公开(公告)号：US20130206367A1

公开(公告)日：2013-08-15

申请号：US13763164

申请日：2013-02-08

Applicant: ASUSTEK COMPUTER INC.

Inventor： Meng-Ping CHEN ,  Ching HO

IPC: F28F3/02

CPC classification number: F28F3/02 ,  F28D15/0275 ,  F28F1/12 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes a base, at least one thermal conductive element, at least one liquid-pipe and a heat sink. The thermal conductive element is disposed at the base. The liquid-pipe is disposed adjacent to the thermal conductive element. The liquid-pipe is disposed at the base. The heat sink covers the thermal conductive element and the liquid-pipe. A part of the heat sink is connected to the base. The heat sink includes a plurality of fins. The heat dissipating module combines air-cooling with water-cooling so as to enhance thermal conductivity.

Abstract translation: 散热模块包括基座，至少一个导热元件，至少一个液体管和散热器。 导热元件设置在基座上。 液体管与导热元件相邻设置。 液体管设置在基部。 散热器覆盖导热元件和液体管。 散热器的一部分连接到基座。 散热片包括多个散热片。 散热模块将空气冷却与水冷结合在一起，以提高导热性。