High temperature underfilling material with low exotherm during use
    1.
    发明授权
    High temperature underfilling material with low exotherm during use 失效
    高温底部填充材料,使用时放热较低

    公开(公告)号:US06548575B2

    公开(公告)日:2003-04-15

    申请号:US09735821

    申请日:2000-12-13

    IPC分类号: C08L6300

    摘要: A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.

    摘要翻译: 一种可固化的底部填充组合物,其包含含有固化剂组分和潜在促进剂组分的环氧树脂。 促进剂组分包括产生具有低于300J / g的放热的树脂的材料。 此外,该组合可以以未填充状态使用,这使填充的环氧组合物和含有不同促进剂组分的环氧组合物相比,环氧树脂保持非常粘稠,从而增加了底部填充工艺的速度。

    Thermally conductive material
    2.
    发明申请
    Thermally conductive material 审中-公开
    导热材料

    公开(公告)号:US20080039555A1

    公开(公告)日:2008-02-14

    申请号:US11502708

    申请日:2006-08-10

    IPC分类号: C08G59/50

    摘要: A low viscosity composition for use in varying applications, such as an encapsulant, anti-corrosive, adhesive and/or thermal interface material in an electronic device is provided. The composition comprises a blend one or more resins, one or more curing agents, one or more reactive diluents and one or more thermally conductive filler having particles with a high aspect ratio.

    摘要翻译: 提供了用于电子设备中的各种应用的低粘度组合物,例如密封剂,防腐蚀剂,粘合剂和/或热界面材料。 该组合物包含混合物一种或多种树脂,一种或多种固化剂,一种或多种反应性稀释剂和一种或多种具有高纵横比的颗粒的导热填料。

    High Tg potting compound
    3.
    发明授权
    High Tg potting compound 失效
    高Tg灌封料

    公开(公告)号:US06462108B1

    公开(公告)日:2002-10-08

    申请号:US09620170

    申请日:2000-07-20

    IPC分类号: C08K308

    摘要: A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two epoxy groups per molecule), present in an amount of 20 to 50 parts by weight; a liquid anhydride, present in an amount of 80 to 150 parts by weight; a basic latent accelerator, present in an amount of 1 to 5 parts by weight; and a filler, present in an amount of 100 to 500 parts by weight.

    摘要翻译: 液体环氧类灌封组合物的玻璃化转变温度等于或大于200℃,并且包含以50至80重量份的量存在的环脂族环氧树脂; 多功能芳族环氧树脂(每分子具有多于两个环氧基团),其量为20至50重量份; 液体酸酐,其量为80至150重量份; 一种碱性潜在促进剂,其用量为1至5重量份; 和填料,其量为100-500重量份。