公开(公告)号：US12245373B2

公开(公告)日：2025-03-04

申请号：US17592126

申请日：2022-02-03

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han Tsou ,  Li-Chien Wan

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.

公开(公告)号：US10729003B2

公开(公告)日：2020-07-28

申请号：US16443980

申请日：2019-06-18

Applicant: ASUSTeK COMPUTER INC.

Inventor： Ping-Han Tsou ,  Li-Chien Wan

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/11

Abstract: An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor.

公开(公告)号：US11289839B2

公开(公告)日：2022-03-29

申请号：US16794597

申请日：2020-02-19

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han Tsou ,  Li-Chien Wan

IPC: H01R12/73 ,  H01R13/6474 ,  H01R12/70 ,  H01R13/10

Abstract: A memory slot adapted to dispose on a circuit board is provided. The memory slot includes a slot body and a plurality of pins. The slot body includes N connecting parts for configuring to M memory cards. The plurality of pins are disposed in the slot body for electrically connecting the M memory cards to the circuit board. Each pin includes O branches extending to the connecting parts respectively for electrically connecting corresponding golden fingers of the memory cards. Where the N, M and O are greater than or equal to 2. The disclosure further provides a main board with the memory slot.

公开(公告)号：US11284505B2

公开(公告)日：2022-03-22

申请号：US16876981

申请日：2020-05-18

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han Tsou ,  Li-Chien Wan

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/18

Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.