METHODS FOR CHARACTERIZATION OF THE MECHANICAL PROPERTIES OF THIN FILMS AND TEST STRUCTURES FOR PERFORMING THE SAME
    1.
    发明申请
    METHODS FOR CHARACTERIZATION OF THE MECHANICAL PROPERTIES OF THIN FILMS AND TEST STRUCTURES FOR PERFORMING THE SAME 审中-公开
    用于表征薄膜的机械性能的方法和用于实施其的测试结构

    公开(公告)号:US20110273701A1

    公开(公告)日:2011-11-10

    申请号:US12680512

    申请日:2007-09-28

    Abstract: A test structure allows one or more deposited thin film layers to be moved such that mechanical properties of the thin film layer or layers may be determined. Methods for characterizing the mechanical properties of the deposited thin film layer include the determination of a transition voltage of the movable thin film layer in the test structure, or the mechanical stiffness of the movable layer, and/or a determination of residual stress within the movable layer. Methods may also include the determination of creep rate or fatigue, as well as the variance in mechanical properties of the movable layer at various temperatures. Test structures used with the testing methods may include structures which interferometrically modulate incident light, enabling electrical or optical determination of the state of the test structures.

    Abstract translation: 测试结构允许移动一个或多个沉积的薄膜层,使得可以确定薄膜层的机械性能。 表征沉积的薄膜层的机械性能的方法包括确定测试结构中可移动薄膜层的转变电压或可移动层的机械刚度,和/或确定可移动层内的残余应力 层。 方法还可以包括确定蠕变速率或疲劳,以及可移动层在各种温度下的机械性能的变化。 与测试方法一起使用的测试结构可以包括对入射光进行干涉测量的结构,使得能够电或光学地确定测试结构的状态。

Patent Agency Ranking