公开(公告)号：US12293902B2

公开(公告)日：2025-05-06

申请号：US17861324

申请日：2022-07-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Muhannad Mustafa ,  Muhammad M. Rasheed ,  Yu Lei ,  Avgerinos V. Gelatos ,  Vikash Banthia ,  Victor H Calderon ,  Shi Wei Toh ,  Yung-Hsin Lee ,  Anindita Sen

IPC: H01J37/32

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, a process kit for a substrate support includes: an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring.