公开(公告)号：US08556385B2

公开(公告)日：2013-10-15

申请号：US12878306

申请日：2010-09-09

Applicant: Lynton R. Burchette

Inventor： Lynton R. Burchette

IPC: B41J2/14

CPC classification number: B41J2/1753 ,  B41J2/17546

Abstract: A replacement imaging chip includes a single row of contact pads adapted for engagement with an imaging device having rows and columns of contacts, the single row of contact pads disposed to contact the rows and columns of contacts when the replacement imaging chip is installed in the imaging device.

Abstract translation: 替代成像芯片包括单排接触垫，其适于与具有行和列接触的成像装置接合，当替换成像芯片安装在成像中时，单排接触垫设置成接触触点的行和列 设备。