Temperature compensated capacitor

    公开(公告)号:US4581795A

    公开(公告)日:1986-04-15

    申请号:US605383

    申请日:1984-04-30

    IPC分类号: H01G4/258 H03H7/54 H03B5/26

    CPC分类号: H01G4/258 H03H7/54 Y10T29/435

    摘要: A temperature compensating capacitor device is described. The device incorporates at least two capacitors with different dielectric materials which vary with temperature such that the overall capacitance of the device remains substantially constant. Filter circuits incorporating such devices and methods of making them are described. Capacitors of one dielectric material are formed by etching a conductive coating on one face of a layer of that material. The layer is attached via a conductive coating on its other face to the base of a housing, and capacitors of the other dielectric material are attached to its etched face. Other impedances are attached between the capacitors to form the ladder network.

    Temperature compensated capacitor
    2.
    发明授权
    Temperature compensated capacitor 失效
    温度补偿电容

    公开(公告)号:US4636913A

    公开(公告)日:1987-01-13

    申请号:US798740

    申请日:1985-11-15

    IPC分类号: H01G4/258 H03H7/54 H01H47/18

    CPC分类号: H01G4/258 H03H7/54

    摘要: A temperature compensating capacitor device is described. The device incorporates at least two capacitors with different dielectric materials which vary with temperature such that the overall capacitance of the device remains substantially constant. Filter circuits incorporating such devices and methods of making them are described. Capacitors of one dielectric material are formed by etching a conductive coating on one face of a layer of that material. The layer is attached via a conductive coating on its other face to the base of a housing, and capacitors of the other dielectric material are attached to its etched face. Other impedances are attached between the capacitors to form the ladder network.

    摘要翻译: 对温度补偿电容器装置进行说明。 该器件包含至少两个具有不同介电材料的电容器,其随着温度而变化,使得器件的整体电容基本保持恒定。 描述了包含这种装置的滤波电路及其制造方法。 通过在该材料层的一个表面上蚀刻导电涂层来形成一种电介质材料的电容器。 该层通过其另一面上的导电涂层附接到壳体的底部,并且另一个电介质材料的电容器附着到其蚀刻面。 在电容器之间附加其它阻抗以形成梯形网络。