公开(公告)号：US20120058066A1

公开(公告)日：2012-03-08

申请号：US13255457

申请日：2010-02-12

申请人： Yusuke Nagai ,  Hidenori Yokoi ,  Koji Uesugi ,  Keiji Naruse

发明人： Yusuke Nagai ,  Hidenori Yokoi ,  Koji Uesugi ,  Keiji Naruse

IPC分类号： A61K8/64 ,  C12N5/071 ,  C12N5/04 ,  A61K47/42 ,  A61K38/10 ,  B05D7/24 ,  A61Q19/00 ,  A61P7/02 ,  C09K3/00 ,  A61L2/04 ,  B05D5/00 ,  C07K7/08 ,  A61Q5/00

CPC分类号： C07K7/08 ,  A61K8/64 ,  A61K9/0048 ,  A61K9/06 ,  A61K38/10 ,  A61K47/42 ,  A61L15/60 ,  A61L27/227 ,  A61L27/52 ,  A61L29/145 ,  A61L31/10 ,  A61L31/145 ,  A61Q5/00 ,  A61Q19/00 ,  B01J20/28047 ,  C10M173/02 ,  C12N5/0068 ,  C12N5/0656 ,  C12N5/0658 ,  C12N2533/50

摘要： Provide are a peptide gel with practically sufficient mechanical strength and a self-assembling peptide capable of forming the peptide gel. The self-assembling peptide is formed of the following amino acid sequence: a1b1c1b2a2b3db4a3b5c2b6a4 where: a1 to a4 each represent a basic amino acid residue; b1 to b6 each represent an uncharged polar amino acid residue and/or a hydrophobic amino acid residue, provided that at least five thereof each represent a hydrophobic amino acid residue; c1 and c2 each represent an acidic amino acid residue; and d represents a hydrophobic amino acid residue.

摘要翻译： 提供具有实际足够的机械强度的肽凝胶和能够形成肽凝胶的自组装肽。 自组装肽由以下氨基酸序列形成：a1b1c1b2a2b3db4a3b5c2b6a4其中：a1至a4各自表示碱性氨基酸残基; b1至b6各自表示不带电极性氨基酸残基和/或疏水性氨基酸残基，条件是其至少5个各自表示疏水性氨基酸残基; c1和c2各自表示酸性氨基酸残基; d表示疏水性氨基酸残基。

公开(公告)号：US07682858B2

公开(公告)日：2010-03-23

申请号：US11151526

申请日：2005-06-14

申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Masaru Nakamura

发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Masaru Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L21/304 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78 ,  H01L2221/6834

摘要： A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.

摘要翻译： 一种晶片处理方法，其特征在于，将沿着划分线将在前表面上形成的划分线的划分线的区域的功能元件分割为各个芯片，所述晶片处理方法包括在劣化层形成步骤中形成劣化层 通过施加能够从晶片的背面沿着划分线穿过晶片的激光束，从与晶片的前表面相对应的与芯片的最终厚度相对应的距离的位置的背面; 分割步骤，通过沿着分割线向已经形成有劣化层的晶片施加外力，沿着分割线将晶片分割成单个芯片; 以及后表面研磨步骤，用于将分成单个芯片的晶片的背面研磨至芯片的最终厚度。

公开(公告)号：US07497213B2

公开(公告)日：2009-03-03

申请号：US11249494

申请日：2005-10-14

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： B28D1/32

CPC分类号： H01L21/67132 ,  B23K26/0853 ,  B23K37/0461 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T29/41 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/325 ,  Y10T225/35

摘要： A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.

摘要翻译： 一种用于沿着分割线沿着多个分割线分割强度减小的晶片的晶片分割装置，其包括用于保持固定在晶片一侧的保护带的带保持装置; 以及晶片分割装置，每个分离装置包括多个张力施加装置，所述张力施加装置包括第一吸持保持构件和第二吸持保持构件，用于通过保护带吸附保持在带保持装置上的晶片在分隔线的两侧 以及用于使它们彼此分离的方向移动第一吸持保持构件和第二吸持保持构件的移动装置。

公开(公告)号：US07350446B2

公开(公告)日：2008-04-01

申请号：US11254779

申请日：2005-10-21

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： B26F3/00 ,  B26F3/02 ,  B65H35/00 ,  B65H35/10 ,  H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T83/8773 ,  Y10T225/30 ,  Y10T225/329 ,  Y10T225/371

摘要： A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.

摘要翻译： 一种分割装置，沿着分割线沿着分割线分割强度降低的晶片，该分割线包括用于保持固定在晶片的一个表面侧上的保护带的带保持装置; 以及晶片分割装置，包括第一吸持保持部件和第二吸持保持部件，两者具有保持面，该保持面用于通过保护带保持在保持带上的晶片通过保护带在分割线的两侧通过 保护带，以及用于使第一吸持保持部件和第二吸引保持部件彼此分离的方向移动的移动部件，其中，第一吸引保持部件的保持面和第二吸引保持部件的保持面 夹持构件倾斜使得它们相对于彼此相对的侧边缘下降或上升。

公开(公告)号：US07244938B2

公开(公告)日：2007-07-17

申请号：US11003327

申请日：2004-12-06

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： G01J5/02

CPC分类号： B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

摘要： A method of checking a deteriorated layer formed in the inside of a workpiece along a dividing line by applying a laser beam capable of passing through the workpiece to the workpiece along the dividing line formed on the workpiece, the method comprising a focusing step of positioning a microscope of infrared image pick-up means to the dividing line formed on the workpiece, and setting the focusing point of the microscope to a position where the deteriorated layer in the inside of the workpiece has been formed; and an image pick-up step of picking up an image of the inside of the workpiece by moving the infrared image pick-up means and the workpiece along the dividing line relative to each other to scan the workpiece, wherein the deteriorated layer formed in the inside of the workpiece is checked based on the image picked up in the image pick-up step.

