公开(公告)号：US5212910A

公开(公告)日：1993-05-25

申请号：US727829

申请日：1991-07-09

申请人： Joseph R. Breivogel ,  Sam F. Louke ,  Michael R. Oliver ,  Leo D. Yau

发明人： Joseph R. Breivogel ,  Sam F. Louke ,  Michael R. Oliver ,  Leo D. Yau

IPC分类号： B24B37/22 ,  B24B37/26 ,  H01L21/304

CPC分类号： B24B37/22 ,  B24B37/26

摘要： An improved composite polishing pad includes a first layer of elastic material, a second, stiff layer and a third layer optimized for slurry transport. This third layer is the layer against which the wafer makes contact during the polishing process. The second layer is segmented into individual sections physically isolated from one another in the lateral dimension. Each segmented section is resilient across its width yet cushioned by the first layer in the vertical direction. The physical isolation of each section combined with the cushioning of the first layer of material create a sort of "bedspring" effect which enables the pad to conform to longitudinal gradations across the wafer.

摘要翻译： 改进的复合抛光垫包括第一层弹性材料，第二刚性层和为泥浆输送而优化的第三层。 该第三层是在抛光过程中晶片接触的层。 第二层被分割为在横向尺寸上彼此物理隔离的单个部分。 每个分段部分在其宽度上是弹性的，并且在垂直方向上被第一层缓冲。 每个部分的物理隔离结合第一层材料的缓冲产生一种“床弹簧”效应，使得垫片能够顺应晶片上的纵向灰度。