the spacer layer. The rigid layer has window portions formed at the regions corresponding to the openings, when seen from a thickness direction of the connector. The wiring layer extends at least to the regions corresponding to the window portions when seen from the thickness direction of the connector, the wiring layer protruding toward opening regions at the window portions.

公开(公告)号：JP5274938B2

公开(公告)日：2013-08-28

申请号：JP2008220245

申请日：2008-08-28

Applicant: シャープ株式会社

Inventor： 智 久戸瀬

IPC: B65D85/86 ,  B65H75/10

CPC classification number: B65D85/672 ,  B65H75/10 ,  B65H2701/37 ,  B65H2701/5122 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/0011 ,  H05K3/0097 ,  H05K3/28 ,  H05K2201/10681 ,  H05K2203/085 ,  H05K2203/086 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A method of at least one embodiment of the present invention for packing a TAB tape is a method in which the TAB tape is wound on a core reel so as to be packed, the TAB tape being a tape-shaped insulating film on which circuits are provided in a repeated manner, the circuits each of which is made up of metal wiring and a solder resist. In at least one embodiment, the method includes a first step of winding at least the TAB tape on an outer peripheral surface of a core reel having a cylindrical shape, the core reel having a shaft hole on its inner peripheral side. This makes it possible to provide (i) a method for packing a TAB tape which method makes it possible to reduce a packing size, and (ii) a smaller packing structure for a TAB tape.

公开(公告)号：JP4975584B2

公开(公告)日：2012-07-11

申请号：JP2007278310

申请日：2007-10-26

Applicant: ルネサスエレクトロニクス株式会社

Inventor： 千尋 佐々木 ,  靖昭 岩田

IPC: H01L23/12 ,  H01L23/36

CPC classification number: H01L23/4985 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/14 ,  H05K1/0209 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/10681 ,  H01L2924/00

公开(公告)号：JP2011176112A

公开(公告)日：2011-09-08

申请号：JP2010038893

申请日：2010-02-24

Applicant: Renesas Electronics Corp ,  ルネサスエレクトロニクス株式会社

Inventor： MATSUDA SATORU ,  YASUDA TSUKASA ,  MATSUMOTO ICHIRO

IPC: H01L21/60 ,  G09F9/00 ,  H01L23/12

CPC classification number: H01L23/24 ,  H01L21/563 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0281 ,  H05K2201/10681 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit having a semiconductor chip mounted to a tape-like or film-like substrate, and having higher strength against bending, and to provide a method of manufacturing the same.
SOLUTION: The semiconductor integrated circuit 1 includes: a bendable tape-like substrate 10 having external terminals, internal terminals connected to a rectangular semiconductor chip 20, and wiring 50 for connecting the internal terminals and the external terminals with each other; a semiconductor chip 20 electrically connected to the tape-like substrate 10; and a reinforcing member 30 for reinforcing the semiconductor chip 20 on the tape-like substrate 10 in a longitudinal direction. The semiconductor chip 20 and the reinforcing member 30 are sealed with resin 40.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种半导体集成电路，其具有安装在带状或薄膜状基板上的半导体芯片，并具有较高的抗弯强度，并提供其制造方法。 解决方案：半导体集成电路1包括：具有外部端子的可弯曲带状基板10，连接到矩形半导体芯片20的内部端子和用于将内部端子和外部端子彼此连接的布线50; 电连接到带状基板10的半导体芯片20; 以及用于在纵向上加强带状基板10上的半导体芯片20的加强构件30。 半导体芯片20和加强构件30用树脂40密封。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2009288774A

公开(公告)日：2009-12-10

申请号：JP2009081732

申请日：2009-03-30

Applicant: Lg Electronics Inc ,  エルジー エレクトロニクス インコーポレイティド

Inventor： YUM JUNGSUP ,  KO DONGKI

IPC: G09F9/00 ,  G02B5/00

CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2201/09827 ,  H05K2201/10681 ,  Y10T428/24331