摘要翻译： 一种通过将能够通过工件穿过工件的激光束沿着形成在工件上的分割线施加到工件上而沿着分割线检查在工件内部形成的劣化层的方法，该方法包括聚焦步骤， 将红外图像拾取装置的显微镜装置到形成在工件上的分割线，并将显微镜的聚焦点设置在已经形成工件内部的劣化层的位置; 以及图像拾取步骤，通过沿着分割线相对于彼此移动红外图像拾取装置和工件来扫描工件来拾取工件内部的图像，其中形成在工件中的劣化层 基于在图像拾取步骤中拾取的图像来检查工件内部。

公开(公告)号：US07179722B2

公开(公告)日：2007-02-20

申请号：US11047619

申请日：2005-02-02

申请人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

发明人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

IPC分类号： H01L21/301

CPC分类号： H01L21/3043 ,  H01L21/30625 ,  H01L21/78 ,  H01L2221/68336

摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.

摘要翻译： 沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到 晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。

公开(公告)号：US20060087008A1

公开(公告)日：2006-04-27

申请号：US11254779

申请日：2005-10-21

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： H01L23/544

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T83/8773 ,  Y10T225/30 ,  Y10T225/329 ,  Y10T225/371

摘要： A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.

摘要翻译： 一种分割装置，沿着分割线沿着分割线分割强度降低的晶片，该分割线包括用于保持固定在晶片的一个表面侧上的保护带的带保持装置; 以及晶片分割装置，包括第一吸持保持部件和第二吸持保持部件，两者具有保持面，该保持面用于通过保护带保持在保持带上的晶片通过保护带在分割线的两侧通过 保护带，以及用于使第一吸持保持部件和第二吸引保持部件彼此分离的方向移动的移动部件，其中，第一吸引保持部件的保持面和第二吸引保持部件的保持面 夹持构件倾斜使得它们相对于彼此相对的侧边缘下降或上升。

公开(公告)号：US20060081574A1

公开(公告)日：2006-04-20

申请号：US11249494

申请日：2005-10-14

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： B23K26/16

CPC分类号： H01L21/67132 ,  B23K26/0853 ,  B23K37/0461 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T29/41 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/325 ,  Y10T225/35

摘要： A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.

公开(公告)号：US20060009010A1

公开(公告)日：2006-01-12

申请号：US11167848

申请日：2005-06-28

申请人： Yusuke Nagai ,  Masaru Nakamura

发明人： Yusuke Nagai ,  Masaru Nakamura

IPC分类号： H01L21/301 ,  H01L21/46 ,  H01L21/78

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052

摘要： A wafer processing method of dividing a wafer having function elements formed in areas sectioned by dividing lines formed on the front surface in a lattice pattern, into individual chips along the dividing lines, which comprises a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer along the dividing lines; a wafer supporting step for putting the back surface of the wafer on an extensible support tape mounted on an annular frame; and a dividing step for dividing the wafer along the dividing lines by expanding the support tape affixed to the wafer, wherein the dividing step comprises first dividing the wafer along dividing lines extending in a predetermined direction and subsequently, along dividing lines extending in a direction intersecting with the predetermined direction by expanding the support tape such that tensile force acting in a direction perpendicular to the dividing lines extending in the predetermined direction becomes larger than tensile force acting in a direction perpendicular to the dividing lines extending in the direction intersecting with the predetermined direction, when the supporting tape affixed to the wafer is expanded.

摘要翻译： 一种晶片处理方法，其将具有以格子图案形成在前表面上的由划分线划分的区域中形成的功能元件的晶片分割成沿着分割线的各个芯片，该方法包括：劣化层形成步骤，用于在 沿分割线在晶片内部; 晶片支撑步骤，用于将晶片的背面放置在安装在环形框架上的可延伸的支撑带上; 以及分割步骤，用于通过扩展固定在晶片上的支撑带来分割晶片，其中分割步骤包括首先沿着沿预定方向延伸的分割线分割晶片，并且随后沿着与交叉的方向延伸的分割线 通过使支撑带膨胀，使得沿与预定方向延伸的分割线垂直的方向作用的张力大于沿与在与预定方向相交的方向延伸的分割线垂直的方向作用的张力 当固定在晶片上的支撑带膨胀时。

公开(公告)号：US20050109742A1

公开(公告)日：2005-05-26

申请号：US10972658

申请日：2004-10-26

申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige

发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige

IPC分类号： B23K26/04 ,  B23K26/02 ,  B23K26/08 ,  B23K101/40 ,  H01L21/301 ,  B23K26/06

CPC分类号： B23K26/02 ,  B23K26/042 ,  B23K26/0853 ,  B23K2101/40

摘要： A processing method using a laser beam, which can locate the focus point of a laser beam (82), sufficiently easily and promptly, at a position of a predetermined depth (D) below the face of a workpiece (34). The spacing between a focusing optical system (78) and the face of the workpiece when the laser beam is focused onto the face of the workpiece is adopted as a reference spacing (BL), and the spacing (SL) between the focusing optical system and the face of the workpiece is set based on a set equation taking into consideration the numerical aperture of the focusing optical system and the refractive index of the workpiece in combination with the reference spacing (BL).

摘要翻译： 一种使用激光束的处理方法，其可以在工件（34）的表面下方的预定深度（D）的位置处足够容易且及时地定位激光束（82）的聚焦点。 采用激光束聚焦到工件表面上时聚焦光学系统（78）和工件表面之间的间距作为参考间距（BL），聚焦光学系统和 考虑到聚焦光学系统的数值孔径和工件的折射率与参考间距（BL）的组合，基于设定的方程来设定工件的面。