公开(公告)号：US11037868B2

公开(公告)日：2021-06-15

申请号：US16801061

申请日：2020-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui Hua Lee ,  Hui-Ying Hsieh ,  Cheng-Hung Ko ,  Chi-Tsung Chiu

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.