Deposition of a conductive and protective coating on a metallic substrate
    1.
    发明授权
    Deposition of a conductive and protective coating on a metallic substrate 失效
    在金属基材上沉积导电和保护涂层

    公开(公告)号:US5043226A

    公开(公告)日:1991-08-27

    申请号:US341995

    申请日:1989-04-24

    IPC分类号: B05D7/16 H05K9/00

    摘要: A method of grafting a conductive, tenacious, and protective coating on a metallic substrate. The metallic substrate, such as steel, aluminum, iron, platinum, silver, nickel, gold, cobalt, copper, copper alloys, or combinations thereof, is contacted with a composition having: (i) one or more polymerizable monomers having at least two functionalities; (ii) one or more graft initiators containing nickel ion in an amount effective to initiate the graft polymerization of the monomers; and (iii) a reducing agent capable of reducing nickel ion to nickel metal. The composition and substrate are heated for a time and at a temperature effective to graft polymerize the monomers and nickel metal onto the substrate and form a conductive, tenacious, and protective coating bonded to the substrate. The coating can also contain elemental phosphorous. Preferably, the coated substrate has a surface resistivity of less than 0.1 ohm per square. The method, coated substrate, and composition are useful for improving the electro-magnetic compatibility (EMC) and electro-static discharge (ESD) protection of electrical enclosures.

    摘要翻译: 在金属基底上接枝导电,韧性和保护性涂层的方法。 金属基材如钢,铝,铁,铂,银,镍,金,钴,铜,铜合金或其组合与具有以下成分的组合物接触:(i)一种或多种可聚合单体,其具有至少两个 功能; (ii)一种或多种含有有效引发单体的接枝聚合的量的镍离子的接枝引发剂; 和(iii)能够将镍离子还原成镍金属的还原剂。 将组合物和基材加热一段时间并且在有效地将单体和镍金属接枝聚合到基材上并形成结合到基材上的导电,韧性和保护性涂层的温度。 涂层还可以含有元素磷。 优选地,涂覆的基底具有小于0.1欧姆/平方的表面电阻率。 该方法,涂覆的基材和组合物可用于改善电气外壳的电磁兼容性(EMC)和静电放电(ESD)保护。