公开(公告)号：US12033923B2

公开(公告)日：2024-07-09

申请号：US17023267

申请日：2020-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Tsung Chiu ,  Hui-Ying Hsieh ,  Chun Hao Chiu ,  Chiuan-You Ding

IPC: H01L23/495

CPC classification number: H01L23/49558 ,  H01L23/49503 ,  H01L23/49527 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/023 ,  H01L2924/19011

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.