公开(公告)号：US5803344A

公开(公告)日：1998-09-08

申请号：US709886

申请日：1996-09-09

申请人： Anthony John Stankavich ,  Dwadasi Hare Rama Sarma ,  Christine Ann Paszkiet ,  Marion Edmond Ellis

发明人： Anthony John Stankavich ,  Dwadasi Hare Rama Sarma ,  Christine Ann Paszkiet ,  Marion Edmond Ellis

IPC分类号： H05K1/09 ,  H05K3/34 ,  B23K31/02 ,  B23K35/26

CPC分类号： H05K3/3484 ,  H05K1/092 ,  H05K2201/10992 ,  H05K2203/043

摘要： A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a soldering technique employing dual-solder layers. The dual-solder layers enable component attachment to the conductor at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165.degree. C. The dual-solder layers can be chosen to inhibit tin diffusion from the solder, silver leaching from the conductor, and the formation of a brittle intermetallic at the solder-conductor interface.

摘要翻译： 高温厚膜混合电路的特征在于与导体电互连的表面安装电路部件。 厚膜混合电路的表面安装电路部件通过采用双焊料层的焊接技术接合到导体上。 双焊料层能够在低于组件的最大加工温度的温度下将元件附着到导体，同时形成在超过165℃的温度下表现出合适的粘合性质的焊料接头。可以选择双焊料层 以抑制锡从焊料扩散，银从导体浸出，以及在焊料 - 导体界面处形成脆性金属间化合物。

公开(公告)号：US06233817B1

公开(公告)日：2001-05-22

申请号：US09232951

申请日：1999-01-17

申请人： Marion Edmond Ellis ,  Frans Peter Lautzenhiser ,  Anthony John Stankavich ,  Dwadasi Hare Rama Sarma ,  Philip Harbaugh Bowles ,  Washington Morris Mobley

发明人： Marion Edmond Ellis ,  Frans Peter Lautzenhiser ,  Anthony John Stankavich ,  Dwadasi Hare Rama Sarma ,  Philip Harbaugh Bowles ,  Washington Morris Mobley

IPC分类号： H05K330

CPC分类号： H01L23/4334 ,  H01L23/142 ,  H01L23/3135 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/053 ,  H05K1/162 ,  H05K1/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/207 ,  H01L2224/45099

摘要： A hybrid circuit structure that includes a metal substrate, an inorganic electrical insulator layer and at least one inorganic thick-film passive circuit element, such as a thick-film resistor, capacitor or conductor. An interface layer is provided between the insulator layer and the circuit element to prevent the detrimental effects of interlayer diffusion. The composition of the interface layer is selected to prevent the diffusion of constituents from the inorganic insulator layer, and to have a CTE near that of the circuit element to reduce thermal fatigue. As a result, the passive circuit element can be formed of essentially any one of a number of conventional inorganic thick-film materials that are widely used on alumina substrates.

摘要翻译： 一种混合电路结构，其包括金属基板，无机电绝缘体层和至少一个无机厚膜无源电路元件，例如厚膜电阻器，电容器或导体。 在绝缘体层和电路元件之间提供界面层，以防止层间扩散的不利影响。 选择界面层的组成以防止组分从无机绝缘体层扩散，并且使CTE接近电路元件的CTE以减少热疲劳。 结果，被动电路元件可以由在氧化铝基板上广泛使用的多种常规无机厚膜材料中的任何一种形成。

公开(公告)号：US06391678B1

公开(公告)日：2002-05-21

申请号：US09344971

申请日：1999-06-28

申请人： Christine Ann Paszkiet ,  Christine Redder Coapman ,  Anthony John Stankavich

发明人： Christine Ann Paszkiet ,  Christine Redder Coapman ,  Anthony John Stankavich

IPC分类号： H01L2144

CPC分类号： H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thick-film conductor, a method for forming the conductor, and a method for attaching a surface-mount circuit device to the conductor with a solder connection. The conductor is formed of a thick-film conductive ink that would normally produce a solderable conductor, but is rendered unsolderable by additions of a fine inorganic particulate material. A solderable region, preferably a pillar, is then selectively formed on the unsolderable conductor to determine the distribution and height of the solder connection on the conductor. In order to suitably affect the solderability of the conductor, the particulate material is present as a fine dispersion and in a sufficient quantity, but not in quantities that significantly affect the electrical, mechanical and processing characteristics of the conductor.

摘要翻译： 一种厚膜导体，一种用于形成导体的方法，以及一种通过焊接连接将表面安装电路器件附着在导体上的方法。 导体由通常产生可焊接导体的厚膜导电油墨形成，但是通过添加无机微粒材料是不可焊的。 然后可选择地在可焊接导体上形成可焊接区域，以确定导体上焊料连接的分布和高度。 为了适当地影响导体的可焊性，颗粒材料以细分散体存在并且以足够的量存在，但不以显着影响导体的电学，机械和加工特性的量存在。