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    Bare die socket
    2.
    发明申请
    Bare die socket 审中-公开
    裸芯片插座

    公开(公告)号：US20060141667A1

    公开(公告)日：2006-06-29

    申请号：US11053448

    申请日：2005-02-08

    申请人： Donald Milbrand ,  Mark Gailus ,  Nathan Pascarella

    发明人： Donald Milbrand ,  Mark Gailus ,  Nathan Pascarella

    IPC分类号： H01L21/44

    CPC分类号： H01R13/405 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3011

    摘要： A socket for removably mounting a bare die to a substrate, such as a printed circuit board. This socket is formed by insert molding signal conductors in an insulative housing. A ground structure is separately provided to control the impedance of the signal conductors and to reduce cross talk. The ground structure may be formed as a separate subassembly and attached to the subassembly formed by insert molding a housing around signal conductors. The ground structure also provides ground connections between the printed circuit board and the chip.

    摘要翻译： 用于将裸片可移除地安装到诸如印刷电路板的基板的插座。 该插座通过在绝缘壳体中嵌入成型信号导体而形成。 单独提供接地结构以控制信号导体的阻抗并减少串扰。 接地结构可以形成为单独的子组件并且附接到通过将信号导体周围的壳体嵌入成型而形成的子组件。 接地结构还提供印刷电路板和芯片之间的接地连接。

    Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
    3.
    发明申请
    Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics 失效
    印刷电路板用于高速，高密度电连接器，具有改进的串扰最小化，衰减和阻抗失配特性

    公开(公告)号：US20080030970A1

    公开(公告)日：2008-02-07

    申请号：US11808642

    申请日：2007-06-12

    申请人： Jason Payne ,  Mark Gailus ,  Leon Khilchenko ,  Huilin Ren

    发明人： Jason Payne ,  Mark Gailus ,  Leon Khilchenko ,  Huilin Ren

    IPC分类号： H05K1/11

    CPC分类号： H01R13/6477 ,  H01R12/714 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6587 ,  H05K1/0219 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/10189

    摘要： In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plurality of stacked dielectric layers, with a conductor disposed on at least one of the plurality of dielectric layers. The mating interface includes a plurality of conductive vias aligned in a plurality of rows, with the plurality of conductive vias extending through at least a portion of the plurality of dielectric layers, at least one of the plurality of conductive vias intersecting the conductor. The plurality of conductive vias includes signal conductor connecting conductive vias and ground conductor connecting conductive vias. For each of the plurality of rows of the conductive vias, there are at least twice as many ground conductor connecting conductive vias as signal conductor connecting conductive vias and the conductive vias are positioned relative to one another so that for each signal conductor connecting conductive via, there are ground conductor connecting conductive vias adjacent either side of the signal conductor connecting conductive via.

    摘要翻译： 在优选实施例中，公开了一种印刷电路板，其具有提供配合接口的表面，电连接器具有信号导体和接地导体。 印刷电路板包括多个堆叠的电介质层，其中导体设置在多个电介质层中的至少一个上。 配合接口包括以多行排列的多个导电通孔，多个导电通孔延伸穿过多个电介质层的至少一部分，多个导电通孔中的至少一个与导体相交。 多个导电通孔包括连接导电通孔的信号导体和连接导电通孔的接地导体。 对于导电通孔的多行中的每一行，存在至少两倍的接地导体，其连接导电通孔，作为连接导电通孔的信号导体，并且导电通孔相对于彼此定位，使得对于连接导电通孔的每个信号导体， 有接地导体连接导电通孔，邻近信号导体的任一侧连接导电通孔。

    Lead(Pb)-free electronic component attachment
    4.
    发明申请
    Lead(Pb)-free electronic component attachment 有权
    无铅（Pb）电子元件附件

    公开(公告)号：US20070205497A1

    公开(公告)日：2007-09-06

    申请号：US11604710

    申请日：2006-11-28

    申请人： Mark Gailus ,  Leon Khilchenko

    发明人： Mark Gailus ,  Leon Khilchenko

    IPC分类号： H01L23/48

    CPC分类号： H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

    摘要： A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

    摘要翻译： 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

    Midplane especially applicable to an orthogonal architecture electronic system
    5.
    发明申请
    Midplane especially applicable to an orthogonal architecture electronic system 有权
    中平面特别适用于正交架构电子系统

    公开(公告)号：US20070149057A1

    公开(公告)日：2007-06-28

    申请号：US11522530

    申请日：2006-09-18

    申请人： Thomas Cohen ,  Marc Cartier ,  Mark Gailus

    发明人： Thomas Cohen ,  Marc Cartier ,  Mark Gailus

    IPC分类号： H01R13/648

    CPC分类号： H05K7/1445 ,  H01R13/514 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

    摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

    摘要翻译： 中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。 中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。 第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。 第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

    Electronic component with high density, low cost attachment
    7.
    发明申请
    Electronic component with high density, low cost attachment 有权
    电子元件密度高，附件成本低

    公开(公告)号：US20070207635A1

    公开(公告)日：2007-09-06

    申请号：US11604289

    申请日：2006-11-27

    申请人： Mark Gailus ,  Leon Khilchenko

    发明人： Mark Gailus ,  Leon Khilchenko

    IPC分类号： H01R12/00

    CPC分类号： H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

    摘要： A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

    摘要翻译： 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

    Apparatus for forming a connection between a circuit board and a connector, having a signal launch
    8.
    发明授权
    Apparatus for forming a connection between a circuit board and a connector, having a signal launch 失效
    用于形成电路板和连接器之间的连接器的装置，具有信号发射

    公开(公告)号：US06639154B1

    公开(公告)日：2003-10-28

    申请号：US09685306

    申请日：2000-10-10

    申请人： Marc Cartier ,  Mark Gailus

    发明人： Marc Cartier ,  Mark Gailus

    IPC分类号： H05K103

    CPC分类号： H05K1/0222 ,  H01R12/718 ,  H01R24/50 ,  H01R2103/00 ,  H05K3/3447 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10303

    摘要： A circuit board includes (i) a section of circuit board material having a signal conductor, a ground conductor, and dielectric material that separates the signal conductor and the ground conductor, and (ii) a signal launch. The signal launch includes a signal via that contacts the signal conductor and the dielectric material of the section of circuit board material, a first set of ground vias and a second set of ground vias. The ground vias contact the ground conductor and the dielectric material of the section of circuit board material. The first set of ground vias is disposed a first radial distance from the signal via. The second set of ground vias is disposed a second radial distance from the signal via. A coaxial connector mounts to the signal launch of the circuit board in order to provide electrical access to the signal and ground conductors.

    摘要翻译： 电路板包括（i）具有分离信号导体和接地导体的信号导体，接地导体和介电材料的电路板材料的一部分，以及（ii）信号发射。 信号发射包括接触信号导体和电路板材料部分的介电材料的信号通路，第一组接地通孔和第二组接地通路。 接地导体与接地导体和电路板材料部分的介电材料接触。 第一组接地通孔设置在与信号通孔相距的第一径向距离处。 第二组接地通孔设置在与信号通孔相距的第二径向距离处。 同轴连接器安装到电路板的信号发射，以便提供对信号和接地导体的电接入。