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公开(公告)号：US09490055B2
公开(公告)日：2016-11-08
申请号：US13287255
申请日：2011-11-02
申请人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
CPC分类号： H01G4/30 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/49002
摘要： A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.
摘要翻译： 陶瓷电子部件包括陶瓷体，内电极，外电极和连接部。 内部电极设置在陶瓷体的内部。 内部电极的端部延伸到陶瓷体的表面。 外部电极设置在陶瓷体的表面上以覆盖内部电极的端部。 外部电极包括树脂和金属。 连接部被配置成从外部电极的内部延伸到陶瓷体的内部。 在设置有外部电极的陶瓷体的表面的一部分中，连接部的在内部电极的延伸方向上延伸约2.4μm以上的长度。
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公开(公告)号：US20110309718A1
公开(公告)日：2011-12-22
申请号：US13161535
申请日：2011-06-16
申请人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
发明人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
摘要： When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.
摘要翻译： 当通过电镀形成层压陶瓷电容器等陶瓷电子部件的外部端子电极时，即使在不希望的位置也可能产生电镀生长。 由组件主体提供的陶瓷表面被构造为包括例如呈现较高镀层生长的例如钛酸钡系陶瓷的高镀层生长区域和例如锆酸锆的低镀层生长区域 其具有相对较低的电镀生长。 构成用于限定外部端子电极的基底的第一层的电镀膜以这样的方式形成，使得以由内部电极的暴露端作为起点设置的导电表面沉积的镀覆沉积物的生长被限制为不交叉 在高电镀生长区域和低电镀生长区域之间的边界朝向低电镀生长区域。
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公开(公告)号：US20110299221A1
公开(公告)日：2011-12-08
申请号：US13150537
申请日：2011-06-01
IPC分类号： H01G4/008
CPC分类号： H01G4/2325 , H01C1/142 , H01C7/18 , H01G4/30
摘要： A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.
摘要翻译： 具有高可靠性的芯片型电子部件，即使安装有芯片型电子部件的基板发生偏转，也能够抑制和防止由于开裂导致的陶瓷体的致命损坏。 芯片型电子部件包括具有内部电极的陶瓷体; 形成在至少包含陶瓷体的端面的区域中的树脂电极层，并且与内部电极直接或间接连接并与陶瓷体连接; 以及覆盖树脂电极层的金属层，其中陶瓷体和树脂电极层之间的粘合强度高于树脂电极层和电镀金属层之间的粘附强度。
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4.发明授权Process for producing resin-coated metal particles, resin-coated metal particles, and toner for forming circuit 有权用于生产树脂涂覆的金属颗粒，树脂涂覆的金属颗粒和用于形成电路的调色剂的方法公开(公告)号：US08053073B2
公开(公告)日：2011-11-08
申请号：US10575662
申请日：2004-09-15
申请人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
发明人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
IPC分类号： G03G5/00
CPC分类号： H05K3/102 , C08F292/00 , H05K2201/0224 , Y10T428/29 , Y10T428/2982
摘要： A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.
摘要翻译： 制造树脂涂覆的金属颗粒的方法包括用二氧化硅涂覆金属颗粒的表面; 使可聚合基团通过使用硅烷偶联剂吸附在二氧化硅被覆颗粒的表面上; 并且通过混合吸附有可聚合基团的颗粒，可聚合单体，聚合引发剂和分散剂，用聚合物树脂涂覆二氧化硅涂覆的颗粒的表面以聚合可聚合单体和可聚合基团。
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公开(公告)号：US20130107420A1
公开(公告)日：2013-05-02
申请号：US13287253
申请日：2011-11-02
申请人： Kiyoyasu SAKURADA , Kota ZENZAI , Hisayoshi OMORI , Takashi KANAYAMA , Shinji OTANI , Naoki SHIMIZU , Seiji KATSUTA
发明人： Kiyoyasu SAKURADA , Kota ZENZAI , Hisayoshi OMORI , Takashi KANAYAMA , Shinji OTANI , Naoki SHIMIZU , Seiji KATSUTA
CPC分类号： H01G4/2325 , H01G4/12 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.
摘要翻译： 陶瓷电子部件包括陶瓷体和外部电极。 外部电极设置在陶瓷体上。 外电极包括第一导电层和第二导电层。 第一导电层包括树脂，第一金属组分和具有比第一金属组分更高的熔点的第二金属组分。 第二导电层设置在第一导电层上。 第二导电层包括镀膜。 含有第一金属成分和第二金属成分的合金粒子从第一导电层的表面突出到第二导电层侧。
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公开(公告)号：US20090189729A1
公开(公告)日：2009-07-30
申请号：US12417686
申请日：2009-04-03
IPC分类号： H01F17/04
CPC分类号： H01Q7/06 , G06K19/07749 , G06K19/07767 , H01Q1/2225 , H01Q1/38
摘要： A flexible substrate is wound around a magnetic core to define an antenna coil. A receiver coil including a first receiver coil portion and a second receiver coil portion which have opposite winding directions, and a transmitter coil including a first transmitter coil portion and a second transmitter coil portion which have opposite winding directions are provided on the flexible substrate. A region in which the receiver coil is provided and a region in which the transmitter coil is provided at least partially overlap each other when viewed in plan view, and non-coil-wound portions are provided between the first coil portions and second coil portions in the coils.
