公开(公告)号：US20180314160A1

公开(公告)日：2018-11-01

申请号：US15771585

申请日：2016-10-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Martinus Gerardus Maria Johannes MAASSEN ,  Reinder Teun PLUG ,  Kaustuve BHATTACHARYYA

IPC: G03F7/20 ,  G06F17/50

CPC classification number: G03F7/705 ,  G03F7/70625 ,  G03F7/70991

Abstract: Increasingly, metrology systems are integrated within the lithographic apparatuses, to provide integrated metrology within the lithographic process. However, this integration can result in a throughput or productivity impact of the whole lithographic apparatus which can be difficult to predict. It is therefore proposed to provide a simulation model which is operable to acquire throughput information associated with a throughput of a plurality of substrates within a lithographic apparatus, said throughput information comprising a throughput parameter, predict, using a throughput simulator the throughput using the throughput parameter as an input parameter. The throughput simulator may be calibrated using the acquired throughput information. The impact of at least one change of a throughput parameter on the throughput of the lithographic apparatus may be predicted using the throughput simulator.