公开(公告)号：US08735286B2

公开(公告)日：2014-05-27

申请号：US13284431

申请日：2011-10-28

Applicant: Rishi Kant ,  Roger Thomas Howe

Inventor： Rishi Kant ,  Roger Thomas Howe

IPC: H01L21/44

CPC classification number: B81C1/00333 ,  B81C2201/0116

Abstract: A method for sealing through-holes in a material via material diffusion, without the deposition of a sealant material, is disclosed. The method is well suited to the fabrication and packaging of microsystems technology-based devices and systems. In some embodiments, the method comprises forming sacrificial material release through-holes through a structural layer, removing the sacrificial material via an etch that etches the sacrificial material through the release through-holes, and sealing of the release through-holes via material diffusion.

Abstract translation: 公开了一种用于通过材料扩散密封材料中的通孔的方法，而不会密封材料的沉积。 该方法非常适合基于微系统技术的设备和系统的制造和封装。 在一些实施例中，该方法包括通过结构层形成牺牲材料释放通孔，通过经由释放通孔蚀刻牺牲材料的蚀刻以及经由材料扩散密封释放通孔来去除牺牲材料。

公开(公告)号：US20120104589A1

公开(公告)日：2012-05-03

申请号：US13284431

申请日：2011-10-28

Applicant: Rishi Kant ,  Roger Thomas Howe

Inventor： Rishi Kant ,  Roger Thomas Howe

IPC: H01L23/20 ,  H01L21/768

CPC classification number: B81C1/00333 ,  B81C2201/0116

Abstract: A method for sealing through-holes in a material via material diffusion, without the deposition of a sealant material, is disclosed. The method is well suited to the fabrication and packaging of microsystems technology-based devices and systems. In some embodiments, the method comprises forming sacrificial material release through-holes through a structural layer, removing the sacrificial material via an etch that etches the sacrificial material through the release through-holes, and sealing of the release through-holes via material diffusion.

Abstract translation: 公开了一种用于通过材料扩散密封材料中的通孔的方法，而不会密封材料的沉积。 该方法非常适合基于微系统技术的设备和系统的制造和封装。 在一些实施例中，该方法包括通过结构层形成牺牲材料释放通孔，通过经由释放通孔蚀刻牺牲材料的蚀刻以及经由材料扩散密封释放通孔来去除牺牲材料。