摘要翻译： 柔性基板缠绕在磁芯上以限定天线线圈。 包括具有相反卷绕方向的第一接收线圈部分和第二接收线圈部分的接收器线圈和包括具有相反卷绕方向的第一发射器线圈部分和第二发射器线圈部分的发射器线圈设置在柔性基板上。 在平面图中观察时，设置有接收器线圈的区域和发送线圈被设置成至少部分地彼此重叠的区域，并且非线圈缠绕部分设置在第一线圈部分和第二线圈部分之间 线圈。
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7.发明申请Process for Producing Resin-Coated Metal Particles, Resin-Coated Metal Particles, and Toner for Forming Circuit 有权用于生产树脂涂覆的金属颗粒，树脂涂覆的金属颗粒和用于成型电路的调色剂的方法公开(公告)号：US20080081275A1
公开(公告)日：2008-04-03
申请号：US10575662
申请日：2004-09-15
申请人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
发明人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
CPC分类号： H05K3/102 , C08F292/00 , H05K2201/0224 , Y10T428/29 , Y10T428/2982
摘要： A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.
摘要翻译： 制造树脂涂覆的金属颗粒的方法包括用二氧化硅涂覆金属颗粒的表面; 使可聚合基团通过使用硅烷偶联剂吸附在二氧化硅被覆颗粒的表面上; 并且通过混合吸附有可聚合基团的颗粒，可聚合单体，聚合引发剂和分散剂，用聚合物树脂涂覆二氧化硅涂覆的颗粒的表面以聚合可聚合单体和可聚合基团。
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公开(公告)号：US09013859B2
公开(公告)日：2015-04-21
申请号：US13020886
申请日：2011-02-04
CPC分类号： H01G4/30 , H01F17/0013 , H01G4/005 , H01G13/00 , H01L41/293
摘要： A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.
摘要翻译： 一种层叠电子部件的制造方法，其中，当分别连接多个内部电极彼此连接的第一镀层和提高层压电子部件的安装性的第二镀层形成为外部端子电极时，整个部件主体 在形成第一镀层之后，用防水剂处理体，然后在形成第二镀层之前去除第一镀层上的防水剂。 在组件主体的外表面上的第一镀膜的端缘与部件主体的外表面之间的间隙填充有防水剂。
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公开(公告)号：US08553391B2
公开(公告)日：2013-10-08
申请号：US13233412
申请日：2011-09-15
IPC分类号： H01G4/06
CPC分类号： H01G4/08 , H01G4/012 , H01G4/2325 , H01G4/30
摘要： In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.
摘要翻译： 在电子部件中，层压体包括多个层叠陶瓷层和由多个层叠陶瓷层的外边缘限定的安装面，外边缘彼此相邻地连续定位。 电容器导体设置在陶瓷层上，并且包括露出在陶瓷层之间的安装表面的暴露部分。 限定外部电极的导电层被布置成直接覆盖暴露部分，并且通过电镀形成以由电镀材料制成。 另一导电层覆盖上述导电层并且部分覆盖层压体的表面，并且由包括金属和玻璃和树脂之一的材料制成。
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公开(公告)号：US20130107421A1
公开(公告)日：2013-05-02
申请号：US13287276
申请日：2011-11-02
申请人： Kota ZENZAI , Hisayoshi OMORI , Takashi KANAYAMA , Kiyoyasu SAKURADA , Naoki SHIMIZU , Seiji KATSUTA , Shinji OTANI
发明人： Kota ZENZAI , Hisayoshi OMORI , Takashi KANAYAMA , Kiyoyasu SAKURADA , Naoki SHIMIZU , Seiji KATSUTA , Shinji OTANI
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/252 , H01G13/006 , H05K3/1283 , H05K3/4664
摘要： A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.
摘要翻译： 陶瓷体包括设置在陶瓷体内部的内部电极，内部电极的端部延伸到陶瓷体的表面。 在陶瓷体的表面上形成电极层，以覆盖内部电极的端部，包括树脂的电极层，含有第一金属成分的第一金属填料和含有第一金属成分的第二金属填料 具有比第一金属成分高的熔点的第二金属成分。 进行加热电极层的步骤，以形成包括位于陶瓷体表面上并且包括第一和第二金属成分的金属层的电极和内部电极中所含的金属。
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