公开(公告)号：US20140196540A1

公开(公告)日：2014-07-17

申请号：US13741198

申请日：2013-01-14

Applicant: ANALOG DEVICES, TECHNOLOGY

Inventor： Arturo Martizon, JR. ,  Thomas M. Goida

IPC: H05K1/11 ,  B81C3/00

CPC classification number: B81C3/008 ,  B81B7/0074 ,  H01L23/49555 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Vertical mount package assemblies and methods for making the same are disclosed. A method for manufacturing a vertical mount package assembly includes providing a base substrate having electrical connections for affixing to external circuitry, and providing a package having a mounting region configured to receive a device therein. Flexible electrical leads are formed between the base substrate and the package. The flexible leads can include a plurality of aligned grooves to guide bending. After forming the flexible electrical leads, the package is rotated relative to the base substrate. The aligned grooves can constrain the relative positions of the substrates during rotation, and the beveled edges of the base substrate and package can maintain a desired angular relationship (e.g., perpendicular) between the base substrate and the package after rotation.

Abstract translation: 公开了垂直安装的封装组件及其制造方法。 一种用于制造垂直安装封装组件的方法，包括提供具有用于固定到外部电路的电连接的基底基板，以及提供具有被配置为在其中接收设备的安装区域的封装。 柔性电引线形成在基底基板和封装之间。 柔性引线可以包括多个对准的沟槽以引导弯曲。 在形成柔性电引线之后，封装相对于基底基板旋转。 对准的沟槽可以在旋转期间约束衬底的相对位置，并且基底衬底和封装的斜边缘可以在旋转之后保持基底衬底和封装之间的期望的角度关系（例如，垂直）。