Abstract: PROBLEM TO BE SOLVED: To provide a flexible film (flexible printed circuit) superior in safeness and reliability in which a hole is easily formed, and to provide a display device which has the film. SOLUTION: The flexible film relating to one embodiment includes: an insulating film including a hole, an inner circumference surface surrounding the hole, a first surface, and a second surface opposite to the first surface; and a metal layer covering the inner circumference surface and at least one of the first surface and the second surface and including a first layer and a second layer. The metal layer has a first region, located on the inner circumference surface and a second region located on the first surface or the second surface, with the second region having a thickness which is larger than that of the first region. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种安全性和可靠性优异的可容易地形成孔的柔性膜（柔性印刷电路），并提供具有该膜的显示装置。 ＆lt; P＆gt;解决方案：涉及一个实施例的柔性膜包括：绝缘膜，包括孔，围绕孔的内周表面，第一表面和与第一表面相对的第二表面; 以及覆盖所述内周面和所述第一表面和所述第二表面中的至少一个的金属层，并且包括第一层和第二层。 金属层具有位于内周面上的第一区域和位于第一表面或第二表面上的第二区域，第二区域的厚度大于第一区域的厚度。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009224478A

公开(公告)日：2009-10-01

申请号：JP2008066040

申请日：2008-03-14

Applicant: Oki Semiconductor Co Ltd ,  Okiセミコンダクタ株式会社

Inventor： KUNIMATSU DAISUKE ,  TAKAYANAGI TAKEHIRO

IPC: H01L23/12

CPC classification number: H05K1/111 ,  H01L2224/16 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10681 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To obtain a semiconductor chip package provided with a tape wiring circuit board for dealing with a semiconductor chip having many pads.
SOLUTION: A second output wire 16 and a third output wire 18 are extended into a chip mounting part 26 crossing a second side 26A and a third side 26D of the chip mounting part 26. The other end portions of the second output wire 16 and the third output wire 18 extended into the chip mounting part 26 are bent toward a fourth side 26B of the chip mounting part 26 and are connected to output pads 42 and 44 provided along the fourth side of a semiconductor chip 22. An input wire 20 is extended along the fourth side 26B of the chip mounting part 26, bent in the halfway thereof and extended into the chip mounting part 26 crossing the fourth side 26B of the chip mounting part 26, and is connected to an input pad 48 provided along the fourth side of the semiconductor chip 22. Accordingly, the tape wiring circuit board 24 can be provided corresponding to the semiconductor chip having many electrode pads.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：为了获得具有用于处理具有许多焊盘的半导体芯片的带布线电路板的半导体芯片封装。 解决方案：第二输出线16和第三输出线18延伸到与芯片安装部分26的第二侧26A和第三侧26D交叉的芯片安装部分26中。第二输出线的另一端部 16和延伸到芯片安装部26的第三输出线18朝向芯片安装部26的第四侧26B弯曲，并且连接到沿着半导体芯片22的第四侧设置的输出焊盘42和44。 20沿着芯片安装部26的第四侧26B延伸，在其一半弯曲并延伸到与芯片安装部26的第四侧26B交叉的芯片安装部26中，并且连接到沿着芯片安装部26设置的输入焊盘48 因此，可以对应于具有许多电极焊盘的半导体芯片来提供带状布线电路板24。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009135340A

公开(公告)日：2009-06-18

申请号：JP2007311627

申请日：2007-11-30

Applicant: Sharp Corp ,  シャープ株式会社

Inventor： KATO TATSUYA

IPC: H01L21/60 ,  G02F1/1345 ,  H01L23/36 ,  H01L23/40

CPC classification number: H01L23/4985 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/09781 ,  H05K2201/10681

