公开(公告)号：US09990451B2

公开(公告)日：2018-06-05

申请号：US14616905

申请日：2015-02-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Stefan Hunsche ,  Venu Vellanki

IPC: G06F17/50 ,  H01L21/66 ,  G03F7/20

CPC classification number: G06F17/5009 ,  G03F7/705 ,  G03F7/70525 ,  H01L22/20

Abstract: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a pattern onto a substrate, the method comprising: identifying a processing window limiting pattern (PWLP) from the pattern; determining a processing parameter under which the PWLP is processed; and determining or predicting, using the processing parameter, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the PWLP with the device manufacturing process.