公开(公告)号：US20140166880A1

公开(公告)日：2014-06-19

申请号：US14107162

申请日：2013-12-16

Applicant: ACADEMIA SINICA

Inventor： YUNN-SHIN SHIUE ,  PAI-CHIA KUO ,  CHIH-TING CHEN ,  YUH-LIN WANG ,  YONG-FEN HSIEH

IPC: H01J37/26

CPC classification number: H01J37/26 ,  H01J37/295 ,  H01J2237/2614 ,  Y10S977/881

Abstract: The present invention provides an on-chip thin film phase plate for a releasing charging, comprising a chip substrate having one or more apertures; and a thin film layer attached to the top surface of the chip substrate. The present invention also provides a method for observing organic material by TEM, which uses the above-mentioned on-chip thin film phase plate in a TEM system.

Abstract translation: 本发明提供了一种用于释放充电的片上薄膜相位板，包括具有一个或多个孔的芯片基板; 以及附着到芯片基板的顶表面的薄膜层。 本发明还提供了一种通过TEM观察有机材料的方法，其在TEM系统中使用上述片上薄膜相位板。