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公开(公告)号：US09742180B2
公开(公告)日：2017-08-22
申请号：US14898512
申请日：2014-06-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Carl J. Wentzel , Christopher D. Sebesta , Jaylon D. Loyd , David V. Mahoney , Michael D. Benson , Levent Biyikli , Jens Weichold , Mark Gravermann , Giuliano Bolcato
IPC: H02G15/02 , H02G1/14 , H02G15/068 , H01B9/00
CPC classification number: H02G15/02 , H01B9/006 , H02G1/14 , H02G15/068
Abstract: A terminal connection device comprises a contiguous body disposed onto an inner conductor. The inner conductor includes a first end mateable with a power cable connector and a second end. The body comprises a multilayer structure having an inner conductive or semiconductive layer disposed over at least a portion of the power cable connector, an insulating layer and an outer conductive or semiconductive layer. The body surrounds the first end of the inner conductor and extending towards the second end of the inner conductor. The body can also include an electrically isolated section of conductive or semiconductive material. The terminal connection device can be a fully integrated structure, having a pre-installed connection interface, or the terminal connection device can be configured as an adapter which can be mounted in the field to a connection interface.
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公开(公告)号：US20210271003A1
公开(公告)日：2021-09-02
申请号：US17259299
申请日：2019-08-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Zhaohui Yang , Przemyslaw P. Markowicz , John A. Wheatley , Qingbing Wang , Mark A. Roehrig , Tri D. Pham , Serena L. Schleusner , Kenneth A.P. Meyer , Levent Biyikli , Thomas V. Weigman
Abstract: An optical element including an array of microlenses, a pinhole mask, and a wavelength selective filter is described. The pinhole mask includes an array of pinholes with each pinhole in the array of pinholes aligned with a microlens in the first array of microlenses. The wavelength selective filter is adapted to transmit a first light ray having a first wavelength and transmitted from a first microlens in the array of microlenses through a first pinhole in the array of pinholes aligned with the first microlens, and to attenuate a second light ray having the first wavelength and transmitted from the first microlens through a second pinhole in the array of pinholes aligned with a second microlens in the first array of microlenses adjacent to the first microlens.
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公开(公告)号：US10121570B2
公开(公告)日：2018-11-06
申请号：US15519399
申请日：2015-10-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Nanayakkara L. D. Somasiri , Paul V. Huynh , Andrew C. Lottes , William L. Taylor , Levent Biyikli , Carl E. Fisher
Abstract: An enhanced breakdown strength dielectric material includes a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.
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公开(公告)号：US20160134094A1
公开(公告)日：2016-05-12
申请号：US14898512
申请日：2014-06-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Carl J. Wentzel , Christopher D. Sebesta , Jaylon D. Loyd , David V. Mahoney , Michael D. Benson , Levent Biyikli , Jens Weichold , Mark Gravermann , Giuliano Bolcato
CPC classification number: H02G15/02 , H01B9/006 , H02G1/14 , H02G15/068
Abstract: A terminal connection device comprises a contiguous body disposed onto an inner conductor. The inner conductor includes a first end mateable with a power cable connector and a second end. The body comprises a multilayer structure having an inner conductive or semiconductive layer disposed over at least a portion of the power cable connector, an insulating layer and an outer conductive or semiconductive layer. The body surrounds the first end of the inner conductor and extending towards the second end of the inner conductor. The body can also include an electrically isolated section of conductive or semiconductive material. The terminal connection device can be a fully integrated structure, having a pre-installed connection interface, or the terminal connection device can be configured as an adapter which can be mounted in the field to a connection interface.
Abstract translation: 终端连接装置包括设置在内导体上的连续体。 内部导体包括可与电力电缆连接器配合的第一端和第二端。 主体包括多层结构，其具有设置在电力电缆连接器的至少一部分上的内部导电或半导体层，绝缘层和外部导电或半导体层。 主体围绕内部导体的第一端并延伸到内部导体的第二端。 主体还可以包括导电或半导体材料的电隔离部分。 终端连接装置可以是完全集成的结构，具有预先安装的连接接口，或者终端连接装置可以被配置为可以在现场安装到连接接口的适配器。
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