Abstract: PROBLEM TO BE SOLVED: To provide a source driver increasing a heat radiating quantity, and also to provide a liquid crystal module. SOLUTION: The film mounted type source driver 100 is provided with: a semiconductor chip 105 having a plurality of connectable terminals with the outside are mounted on the surfaces of a film forming base material 107; an input terminal wiring region 101 having formed wiring connected with the input terminals of the semiconductor chip 105; an output terminal wiring region 102 having wiring connected with the output terminals of the semiconductor chip 105 are provided. Sprocket portions 103 each having a continuous hole sequence 106 and a copper foil formed on its surface are provided at both ends of the film forming base material 107, and the input terminal wiring region 101 and the output terminal wiring region 102 are so provided in opposite directions of each other as to be extended toward the side with no sprocket portion 103, and a thermal conduction pattern 104 for connecting the terminals of the semiconductor chip 105 except its input and output terminals with the copper foils of the sprocket portions 103 is formed. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供增加散热量的源极驱动器，以及提供液晶模块。 ＆lt; P＆gt;解决方案：胶片安装型源极驱动器100具有：在成膜基材107的表面上安装具有多个具有外部可连接端子的半导体芯片105; 具有与半导体芯片105的输入端子连接的形成布线的输入端子布线区域101; 设置具有与半导体芯片105的输出端子连接的配线的输出端子配线区域102。 在成膜基材107的两端设有各自具有连续的孔序列106和在其表面形成的铜箔的链轮部103，并且输入端子配线区域101和输出端子配线区域102设置成相反 彼此之间的方向相对于没有链轮部分103的侧面延伸，并且形成用于将除了其输入和输出端子之外的半导体芯片105的端子与链轮部分103的铜箔连接的导热图案104。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008258512A

公开(公告)日：2008-10-23

申请号：JP2007101287

申请日：2007-04-09

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： TSUNEKAWA MAKOTO

IPC: H01L21/60

CPC classification number: H05K3/0008 ,  H01L21/4839 ,  H01L23/49565 ,  H01L23/49582 ,  H01L23/544 ,  H01L24/80 ,  H01L2223/5442 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/28 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2203/1545 ,  H05K2203/166 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/4916

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a tape carrier for TAB capable of carrying out screen printing of solder resist with high precision while suppressing an increase in the number of steps and waste of material. SOLUTION: Positioning marks PM1 and PM2 are formed on both sides of each printing block 13 on the tape carrier 1 for TAB. In screen printing, a long-shaped circuit substrate 10 is transported by a roll-to-roll system. When an optical sensor detects the positioning mark PM1, the transport of the long-shaped circuit substrate 10 stops. Then, a screen printing device 100 carries out screen printing of solder resist on the printing blocks 13 of the long-shaped circuit substrate 10. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造能够以高精度执行阻焊剂丝网印刷的TAB的带载体的方法，同时抑制步骤数量的增加和材料的浪费。 解决方案：定位标记PM1和PM2形成在用于TAB的带载体1上的每个印刷块13的两侧。 在丝网印刷中，通过卷对卷系统输送长形状的电路基板10。 当光学传感器检测到定位标记PM1时，长形电路基板10的传送停止。 然后，丝网印刷装置100在长形电路基板10的印刷块13上进行阻焊剂的丝网印刷。版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP3915928B2

公开(公告)日：2007-05-16

申请号：JP2004339305

申请日：2004-11-24

Applicant: セイコーエプソン株式会社

Inventor： 宗英 西面

IPC: H01L21/60 ,  H05K1/02

CPC classification number: H05K1/118 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/0058 ,  H05K2201/09236 ,  H05K2201/09727 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0228 ,  H01L2924/00

公开(公告)号：JP3898891B2

公开(公告)日：2007-03-28

申请号：JP2000568124

申请日：1999-01-15

Applicant: スリーエム カンパニー

Inventor： ウィリアム・ジェイ・クラタノフ ,  ゲイル・アール・ティ・シューラー ,  ロバート・ジェイ・シューベルト ,  英明 安井 ,  英男 山崎 ,  裕輔 斎藤

IPC: H01L23/12 ,  H01L23/498 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/10681 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099