Silver brazing material and joining method using the silver brazing material

    公开(公告)号:US11638973B2

    公开(公告)日:2023-05-02

    申请号:US17048086

    申请日:2018-10-24

    摘要: A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

    GOLD POWDER, PRODUCTION METHOD FOR GOLD POWDER, AND GOLD PASTE

    公开(公告)号:US20220219237A1

    公开(公告)日:2022-07-14

    申请号:US17632221

    申请日:2020-07-20

    摘要: A gold powder comprising gold having a purity of 99.9% by mass or more and having an average particle size of 0.01 μm or more and 1.0 μm or less, a content of a chloride ion is 100 ppm or less, and a content of a cyanide ion is 10 ppm or more and 1000 ppm or less. A total of the content of a chloride ion and the content of a cyanide ion is preferably 110 ppm or more and 1000 ppm or less. The gold powder has improved adaptability to various processes including bonding or the like with a content of a chloride ion, that is, an impurity, optimized. A gold paste using this gold powder is suitably used in various uses for bonding such as die bonding of a semiconductor chip, sealing a semiconductor package, and forming an electrode/wire.

    Alloy for medical use, and method for producing same

    公开(公告)号:US11345986B2

    公开(公告)日:2022-05-31

    申请号:US17077344

    申请日:2020-10-22

    IPC分类号: C22F1/14 C22C5/02

    摘要: The present invention provides an alloy for medical use including an Au—Pt alloy, in which the Au—Pt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with the balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an α-phase is distributed in an α-phase matrix, the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the α-phase, and the Pt-rich phase has an area ratio of 1 to 22% in any cross-section. This alloy is an artifact-free alloy material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of ±4 ppm with respect to magnetic susceptibility of water.

    IMMUNOCHROMATOGRAPHY ANALYSIS DEVICE FOR DETECTING DENGUE VIRUS

    公开(公告)号:US20220128553A1

    公开(公告)日:2022-04-28

    申请号:US17427569

    申请日:2020-01-31

    IPC分类号: G01N33/543 G01N33/569

    摘要: The invention relates to an immunochromatography analysis device which enables simple and rapid diagnosis of dengue virus infection, and an object thereof is to provide an immunochromatography analysis device which can reduce a cross-reaction with a virus belonging to Flaviviridae other than dengue virus and which can specifically detect dengue virus. The invention relates to an immunochromatography analysis device for detecting dengue virus including a sample application part, a labeling substance-holding part, a chromatography medium part having a detection part and an absorption part, wherein the labeling substance-holding part contains a first antibody which recognizes the amino acid sequence of SEQ ID NO: 2 that is present in the whole amino acid sequence of dengue virus NS1 of SEQ ID NO: 1, and the detection part contains a second antibody which recognizes the three-dimensional structure of dengue virus NS1.

    PERPENDICULAR MAGNETIC RECORDING MEDIUM

    公开(公告)号:US20220122635A1

    公开(公告)日:2022-04-21

    申请号:US17422369

    申请日:2019-12-23

    IPC分类号: G11B5/66 G11B5/73

    摘要: Provided is a perpendicular magnetic recording medium that exhibits improved thermal stability and achieves reduction in switching magnetic field by providing a cap layer having characteristics (characteristics contributing to reducing switching magnetic field of the perpendicular magnetic recording medium as well as to improving thermal stability thereof) superior to existing cap layers.
    A perpendicular magnetic recording layer (24) has a granular structure which comprises Co- Pt-alloy magnetic crystal grains (24A) and a non-magnetic grain boundary oxide (24B). A cap layer (26) has a granular structure which comprises Co-Pt-alloy magnetic crystal grains (26A) and a magnetic grain boundary oxide (26B). The Co- Pt -alloy magnetic crystal grains (26A) in the cap layer (26) contain 65-90 at % of Co and 10-35 at % of Pt. The magnetic grain boundary oxide (26B) is included in a volume fraction of 5-40 vol % with respect to the total volume of the cap layer (26).

    DC high voltage relay and contact material for DC high-voltage relay

    公开(公告)号:US11309141B2

    公开(公告)日:2022-04-19

    申请号:US16980047

    申请日:2019-03-12

    IPC分类号: H01H1/0237 H01H50/58

    摘要: A DC high-voltage relay including at least one contact pair including a movable contact and a fixed contact, having a contact force and/or opening force of 100 gf or more, the DC high-voltage relay of 48 V or more. The movable contact and/or the fixed contact includes Ag oxide-based contact material. Metal components in the contact material includes at least one metal M essentially containing Sn, and a balance including Ag and inevitable impurity metals. The content of the metal M is 0.2% by mass or more and 8% by mass or less based on the total mass of all metal components in the contact material. The contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy. As metal M, In, Bi, Ni and Te can be added.

    THROUGH-HOLE SEALING STRUCTURE AND SEALING METHOD, AND TRANSFER SUBSTRATE FOR SEALING THROUGH-HOLE

    公开(公告)号:US20220102228A1

    公开(公告)日:2022-03-31

    申请号:US16083162

    申请日:2017-04-06

    摘要: A sealing structure including: a set of base members forming a sealed space; a through-hole which is formed in at least one of the base members, and communicates with the sealed space; and a sealing member that seals the through-hole. An underlying metal film including a bulk-like metal such as gold is provided on a surface of the base member provided with the through-hole. The sealing member seals the through-hole while being bonded to the underlying metal film, and includes: a sealing material which is bonded to the underlying metal film, and includes a compressed product of a metal powder of gold or the like, the metal powder having a purity of 99.9% by mass or more; and a lid-like metal film which is bonded to the sealing material, and includes a bulk-like metal such as gold. Further, the sealing material includes: an outer periphery-side densified region being in contact with an underlying metal film; and a center-side porous region being in contact with the through-hole. The densified region has a porosity of 10% or less in terms of an area ratio at any cross-section.