公开(公告)号：US4459639A

公开(公告)日：1984-07-10

申请号：US397645

申请日：1982-07-12

Applicant: Dale L. Heil ,  Mark D. Goodsmith

Inventor： Dale L. Heil ,  Mark D. Goodsmith

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K2201/10022 ,  H05K2201/10553 ,  H05K2201/10651

Abstract: A technique and assembly is disclosed which allows more effective heat dissipation in a printed circuit assembly. A heatsink plate is etched using the artwork or masks used to form the conductive strips and terminals on a conventional printed circuit board. The heatsink plate is secured over at least a portion of the surface of the printed circuit board by an adhesive and the resulting heatsink assembly is mounted adjacent to a thermally conductive bracket. The heatsink assembly is then secured to the bracket by a wedge clamp which includes mating wedges configured to provide a high thermally conductive path between the heatsink plate and bracket for dissipating heat generated in or about the printed circuit heatsink assembly. The clamp configuration is such as to allow slidable movement between similarly shaped wedges which produces proper formation of the thermally conductive path during clamping.The Government has rights to this invention pursuant to contract No. F04701-79-C-0083, awarded by the Department of the Air Force.

Abstract translation: 公开了一种允许在印刷电路组件中更有效散热的技术和组件。 使用用于在常规印刷电路板上形成导电条和端子的图形或掩模蚀刻散热板。 散热板通过粘合剂固定在印刷电路板的表面的至少一部分上，并且所得到的散热器组件安装在导热支架附近。 散热器组件然后通过楔形夹固定到支架上，楔形夹具包括配对楔块，其配置成在散热板和支架之间提供高导热路径，用于散热印刷电路散热器组件中或其周围产生的热量。 夹持构造是允许在类似形状的楔块之间的可滑动运动，其在夹紧期间产生适当地形成导热路径。 政府根据空军部授予的F04701-79-C-0083号合同，享有本发明的权利。

公开(公告)号：US4475145A

公开(公告)日：1984-10-02

申请号：US397644

申请日：1982-07-12

Applicant: Dale L. Heil ,  Mark D. Goodsmith

Inventor： Dale L. Heil ,  Mark D. Goodsmith

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K2201/10022 ,  H05K2201/10553 ,  H05K2201/10651

Abstract: A printed circuit heatsink technique and assembly is disclosed which increases the heat dissipating capabilities of a printed circuit assembly. A thermally conductive plate is etched using the same artwork or mask employed to define the patterns of terminals and conductive areas on one surface of a printed circuit board. The plate is etched in those regions corresponding to the terminal and conductive areas so that holes are produced in the terminal areas and channels are produced in the conductive areas. The plate is then bonded to the printed circuit board prior to the attachment of the leads of electronic components through the holes formed in the thermally conductive plate. The assembly absorbs heat generated by the electronic components and provides a greater surface area for dissipating that heat without the need for specially fabricated heatsink elements or complex milling procedures.

Abstract translation: 公开了印刷电路散热技术和组件，其增加了印刷电路组件的散热能力。 使用用于限定印刷电路板的一个表面上的端子和导电区域的图案的相同的图案或掩模蚀刻导热板。 在对应于端子和导电区域的那些区域中蚀刻板，使得在端子区域中产生孔，并且在导电区域中产生通道。 然后在通过形成在导热板中的孔的电子部件的引线附接之前，将板接合到印刷电路板。 组件吸收由电子部件产生的热量，并提供更大的表面积来消散热量，而不需要特别制造的散热元件或复杂的铣削程序。