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公开(公告)号：US10712781B2
公开(公告)日：2020-07-14
申请号：US15900349
申请日：2018-02-20
Applicant: ASUSTEK COMPUTER INC.
Inventor： San-Feng Lin , Yen-Yu Chen
Abstract: A casing assembly of an electronic device is provided. The casing assembly of the electronic device is configured to connect a connecting assembly. The connecting assembly comprises a metal casing; and an injection-molded frame. The injection-molded frame includes a first surface and a second surface, the first surface is fixed to the metal casing, and the second surface is configured with a plurality of connecting structures. The connecting structures are fixed to the connecting assembly, and the connecting assembly is assembled to the metal casing via the connecting structures.
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