公开(公告)号：US20250132278A1

公开(公告)日：2025-04-24

申请号：US18491720

申请日：2023-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Jing HSU ,  Hsu-Nan FANG

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/18

Abstract: An electronic device is disclosed. The electronic device includes a unit chip. The unit chip includes an electronic component having a power delivery circuit and a reinforcement supporting the electronic component. The reinforcement is configured to transmit a power signal to the power delivery circuit. The reinforcement includes a thermosetting reinforcement or a glass reinforcement.

公开(公告)号：US20250087621A1

公开(公告)日：2025-03-13

申请号：US18244205

申请日：2023-09-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Jing HSU ,  Hsu-Nan FANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

Abstract: An interposer structure and a package structure are provided. The interposer structure includes a conductive portion, a dielectric layer, a plurality of first wires, and a plurality of second wires. The conductive portion has a first surface and a second surface opposite to the first surface. The dielectric layer encapsulates the conductive portion and exposes the first surface and the second surface. The first wires are formed on the first surface. The second wires are disposed over the second surface.